4Gb: x8, x16 DDR3L SDRAM Addendum
Description
Addendum
DDR3L SDRAM
MT41K512M8RH-125 V:E MT41K256M16HA-125 V:E
MT41K512M8DA-107 V:P MT41K256M16TW-107 V:P
Description
DDR3L SDRAM (1.35V) is a low voltage version of the
DDR3 (1.5V) SDRAM. Refer to the DDR3 (1.5V)
SDRAM data sheet specifications when running in
1.5V compatible mode.
•
•
•
•
Automatic self refresh (ASR)
Write leveling
Multipurpose register
Output driver calibration
Options
• Configuration
– 512 Meg x 8
– 256 Meg x 16
• FBGA package (Pb-free) – x8
– 78-ball (9mm x 10.5mm) Rev. E
– 78-ball (8mm x 10.5mm) Rev. P
• FBGA package (Pb-free) – x16
– 96-ball (9mm x 14mm) Rev. E
– 96-ball (8mm x 14mm) Rev. P
• Timing – cycle time
– 1.071ns @ CL = 13 (DDR3-1866)
– 1.25ns @ CL = 11 (DDR3-1600)
• Special options
– Visual inspection
• Operating temperature
– Commercial (0°C
≤
T
C
≤
+95°C)
– Industrial (–40°C
≤
T
C
≤
+95°C)
• Revision
Marking
512M8
256M16
RH
DA
HA
TW
-107
-125
V
None
IT
:E/:P
Features
• V
DD
= V
DDQ
= 1.35V (1.283–1.45V)
• Backward compatible to V
DD
= V
DDQ
= 1.5V ±0.075V
– Supports DDR3L devices to be backward com-
patible in 1.5V applications
• Differential bidirectional data strobe
• 8n-bit prefetch architecture
• Differential clock inputs (CK, CK#)
• 8 internal banks
• Nominal and dynamic on-die termination (ODT)
for data, strobe, and mask signals
• Programmable CAS (READ) latency (CL)
• Programmable posted CAS additive latency (AL)
• Programmable CAS (WRITE) latency (CWL)
• Fixed burst length (BL) of 8 and burst chop (BC) of 4
(via the mode register set [MRS])
• Selectable BC4 or BL8 on-the-fly (OTF)
• Self refresh mode
• T
C
of 0°C to +95°C
– 64ms, 8192-cycle refresh at 0°C to +85°C
– 32ms at +85°C to +95°C
• Self refresh temperature (SRT)
Table 1: Key Timing Parameters
Speed Grade
-107
1
-125
Note:
Data Rate (MT/s)
1866
1600
Target
t
RCD-
t
RP-CL
13-13-13
11-11-11
t
RCD
(ns)
t
RP
(ns)
CL (ns)
13.91
13.75
13.91
13.75
13.91
13.75
1. Backward compatible to 1600, CL = 11 (-125).
09005aef858c7838
4Gb_DDR3L_addendum.pdf - Rev. C 7/16 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
4Gb: x8, x16 DDR3L SDRAM Addendum
Description
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
Page size
512 Meg x 8
64 Meg x 8 x 8 banks
8K
64K (A[15:0])
8 (BA[2:0])
1K (A[9:0])
1KB
256 Meg x 16
32 Meg x 16 x 8 banks
8K
32K (A[14:0])
8 (BA[2:0])
1K (A[9:0])
2KB
Figure 1: DDR3L Part Numbers
Example Part Number:
MT41K512M8RH-125 V:E
-
MT41K
Configuration
Package
Speed
:
Revision
{
:E/:P
Configuration
512 Meg x 8
256 Meg x 16
Mark
512M8
256M16
Temperature
Commercial
Industrial temperature
Special Options
Package
78-ball 9mm x 10.5mm FBGA
78-ball 8mm x 10.5mm FBGA
96-ball 9mm x 14mm FBGA
96-ball 8mm x 14mm FBGA
Re
v.
E
P
E
P
Mark
RH
DA
HA
TW
Mark
-107
-125
Visual inspection
Speed Grade
t
CK
t
CK
Revision
Mark
None
IT
Mark
V
= 1.071ns, CL = 13
= 1.25ns, CL = 11
Note:
1. Not all options listed can be combined to define an offered product. Use the part catalog search on
http://www.micron.com for available offerings.
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
09005aef858c7838
4Gb_DDR3L_addendum.pdf - Rev. C 7/16 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
4Gb: x8, x16 DDR3L SDRAM Addendum
Revision History
Revision History
Rev. C – 07/16
• Added DA and TW package codes
• Added :P Revision code
• Removed unused mark options
Rev. B – 04/15
• Removed Micron Confidential and Proprietary mark
Rev. A – 02/14
• Initial release; based on 4Gb: x4, x8, x16 DDR3L SDRAM, Rev I 09/13 data sheet
(09005aef84780270)
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000
www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
09005aef858c7838
4Gb_DDR3L_addendum.pdf - Rev. C 7/16 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
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