DSPIC33EP256GM306T-I/MR datasheet, PDF

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DSPIC33EP256GM306T-I/MR: DescriptionIC MCU 16BIT 256KB FLASH 64QFN; CategoryThe embedded processor and controller Microcontrollers and processors; File Size547KB，40 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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DSPIC33EP256GM306T-I/MR Overview

IC MCU 16BIT 256KB FLASH 64QFN

DSPIC33EP256GM306T-I/MR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microchip
package instruction	QFN-64
Reach Compliance Code	compliant
ECCN code	3A001.A.3
Has ADC	YES
Other features	70 MIPS, ADC ALSO SUPPORTS 10-BIT RESOLUTION
Address bus width
bit size	16
maximum clock frequency	60 MHz
DAC channel	NO
DMA channel	YES
External data bus width
Format	FLOATING POINT
JESD-30 code	S-PQCC-N64
JESD-609 code	e3
length	9 mm
Humidity sensitivity level	3
Number of I/O lines	53
Number of terminals	64
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC64,.35SQ,20
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
RAM (bytes)	32768
RAM (number of words)	16384
rom(word)	262144
ROM programmability	FLASH
Filter level	TS 16949
Maximum seat height	1 mm
Maximum slew rate	60 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	9 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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dsPIC33EPXXXGM3XX/6XX/7XX FAMILY

dsPIC33EPXXXGM3XX/6XX/7XX Family

Silicon Errata and Data Sheet Clarification

The dsPIC33EPXXXGM3XX/6XX/7XX family devices

that you have received conform functionally to the

current Device Data Sheet (DS70000689D), except for

the anomalies described in this document.

The silicon issues discussed in the following pages are

for silicon revisions with the Device and Revision IDs

listed in

Table 1.

The silicon issues are summarized in

Table 2.

The errata described in this document will be addressed

in future revisions of dsPIC33EPXXXGM3XX/6XX/7XX

family silicon.

Note:

This document summarizes all silicon

errata issues from all revisions of silicon,

previous as well as current. Only the issues

indicated in the last column of

Table 2

apply to the current silicon revision (A3).

For example, to identify the silicon revision level using

MPLAB IDE in conjunction with a hardware debugger:

Using the appropriate interface, connect the

device to the hardware debugger.

Open an MPLAB IDE project.

Configure the MPLAB IDE project for the

appropriate device and hardware debugger.

Based on the version of MPLAB IDE you are

using, do one of the following:

a) For MPLAB IDE 8, select

Programmer >

Reconnect.

b) For MPLAB X IDE, select

Window > Dash-

board

and click the

Refresh Debug Tool

Status

icon (

Depending on the development tool used, the

part number

and

Device Revision ID value

appear in the

Output

window.

Note:

If you are unable to extract the silicon

revision level, please contact your local

Microchip sales office for assistance.

Data Sheet clarifications and corrections start on

Page 25,

following the discussion of silicon issues.

The silicon revision level can be identified using the

current version of MPLAB

IDE and Microchip’s

programmers, debuggers and emulation tools, which

are available at the Microchip corporate web site

(www.microchip.com).

The

DEVREV

values

for

the

various

dsPIC33EPXXXGM3XX/6XX/7XX family silicon revisions

are shown in

Table 1.



2013-2018 Microchip Technology Inc.

DS80000577P-page 1

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