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DSPIC33EP256GM310T-I/PF

Description
IC,DSP,16-BIT,CMOS,TQFP,100PIN,PLASTIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size547KB,40 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Parametric View All

DSPIC33EP256GM310T-I/PF Overview

IC,DSP,16-BIT,CMOS,TQFP,100PIN,PLASTIC

DSPIC33EP256GM310T-I/PF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1809332091
package instructionTQFP-100
Reach Compliance Codecompliant
Country Of OriginThailand
ECCN code3A991.A.2
YTEOL7.18
Address bus width
barrel shifterYES
bit size16
boundary scanYES
maximum clock frequency60 MHz
External data bus width
FormatFIXED POINT
Integrated cacheNO
Internal bus architectureMULTIPLE
JESD-30 codeS-PQFP-G100
JESD-609 codee3
length14 mm
low power modeYES
Humidity sensitivity level3
Number of DMA channels4
Number of external interrupt devices5
Number of serial I/Os4
Number of terminals100
Number of timers13
On-chip data RAM width8
On-chip program ROM width8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTFQFP
Encapsulate equivalent codeTQFP100,.63SQ
Package shapeSQUARE
Package formFLATPACK, THIN PROFILE, FINE PITCH
power supply3.3 V
Certification statusNot Qualified
RAM (number of words)32768
ROM programmabilityFLASH
Filter levelTS 16949
Maximum seat height1.2 mm
Maximum slew rate60 mA
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
width14 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, CONTROLLER
dsPIC33EPXXXGM3XX/6XX/7XX FAMILY
dsPIC33EPXXXGM3XX/6XX/7XX Family
Silicon Errata and Data Sheet Clarification
The dsPIC33EPXXXGM3XX/6XX/7XX family devices
that you have received conform functionally to the
current Device Data Sheet (DS70000689D), except for
the anomalies described in this document.
The silicon issues discussed in the following pages are
for silicon revisions with the Device and Revision IDs
listed in
Table 1.
The silicon issues are summarized in
Table 2.
The errata described in this document will be addressed
in future revisions of dsPIC33EPXXXGM3XX/6XX/7XX
family silicon.
Note:
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the issues
indicated in the last column of
Table 2
apply to the current silicon revision (A3).
For example, to identify the silicon revision level using
MPLAB IDE in conjunction with a hardware debugger:
1.
2.
3.
4.
Using the appropriate interface, connect the
device to the hardware debugger.
Open an MPLAB IDE project.
Configure the MPLAB IDE project for the
appropriate device and hardware debugger.
Based on the version of MPLAB IDE you are
using, do one of the following:
a) For MPLAB IDE 8, select
Programmer >
Reconnect.
b) For MPLAB X IDE, select
Window > Dash-
board
and click the
Refresh Debug Tool
Status
icon (
).
Depending on the development tool used, the
part number
and
Device Revision ID value
appear in the
Output
window.
Note:
If you are unable to extract the silicon
revision level, please contact your local
Microchip sales office for assistance.
5.
Data Sheet clarifications and corrections start on
Page 25,
following the discussion of silicon issues.
The silicon revision level can be identified using the
current version of MPLAB
®
IDE and Microchip’s
programmers, debuggers and emulation tools, which
are available at the Microchip corporate web site
(www.microchip.com).
The
DEVREV
values
for
the
various
dsPIC33EPXXXGM3XX/6XX/7XX family silicon revisions
are shown in
Table 1.
2013-2018 Microchip Technology Inc.
DS80000577P-page 1

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