Data Sheet
FEATURES
Fast settling output current: 85 ns
Full-scale current prematched to ±1 LSB
Direct interface to TTL, CMOS, ECL, HTL, PMOS
Nonlinearity to 0.1% maximum over temperature range
High output impedance and compliance: −10 V to +18 V
Complementary current outputs
Wide range multiplying capability: 1 MHz bandwidth
Low FS current drift: ±10 ppm/°C
Wide power supply range: ±4.5 V to ±18 V
Low power consumption: 33 mW at ±5 V
Low cost
8-Bit, High Speed, Multiplying
D/A Converter
DAC08
Direct interface to all popular logic families with full noise
immunity is provided by the high swing, adjustable threshold
logic input.
High voltage compliance complementary current outputs are
provided, increasing versatility and enabling differential operation
to effectively double the peak-to-peak output swing. In many
applications, the outputs can be directly converted to voltage
without the need for an external op amp. All
DAC08
series models
guarantee full 8-bit monotonicity, and nonlinearities as tight as
±0.1% over the entire operating temperature range are available.
Device performance is essentially unchanged over the ±4.5 V to
±18 V power supply range, with 33 mW power consumption
attainable at ±5 V supplies.
The compact size and low power consumption make the
DAC08
attractive for portable and military/aerospace applications;
devices processed to MIL-STD-883, Level B are available.
DAC08
applications include 8-bit, 1 µs A/D converters, servo
motor and pen drivers, waveform generators, audio encoders
and attenuators, analog meter drivers, programmable power
supplies, LCD display drivers, high speed modems, and other
applications where low cost, high speed, and complete
input/output versatility are required.
GENERAL DESCRIPTION
The
DAC08
series of 8-bit monolithic digital-to-analog convert-
ers provide very high speed performance coupled with low cost
and outstanding applications flexibility.
Advanced circuit design achieves 85 ns settling times with very
low glitch energy and at low power consumption. Monotonic
multiplying performance is attained over a wide 20 to 1 reference
current range. Matching to within 1 LSB between reference and
full-scale currents eliminates the need for full-scale trimming in
most applications.
FUNCTIONAL BLOCK DIAGRAM
V+
13
V
LC
1
(MSB)
B1
5
B2
6
B3
7
B4
8
B5
9
B6
10
B7
11
(LSB)
B8
12
DAC08
BIAS
NETWORK
CURRENT
SWITCHES
4
2
I
OUT
V
REF
(+)
14
I
OUT
V
REF
(–)
15
REFERENCE
AMPLIFIER
00268-C-001
16
COMP
3
V–
Figure 1.
Rev. D
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DAC08
TABLE OF CONTENTS
Features .............................................................................................. 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Electrical Characteristics ............................................................. 3
Typical Electrical Characteristics ............................................... 4
Absolute Maximum Ratings............................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution .................................................................................. 5
Pin Configuration and Function Descriptions ............................. 6
Test and Burn-In Circuits ................................................................ 7
Typical Performance Characteristics ............................................. 8
Basic Connections .......................................................................... 11
Data Sheet
Application Information ................................................................ 14
Reference Amplifier Setup ........................................................ 14
Reference Amplifier Compensation for Multiplying
Applications ................................................................................ 14
Logic Inputs................................................................................. 14
Analog Output Currents ........................................................... 14
Power Supplies ............................................................................ 15
Temperature Performance......................................................... 15
Multiplying Operation ............................................................... 15
Settling Time ............................................................................... 15
Analog Devices Current Output DACs ....................................... 17
Outline Dimensions ....................................................................... 18
Ordering Guide .......................................................................... 19
REVISION HISTORY
3/16—Rev. C to Rev. D
Added Thermal Resistance Section ............................................... 5
Changes to Table 4 ............................................................................ 5
Change to Figure 29 ....................................................................... 12
Updated Outline Dimensions ....................................................... 18
Changes to Ordering Guide .......................................................... 10
11/04—Rev. B to Rev. C
Changed SO to SOIC ......................................................... Universal
Removed DIE ...................................................................... Universal
Changes to Figure 30, Figure 31, Figure 32 ................................. 12
Change to Figure 33 ....................................................................... 15
Added Table 4.................................................................................. 16
Updated Outline Dimensions ....................................................... 17
Changes to Ordering Guide .......................................................... 18
2/02—Rev. A to Rev. B
Edits to Specifications .......................................................................2
Edits to Absolute Maximum Ratings ..............................................3
Edits to Ordering Guide ...................................................................3
Edits to Wafer Test Limits ................................................................5
Edit to Figure 13 ................................................................................8
Edits to Figures 14 and 15 ................................................................9
Rev. D | Page 2 of 21
Data Sheet
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
DAC08
V
S
= ±15 V, I
REF
= 2.0 mA, –55°C ≤ T
A
≤ +125°C for
DAC08/DAC08A,
0°C ≤ T
A
≤ +70°C for
DAC08E
and
DAC08H,
−40°C to +85°C for
DAC08C,
unless otherwise noted. Output characteristics refer to both I
OUT
and I
OUT
.
Table 1.
Parameter
RESOLUTION
MONOTONICITY
NONLINEARITY
SETTLING TIME
PROPAGATION DELAY
Each Bit
All Bits Switched
FULL-SCALE TEMPCO
1
OUTPUT VOLTAGE
Compliance
(True Compliance)
DAC08A/DAC08H
Symbol Test Conditions/Comments Min Typ
Max
8
8
NL
±0.1
t
S
To ±1/2 LSB, all bits switched
85
135
on or off, T
A
= 25°C
1
t
PLH
t
PHL
TCI
FS
T
A
= 25°C
1
35
35
±10
60
60
±50
DAC08E
DAC08C
Min Typ
Max Min Typ
Max
8
8
8
8
±0.19
±0.39
85
150
85
150
Unit
Bits
Bits
%FS
ns
35
35
±10
DAC08E
V
OC
Full-scale current
Change <1/2 LSB, R
OUT
>
20 MΩ typ
V
REF
= 10.000 V R14, R15 =
5.000 kΩ T
A
= 25°C
I
FR4
− I
FR2
60
60
±80
±50
35
35
±10
60
60
±80
ns
ns
ppm/°C
−10
1.984 1.992
±0.5
0.1
+18
−10
+18
2.04
±8
2
–10
1.94 1.99
±2
0.2
2.1
+18
2.04
±16
4
V
mA
µA
µA
mA
FULL RANGE CURRENT I
FR4
FULL RANGE
I
FRS
SYMMETRY
ZERO-SCALE CURRENT I
ZS
OUTPUT CURRENT
I
OR1
RANGE
I
OR2
2.000 1.94 1.99
±4
1
2.1
±1
0.2
R14, R15 = 5.000 kΩ
V
REF
= +15.0 V, V− = −10 V
V
REF
= +25.0 V,
V− = −12 V
I
REF
= 2 mA
2.1
4.2
25
4.2
25
4.2
25
mA
nA
OUTPUT CURRENT
NOISE
LOGIC INPUT LEVELS
Logic 0
Logic 1
LOGIC INPUT CURRENT
Logic 0
Logic 1
LOGIC INPUT SWING
LOGIC THRESHOLD
RANGE
REFERENCE BIAS
CURRENT
REFERENCE INPUT
SLEW RATE
V
IL
V
IL
I
IL
I
IH
V
IS
V
THR
I
15
dI/dt
V
LC
= 0 V
2
V
LC
= 0 V
V
IN
= −10 V to +0.8 V
V
IN
= 2.0 V to 18 V
V− = −15 V
V
S
= ±15 V
1
−2
0.002
−10
−10
−1
R
EQ
= 200 Ω
R
L
= 100 Ω
C
C
= 0 pF. See Figure 7.
1
4
8
0.8
2
−10
−2
10
0.002
+18 −10
+13.5 −10
−3
4
−1
8
0.8
2
−10
−2
10
0.002
+18 −10
+13.5 −10
−3
4
−1
8
0.8
V
V
µA
µA
V
V
µA
mA/µs
−10
10
+18
+13.5
−3
Rev. D | Page 3 of 21
DAC08
Parameter
POWER SUPPLY
SENSITIVITY
Data Sheet
DAC08A/DAC08H
DAC08E
DAC08C
Symbol Test Conditions/Comments Min Typ
Max Min Typ
Max Min Typ
Max Unit
PSSI
FS+
V+ = 4.5 V to 18 V
±0.0003 ±0.01
±0.0003 ±0.01
±0.0003 ±0.01 %∆I
O
/
%∆V+
PSSI
FS–
V− = −4.5 V to −18 V
±0.002 ±0.01
±0.002 ±0.01
±0.002 ±0.01 %∆I
O
/
%∆V−
I
REF
= 1.0 mA
I+
V
S
= ±5 V, I
REF
= 1.0 mA
2.3
3.8
2.3
3.8
2.3
3.8
mA
I−
I+
I−
I+
I−
P
D
−4.3
2.4
−6.4
2.5
−6.5
33
108
135
−5.8
3.8
−7.8
3.8
−7.8
48
136
174
−4.3
2.4
−6.4
2.5
−6.5
33
103
135
−5.8
3.8
−7.8
3.8
−7.8
48
136
174
−4.3
2.4
−6.4
2.5
−6.5
33
108
135
−5.8
3.8
−7.8
3.8
−7.8
48
136
174
mA
mA
mA
mA
mA
mW
mW
mW
POWER SUPPLY
CURRENT
POWER DISSIPATION
V
S
= +5 V, −15 V
I
REF
= 2.0 mA
V
S
= ±15 V
I
REF
= 2.0 mA
±5 V, I
REF
= 1.0 mA +5 V,
−15 V
I
REF
= 2.0 mA ±15 V, I
REF
=
2.0 mA
1
Guaranteed by design.
TYPICAL ELECTRICAL CHARACTERISTICS
V
S
= ±15 V, and I
REF
= 2.0 mA, unless otherwise noted. Output characteristics apply to both I
OUT
and I
OUT
.
Table 2.
Parameter
REFERENCE INPUT SLEW RATE
PROPAGATION DELAY
SETTLING TIME
Symbol
dI/dt
t
PLH
, t
PHL
t
S
Test Conditions/Comments
T
A
= 25°C, any bit
To ±1/2 LSB, all bits switched on or
off, T
A
= 25°C
All Grades Typical
8
35
85
Unit
mA/µs
ns
ns
Rev. D | Page 4 of 21
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Operating Temperature
DAC08AQ, DAC08Q
DAC08HQ, DAC08EQ, DAC08CQ
DAC08CP, DAC08CS
Junction Temperature (T
J
)
Storage Temperature Q Package
Storage Temperature P Package
Lead Temperature (Soldering, 60 sec)
V+ Supply to V− Supply
Logic Inputs
V
LC
Analog Current Outputs (at V
S−
= 15 V)
Reference Input (V
14
to V
15
)
Reference Input Differential Voltage
(V
14
to V
15
)
Reference Input Current (I
14
)
Rating
−55°C to +125°C
0°C to +70°C
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
−65°C to +125°C
300°C
36 V
V− to V− + 36 V
V− to V+
4.25 mA
V− to V+
±18 V
5.0 mA
DAC08
THERMAL RESISTANCE
θ
JA
is specified for worst case mounting conditions, that is, θ
JA
is
specified for device in socket for CERDIP, PDIP, and LCC
packages; θ
JA
is specified for device soldered to printed circuit
board for SOIC package.
Table 4. Thermal Resistance
Package Type
16-Lead CERDIP (Q)
16-Lead PDIP (P)
20-Terminal LCC (RC)
16-Lead SOIC (S)
θ
JA
100
82
76
111
θ
JC
16
39
36
35
Unit
°C/W
°C/W
°C/W
°C/W
ESD CAUTION
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. D | Page 5 of 21
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