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XHP50A-00-0000-0D0BJ20E2

Description
LED XLAMP XH-P50 WHITE SMD
CategoryLED optoelectronic/LED    photoelectric   
File Size2MB,33 Pages
ManufacturerCree
Websitehttp://www.cree.com/
Environmental Compliance
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XHP50A-00-0000-0D0BJ20E2 Overview

LED XLAMP XH-P50 WHITE SMD

XHP50A-00-0000-0D0BJ20E2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerCree
Reach Compliance Codeunknown
Optoelectronic device typesSINGLE COLOR LED
Base Number Matches1
CLD-DS111 Rev 1J
Product family data sheet
Cree
®
XLamp
®
XHP50 LEDs
ProDuCt DEsCriPtion
Powered by Cree’s groundbreaking SC5
Technology™ Platform, the XLamp
®
XHP50
LeD is a member of Cree’s extreme High
Power (XHP) class of LEDs that redefines
lumen density and reliability to radically
reduce system costs by up to 40 percent. At
its maximum current, the XHP50 LeD delivers
twice the light output of the industry’s
brightest single-die LeD, the XLamp XM-L2
LeD, with similar lumens per watt and
without increasing the package footprint.
The XHP50 LeD also achieves longer
lifetime at higher operating temperatures
than previous LeD technology. The result is
significantly lower thermal, mechanical and
optical costs at the system level.
FEAturEs
Available in white, configurable to 6 V
or 12 V by PCB layout
Available in 5-step easyWhite
®
bins
at 3000 K to 5000 K CCT, 3-step
EasyWhite bins at 2700 K to 5000 K
and 2-step EasyWhite bins at 2700 K
to 4000 K CCT
Available in ANSI white bins at
3000 K to 7000 K CCT
Available in standard, 70-, 80-, and
90-minimum CRI options
Binned at 85 °C
Maximum drive current: 3000 mA
(6 V), 1500 mA (12 V)
Low thermal resistance: 1.2 °C/W
Wide viewing angle: 120°
Unlimited floor life at
≤ 30 ºC/85% RH
Reflow solderable - JEDEC
J-STD-020C
RoHS and ReACh compliant
UL
®
recognized component
(e349212)
tAbLE oF ContEnts
Characteristics ..............................................2
Flux Characteristics, easyWhite
®
Order
Codes and Bins
.............................................3
Flux Characteristics, ANSI White Order
Codes and Bins
.............................................7
Relative Spectral Power Distribution ........ 11
Relative Flux vs. Junction Temperature.... 11
electrical Characteristics ........................... 12
Relative Flux vs. Current ............................ 13
Relative Chromaticity vs Current............... 14
Relative Chromaticity vs Temperature ...... 15
Typical Spatial Distribution........................ 15
Thermal Design ..........................................
16
Performance Groups – Luminous Flux..... 17
Performance Groups – Chromaticity........ 17
Cree’s Standard White Chromaticity
Regions Plotted on the 1931 CIe Curve.... 21
Cree’s Standard Cool White Kits Plotted
on ANSI Standard Chromaticity Regions .. 24
Cree’s Standard Warm and Neutral White
Kits Plotted on ANSI Standard
Chromaticity Regions ................................ 25
Bin and Order-Code Formats
.....................
26
Reflow Soldering Characteristics
.............. 27
Notes .......................................................... 28
Mechanical Dimensions ............................ 30
Electrical Configuration
............................. 32
Tape and Reel ............................................. 32
Packaging ................................................... 33
WWW.CREE.Com/XLAmp
Copyright © 2014-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, XLamp
®
and
EasyWhite
®
are registered trademarks and the Cree logo and SC5 Technology™ are trademarks of Cree, Inc. UL
®
and the UR logo are registered
trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
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