D/CRCW-HR e3
www.vishay.com
Vishay
Lead (Pb)-Free Thick Film,
Rectangular High Value Chip Resistor
FEATURES
• High resistance values (up to 470M)
• Suitable for voltage dividers and hybrids
• Pure tin plating provides compatibility with lead
(Pb)-free and lead containing soldering
processing
• Metal glaze on high quality ceramic
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
CASE
SIZE
INCH
CASE
SIZE
METRIC
POWER
RATING
P
70
W
LIMITING
ELEMENT
VOLTAGE
U
max.
AC
RMS
/DC
V
75
150
200
RESISTANCE
TEMPERATURE
TOLERANCE
RANGE
SERIES
COEFFICIENT
%
ppm/K
MODEL
D11/CRCW0603-HR
D12/CRCW0805-HR
D25/CRCW1206-HR
0603
0805
1206
RR 1608M
RR 2012M
RR 3216M
0.10
0.125
0.25
± 500
± 500
± 500
±5
±5
±5
11M to 470M
11M to 470M
11M to 470M
E24
E24
E24
Notes
• These resistors do not feature a limited lifetime when operated within the limits of rated dissipation, permissible operating voltage, and
permissible film temperature. However, the resistance typically increase due to the resistor’s film temperature over operating time, generally
known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional time.
• Marking and packaging: See datasheet “Surface Mount Resistor Marking” (www.vishay.com/doc?20020)
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
TECHNICAL SPECIFICATIONS
PARAMETER
Rated Dissipation at
P
70 (1)
Operating Voltage
U
max.
AC
RMS
/DC
Voltage Coefficient
Insulation Voltage
U
ins
(1 min)
Insulation Resistance
Operating Temperature Range
Weight
UNIT
W
V
%/V
V
°C
mg
2
100
D11/CRCW0603-HR
0.1
75
D12/CRCW0805-HR
0.125
150
< 100M: < 0.1
> 100M: < 0.3
200
> 10
9
- 55 to + 155
5.5
10
300
D25/CRCW1206-HR
0.25
200
(1)
Note
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
Revision: 12-Jun-12
Document Number: 20022
1
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-HR e3
www.vishay.com
Vishay
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW060316M0JPEAHR
C
R
C
W
0
6
0
3
1
6
M
0
J
P
E
A
H
R
MODEL/SIZE
CRCW0603
CRCW0805
CRCW1206
RESISTANCE
M
= Million
TOLERANCE
J
=±5%
TCR
P
= ± 500 ppm/K
PACKAGING
EA
EB
EC
SPECIAL
Up to 2 digits
HR
= High value
Product Description: D11/CRCW0603-HR 500 16M 5 % ET1 e3
D11/CRCW0603-HR
MODEL
D11/CRCW0603-HR
D12/CRCW0805-HR
D25/CRCW1206-HR
500
TCR
±
500
ppm/K
16M
RESISTANCE
68M
= 68 M
227M
= 227 M
5%
TOLERANCE
±
5
%
ET1
PACKAGING
ET1
ET5
ET6
e3
LEAD (Pb)-FREE
e3
= Pure tin
termination finish
PACKAGING
MODEL
D11/CRCW0603-HR
CODE
EA = ET1
EB = ET5
EC = ET6
EA = ET1
D12/CRCW0805-HR
EB = ET5
EC = ET6
EA = ET1
D25/CRCW1206-HR
EB = ET5
EC = ET6
QUANTITY
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
8 mm
4 mm
Paper tape acc. to
IEC 60068-3
Type I
8 mm
4 mm
8 mm
4 mm
CARRIER TAPE
WIDTH
PITCH
REEL DIAMETER
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
DIMENSIONS
SOLDER PAD DIMENSIONS
in millimeters
SIZE
INCH METRIC
0603
0805
1206
1608
2012
3216
1.55
2.0
3.2
L
+ 0.10
- 0.05
+ 0.20
- 0.10
+ 0.10
- 0.20
DIMENSIONS
in millimeters
REFLOW SOLDERING
W
0.85 ± 0.1
1.25 ± 0.15
1.6 ± 0.15
H
0.45 ± 0.05
0.45 ± 0.05
0.55 ± 0.05
T1
0.3 ± 0.2
0.3
+ 0.10
- 0.20
WAVE SOLDERING
a
0.9
0.9
1.1
b
0.9
1.3
1.7
l
1.0
1.3
2.3
T2
0.3 ± 0.2
0.3 ± 0.2
0.4 ± 0.2
a
0.5
0.7
0.9
b
0.9
1.3
1.7
l
1.0
1.2
2.0
0.45 ± 0.2
Revision: 12-Jun-12
Document Number: 20022
2
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-HR e3
www.vishay.com
DERATING
Fraction of Rated Dissipation
P
70
Vishay
100
%
50
0
- 50
0
50
100
°C
150
70
Ambient Temperature in
amb
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 2 OR BETTER
Stability for product types:
D/CRCW-HR e3
4.5
4.13
_
_
Resistance
Short time overload
-
U
= 2.5 x √P
70
x
R
2 x
U
max.
;
Duration acc. to style
Solder bath method;
Sn60Pb40
4.17.2
58 (Td)
Solderability
Solder bath method;
Sn96, 5Ag3Cu0.5 or
Sn99, 3Cu0.7
non-activated flux;
(245 ± 5) °C or (250 ± 5) °C
(3 ± 0.3) s
20 °C/- 55 °C/20 °C and
20 °C/125 °/20 °C
RR 1608: 9 N
RR 2012 and RR 3216: 45N
Depth 2 mm;
3 times
30 min. at - 55 °C;
30 min. at 125 °C
5 cycles
1000 cycles
-
125 °C; 16 h
55 °C;
90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;
90 % RH
24 h; 5 cycle
U
= √P
70
x
R
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
11 M to 470 M
±5%
± (0.5 %
R
+ 0.05
)
Good tinning ( 95 % covered); no visible
damage
Good tinning ( 95 % covered); no visible
damage
4.8.4.2
4.32
4.33
_
21 (Uu
3
)
21 (Uu
1
)
Temperature
coefficient
Shear (adhesion)
Substrate bending
± 500 ppm/K
No visible damage
No visible damage, no open circuit in bent
position
± (0.25 %
R
+ 0.05
)
4.19
14 (Na)
Rapid change of
temperature
Climatic sequence:
Dry Heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
D.C. Load
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
_
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
_
± (2 %
R
+ 0.1
)
Revision: 12-Jun-12
Document Number: 20022
3
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-HR e3
www.vishay.com
Vishay
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 2 OR BETTER
Stability for product types:
D/CRCW-HR e3
Endurance at
70 °C
U
= √P
70
x
R
U
max.
1.5 h on; 0,5 h off;
70 °C; 1000 h
70 °C; 8000 h
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
(40 ± 2) °C;
(93 ± 3) % RH; 56 days
155 °C; 1000 h
11 M to 470 M
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
4.25.1
_
± (2 %
R
+ 0.1
)
± (4 %
R
+ 0.1
)
± (0.5 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (2 %
R
+ 0.1
)
4.18.2
58 (Td)
Resistance to
soldering heat
Damp heat,
steady state
Endurance at upper
category temperature
4.24
4.25.3
78 (Cab)
_
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2-x, variety of environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
Revision: 12-Jun-12
Document Number: 20022
4
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
1
Document Number: 91000
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