Temperature Measurement
SMD NTC Thermistors with Nickel Barrier Termination, Size 0603
Applications
I
Temperature measurement and compensation in
B573**
V 3**
0,8±0,15
0,9 max.
Features
I
Multilayer SMD NTC with inner electrodes
I
Ni barrier termination (Ag/Ni/Sn)
I
High accuracy:
±
5 % in resistance,
Termination
0,35±0,15
– mobile phone applications
(e.g. battery pack, TCXO, LCD)
– data systems
– automotive electronics
1,6±0,15
TNT0396-Y
B
value tolerance down to
±
1,5 % available on request
I
Excellent long-term ageing stability in high-temperature
and high-humidity environment
I
Superior resistance stability during soldering (change < 1 %)
Options
Dimensions in mm
Approx. weight 6 mg
Alternative resistance ratings, resistance tol.
<
5 % and
B
value tol. < 3 % available on request
Delivery mode
Cardboard tape, 180-mm reel, PU: 4000 pcs (standard); 330-mm reel, PU: 16000 pcs (on request)
Climatic category (IEC 60068-1)
Max. power at 25
°
C (on PCB)
Resistance tolerance
Rated temperature
B
value tolerance
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
R
25
No. of
R/T
characteristic
8501
8501
8501
8501
8501
8502
8502
8502
8502
8502
B
25/50
K
3470
3470
3470
3470
3470
3940
3940
3940
3940
3940
P
25
∆
R
N
/R
N
T
N
∆
B/B
δ
th
1)
τ
c
1)
C
th
1)
1)
55/125/56
180
±
5 %,
±
10 %
25
±
3%
approx. 3,0
approx. 4,0
approx. 12,0
B
25/100
K
3550
3550
3550
3550
3550
4000
4000
4000
4000
4000
mW
°
C
mW/K
s
mJ/K
B
25/85
K
3540
3540
3540
3540
3540
3980
3980
3980
3980
3980
Ordering code
Ω
47
100
150
220
330
470
680
1,0 k
1,5 k
10 k
B57311V2470+060
B57311V2101+060
B57311V2151+060
B57311V2221+060
B57311V2331+060
B57321V2471+060
B57321V2681+060
B57321V2102+060
B57321V2152+060
B57321V2103+060
1) Depends on mounting situation
50
05/02
Temperature Measurement
SMD NTC Thermistors with Nickel Barrier Termination, Size 0603
Reliability data
B573**
V 3**
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Storage in
dry heat
Standard
IEC
60068-2-2
JIS C 0021
IEC
60068-2-3
JIS C 0022
IEC
60068-2-14
JIS C 0025
Test conditions
Storage at upper
category temperature
T:
(125
±
2)
°
C
t:
1000 h
Temperature of air: (40
±
2)
°
C
Relative humidity of air:
(93 +2/–3) %
Duration: 56 days
∆
R
25
/R
25
(typical)
<2%
Remarks
Storage in damp
heat, steady state
<2%
Rapid temperature
cycling
Endurance
Lower test temperature: – 55
°
C < 2 %
Upper test temperature: 125
°
C
Number of cycles: 100
P
max
: 180 mW
T:
(65
±
2)
°
C
t:
1000 h
<2%
Solderability
IEC
60068-2-58
JIS C 0054
Solderability:
(215
±
3)
°
C / (3
±
0,3) s
(235
±
5)
°
C / (2
±
0,2) s
Resistance to soldering heat:
(260
±
5)
°
C / (10
±
1) s
95 % of
terminations
wetted
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
<1%
52
05/02
Herausgegeben von EPCOS AG
Unternehmenskommunikation, Postfach 80 17 09, 81617 München, DEUTSCHLAND
++49 89 636 09, FAX (0 89) 636-2 26 89
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Published by EPCOS AG
Corporate Communications, P.O. Box 80 17 09, 81617 Munich, GERMANY
++49 89 636 09, FAX (0 89) 636-2 26 89
EPCOS AG 2002. Reproduction, publication and dissemination of this brochure and the information contained therein without
EPCOS’ prior express consent is prohibited.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics
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This brochure replaces the previous edition.
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