5962-8606305UA datasheet, PDF - EEWORLD Datasheet

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5962-8606305UA: DescriptionUVPROM, 32KX8, 150ns, CMOS, CDIP28, CERAMIC, DIP-28; Categorystorage; File Size156KB，5 Pages; ManufacturerWaferscale Integration Inc.

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5962-8606305UA Overview

UVPROM, 32KX8, 150ns, CMOS, CDIP28, CERAMIC, DIP-28

5962-8606305UA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Waferscale Integration Inc.
package instruction	CERAMIC, DIP-28
Reach Compliance Code	unknown
Is Samacsys	N
Maximum access time	150 ns
I/O type	COMMON
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	37.085 mm
memory density	262144 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	12.5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Maximum standby current	0.0003 A
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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Description	UVPROM, 32KX8, 150ns, CMOS, CDIP28, CERAMIC, DIP-28	UVPROM, 32KX8, 150ns, CMOS, CDIP28, CERAMIC, DIP-28	UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28	UVPROM, 32KX8, 120ns, CMOS, CDIP28, CERAMIC, DIP-28	UVPROM, 32KX8, 120ns, CMOS, CQCC32, WINDOWED, CERAMIC, LLCC-32	UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, THIN, CERDIP-28	UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28	UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, THIN, CERDIP-28
package instruction	CERAMIC, DIP-28	CERAMIC, DIP-28	0.600 INCH, WINDOWED, CERDIP-28	CERAMIC, DIP-28	WINDOWED, CERAMIC, LLCC-32	0.300 INCH, WINDOWED, THIN, CERDIP-28	0.600 INCH, WINDOWED, CERDIP-28	0.300 INCH, WINDOWED, THIN, CERDIP-28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	150 ns	150 ns	200 ns	120 ns	120 ns	150 ns	120 ns	120 ns
JESD-30 code	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-CQCC-N32	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28
length	37.085 mm	37.215 mm	37.215 mm	37.215 mm	13.97 mm	37.085 mm	37.215 mm	37.085 mm
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	32	28	28	28
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	WDIP	DIP	WQCCN	WDIP	WDIP	WDIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE, WINDOW	IN-LINE	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.72 mm	5.72 mm	5.72 mm	3.3 mm	5.08 mm	5.72 mm	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL
width	7.62 mm	15.24 mm	15.24 mm	15.24 mm	11.43 mm	7.62 mm	15.24 mm	7.62 mm
Base Number Matches	1	1	1	1	1	1	1	1
Maker	Waferscale Integration Inc.	-	-	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.	Waferscale Integration Inc.
JESD-609 code	e0	e0	e0	e0	-	-	-	e0
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	-	-	-	3-STATE
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	TIN LEAD	Tin/Lead (Sn/Pb) - hot dipped	-	-	-	TIN LEAD

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