F-219
SEAF–20–05.0–S–10–2–A–K–TR
SEAF–30–05.0–S–08–2–A–K–TR
(1.27 mm) .050"
SEAF–30–05.0–S–08–2–A–LP–K–TR
SEAF SERIES
HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Operating Temp Range:
-55 °C to +125 °C
Current Rating
(7 mm stack height):
2.7 A per pin
(10 adjacent pins powered)
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Working Voltage:
240 VAC
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Board Mates:
SEAM, SEAMP,
SEAR, SEAMI
Cable Mates:
SEAC
Standoffs:
JSO
(1.12 mm)
.044"
NOMINAL
WIPE
Up to
500 pins
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 30 µ" GOLD
Low
insertion/
extraction
forces
HIGH-SPEED CHANNEL PERFORMANCE
SEAF/SEAM @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
Solder
charges
SEAF
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
LEAD
STYLE
–05.0
–06.0
–06.5
–07.5
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
OPTION
K
TR
–K
STANDARDS
• VITA 47
• VITA 57.1 FMC
• VITA 57.4 FMC+
• VITA 74 VNX
• PISMO
™
2
Visit www.samtec.com/standards
for more information.
–10, –15, – 20,
– 30, –40, –50
(–10 only available
in 04 row)
(–15 only available
in 04 or 10 row with
–05.0 lead style)
= 10 µ"
(0.25 µm)
Gold on
contact
area,
Matte Tin on
solder tail
–L
– 04
=Four
Rows
– 05
=Five
Rows
= Tin/Lead
Alloy
Solder Charge
–1
–2
A
(5.05)
.199
(6.05)
.238
(6.55)
.258
(7.54)
.297
DIFFERENTIAL
SIGNAL ROUTING
(1.27) .050
(1.27)
.050
NO. OF
B
ROWS
(5.66) .223
–04
–05, –06
(8.20) .323
(10.74) .423
–08
(13.28) .523
–10
= 30 µ"
(0.76 µm)
Gold on
contact
area,
Matte Tin on
solder tail
–S
– 06
=Six
Rows
= Lead-Free
Solder Charge
= Polyimide
= Latch Post
film Pick &
(–LP required
Place Pad
for SEAC
(Not
mate only)
available
(Available with
with –10 and
–05.0 lead style
–15 pins
and –04, –06, –08
with –LP
& –10 rows only) Latch post)
– LP
=Eight
Rows
– 08
– 10
=Ten
Rows
POWER/SIGNAL
APPLICATION
(1.27) .050
The above signal routing
configuration allows for
the use of 25 to 125
differential pair counts.
Contact sig@samtec.com
for specific details.
08
B
(1.27)
.050
No. of positions x
01
(1.27) .050 + (5.82) .229
(15.49)
.610
Notes:
Patented
IPC-A-610F and
IPC J-STD-001F Class 3
solder joint.
Some sizes, styles and
options are non-standard,
non-returnable.
(1.27)
.050
(1.12) .044 DIA
No. of positions x
(1.27) .050 + (3.58) .141
A
–LP
(1.78)
.070
(0.20)
.008
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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