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MT46H128M16LFDD-48 WT:C

Description
DRAM Chip Mobile LPDDR SDRAM 2Gbit 128Mx16 1.8V 60-Pin VFBGA
File Size1MB,96 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance
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MT46H128M16LFDD-48 WT:C Overview

DRAM Chip Mobile LPDDR SDRAM 2Gbit 128Mx16 1.8V 60-Pin VFBGA

MT46H128M16LFDD-48 WT:C Parametric

Parameter NameAttribute value
EU restricts the use of certain hazardous substancesCompliant
ECCN (US)EAR99
Part StatusLTB
HTS8542.32.00.36
DRAM TypeMobile LPDDR SDRAM
Chip Density (bit)2G
Organization128Mx16
Number of Internal Banks4
Number of Words per Bank32M
Number of Bits/Word (bit)16
Data Bus Width (bit)16
Maximum Clock Rate (MHz)208
Maximum Access Time (ns)6.5|5
Address Bus Width (bit)16
Interface TypeLVCMOS
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Maximum Operating Supply Voltage (V)1.95
Operating Current (mA)130
Minimum Operating Temperature (°C)-25
Maximum Operating Temperature (°C)85
Supplier Temperature GradeWireless
Number of I/O Lines (bit)16
Supplier PackageVFBGA
Pin Count60
Standard Package NameBGA
MountingSurface Mount
Package Height0.55(Min)
Package Length9
Package Width8
PCB changed60
Lead ShapeBall
2Gb: x16, x32 Automotive LPDDR SDRAM
Features
Automotive LPDDR SDRAM
MT46H128M16LF – 32 Meg x 16 x 4 Banks
MT46H64M32LF – 16 Meg x 32 x 4 Banks
Features
• V
DD
/V
DDQ
= 1.70–1.95V
• Bidirectional data strobe per byte of data (DQS)
• Internal, pipelined double data rate (DDR)
architecture; two data accesses per clock cycle
• Differential clock inputs (CK and CK#)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
• 4 internal banks for concurrent operation
• Data masks (DM) for masking write data; one mask
per byte
• Programmable burst lengths (BL): 2, 4, 8, or 16
• Concurrent auto precharge option is supported
• Auto refresh and self refresh modes
• 1.8V LVCMOS-compatible inputs
• Temperature-compensated self refresh (TCSR)
2
• Partial-array self refresh (PASR)
• Deep power-down (DPD)
• Status read register (SRR)
• Selectable output drive strength (DS)
• Clock stop capability
• 64ms refresh; 32ms for the automotive temperature
range
Table 1: Key Timing Parameters (CL = 3)
Speed Grade
-48
Clock Rate
208 MHz
Access Time
4.8ns
Options
• V
DD
/V
DDQ
– 1.8V/1.8V
• Configuration
– 128 Meg x 16 (32 Meg x 16 x 4 banks)
– 64 Meg x 32 (16 Meg x 32 x 4 banks)
• Addressing
– JEDEC-standard
• Plastic "green" package
– 60-ball VFBGA (8mm x 9mm)
– 90-ball VFBGA (8mm x 13mm)
• Timing – cycle time
– 4.8ns @ CL = 3 (208 MHz)
• Special Options
– Automotive (package-level burn-in)
• Operating temperature range
– From –40˚C to +85˚C
– From –40˚C to +105˚C
1
• Design revision
Notes:
1. Contact factory for availability.
2. Self refresh supported up to 85 ºC.
Mark
H
128M16
64M32
LF
DD
BQ
-48
A
IT
AT
:C
Table 2: Configuration Addressing – 2Gb
Architecture
Configuration
Refresh count
Row addressing
Column addressing
128 Meg x 16
32 Meg x 16 x 4 banks
8K
16K A[13:0]
2K A11, A[9:0]
64 Meg x 32
16 Meg x 32 x 4 banks
8K
16K A[13:0]
1K A[9:0]
PDF: 09005aef8541eee0
t89m_auto_lpddr.pdf - Rev. H 01/17 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

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MT46H128M16LFDD-48 WT:C MT46H128M16LFDD-48 WT:C TR
Description DRAM Chip Mobile LPDDR SDRAM 2Gbit 128Mx16 1.8V 60-Pin VFBGA DRAM Chip Mobile LPDDR SDRAM 2Gbit 128Mx16 1.8V 60-Pin VFBGA
EU restricts the use of certain hazardous substances Compliant Compliant
ECCN (US) EAR99 EAR99
Part Status LTB LTB
DRAM Type Mobile LPDDR SDRAM Mobile LPDDR SDRAM
Chip Density (bit) 2G 2G
Organization 128Mx16 128Mx16
Number of Internal Banks 4 4
Number of Words per Bank 32M 32M
Number of Bits/Word (bit) 16 16
Data Bus Width (bit) 16 16
Maximum Clock Rate (MHz) 208 208
Maximum Access Time (ns) 6.5|5 5|6.5
Address Bus Width (bit) 16 16
Interface Type LVCMOS LVCMOS
Minimum Operating Supply Voltage (V) 1.7 1.7
Typical Operating Supply Voltage (V) 1.8 1.8
Maximum Operating Supply Voltage (V) 1.95 1.95
Operating Current (mA) 130 130
Minimum Operating Temperature (°C) -25 -25
Maximum Operating Temperature (°C) 85 85
Supplier Temperature Grade Wireless Wireless
Number of I/O Lines (bit) 16 16
Supplier Package VFBGA VFBGA
Pin Count 60 60
Standard Package Name BGA BGA
Mounting Surface Mount Surface Mount
Package Height 0.55(Min) 0.55(Min)
Package Length 9 9
Package Width 8 8
PCB changed 60 60
Lead Shape Ball Ball
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