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5570N-20

Description
THERMALLY CONDUCTIVE ACRYLIC INT
CategoryThermal management products   
File Size109KB,3 Pages
Manufacturer3M
Websitehttp://3M.com/esd
Environmental Compliance
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5570N-20 Overview

THERMALLY CONDUCTIVE ACRYLIC INT

Technical Data | July 2016
3M™ Thermally Conductive Acrylic Interface Pad 5570N
Product Description
3M™ Thermally Conductive Acrylic Interface Pad 5570N is designed to provide a preferential heat transfer path
between heat generating components like integrated circuit chips and heat spreaders like aluminum heat sinks. 3M™
Thermally Conductive Acrylic Interface Pad 5570N consists of a highly conformable, slightly tacky acrylic elastomer
sheet filled with thermally conductive ceramic particles.
Key Features and Benefits
Soft for good conformability even to non-flat integrated circuit (IC) surfaces and heat spreading blocks
Little to no siloxane gas/oil bleeding that can cause electric connection failures
High pressure relaxation helps reduce pressure to electric components
Good electrical insulation properties
Slight tack allows easy pre-assembly
Good wetting performance for better thermal conductivity
Product Construction/Material Description
Note:
The following technical information and data should be considered representative or typical only and should not be used for
specification purposes.
3M™ Thermally Conductive Acrylic Interface Pad 5570N
Property
Color
Base resin
Pad Thickness
Primary Filler Type
Product Liner
Roll Length
Value
White with light gray dots
Acrylic
0.5, 1.0, 1.5, 2.0 mm
Ceramic
PET Film
Standard: 33 M
Custom size can be supplied by user requests.
Applications
IC packaging heat conduction
Heat sink
Chip on film (COF) thermal management for uniform temperature
LED board thermal interface management
LED TV driver IC Chip
General gap filling in electronic device
Electric vehicle/hybrid battery for automotive

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