DATA SHEET
WIRELESS COMPONENTS
Ceramic Chip Antenna
ANT1608LL14R2455A
2.4
AND
5GH
Z
1608 Series
Product Specification – December 25, 2014 V.0
Product specification
2
WIRELESS COMPONENTS
Ceramic Chip Antenna
FEATURES
Compact size
Omni-directional radiation
Dual-band design
Tape & reel automatic
mounting
Reflow process compatible
RoHS compliant
APPLICATIONS
2.4&5GHz WiFi device
ISM band equipment
ORDERING INFORMATION
All part numbers are identified by the series, packing type, material, size,
antenna type, working frequency and packing quantity.
PART NUMBER
ANT 1608 L L14 R 2455A
(1)
(2)
(3) (4)
(5)
(6)
(1) PRODUCT
ANT = Antenna
(2) SIZE
1608 = 1.6 × 0.8
(3) ANTENNA TYPE
L,F,A = Chip Antenna
(4) SERIAL NO.
L14
(5)PACKING STYLE
R = Tape and Reel
(6) WORKING FREQUENCY
2455 = 2.4/5GHz
PHYCOMP CTC
CAN4311715142524K
12NC
431171514252
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Dec. 25, 2014 V.0
Product specification
3
WIRELESS COMPONENTS
Ceramic Chip Antenna
SPECIFICATION
Table 1
DESCRIPTION
Centre Frequency
Bandwidth
Polarization
Azimuth Beamwidth
Peak Gain
Impedance
Operating Temperature
Maximum Power
Termination
Resistance to Soldering Heats
NOTE
VALUE
2.45 G / 5.5 G Hz
120 / 900 MHz ( Typ. )
Linear
Omni-directional
3.11 / 3.43 dBi ( Typ. )
50 ohm
- 40~105
℃
1W
Ag (Environmentally-Friendly Leadless)
260℃ , 10sec.
1. The specification is defined on Yageo evaluation board
DIMENSIONS
Table 2 Machinical Dimension
DIMENSION
L (mm)
W (mm)
T (mm)
A1 (mm)
A2 (mm)
B1 (mm)
B2 (mm)
C1 (mm)
C2 (mm)
G1 (mm)
G2 (mm)
1.60 ± 0.15
0.80 ± 0.15
0.40 ± 0.15
0.70 ± 0.15
0.25 ± 0.15
0.30 ± 0.15
0.25 ± 0.15
0.70 ± 0.15
0.25 ± 0.15
0.20 ± 0.05
0.10 ± 0.05
OUTLINES
Table 3 Termination configuration
TERMINAL NAME
B
A1, A2
C1, C2
FUNCTION
Feeding Point
Soldering Point for 2.4GHz
Soldering Point for 5 GHz
Fig. 1
Antenna outlines
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Dec. 25, 2014 V.0
Product specification
4
WIRELESS COMPONENTS
Ceramic Chip Antenna
REFERENCE DESIGN OF EVALUATION BOARD
Fig. 2
Outlook and dimension of evaluation board
Clearance size :8 * 5 mm
Fig. 3 Details of soldering Pad
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Dec. 25, 2014 V.0
Product specification
5
WIRELESS COMPONENTS
Ceramic Chip Antenna
Fig. 4 Footprint
ELECTRICAL PERFORMANCES
Fig. 5
Return loss
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Dec. 25, 2014 V.0