Basic information of MAX9717DEBL+TG45 amplifier:
Commonly used packaging methods are 3 X 3 MM, ROHS COMPLIANT, UCSP-9
MAX9717DEBL+TG45 amplifier core information:
The MAX9717DEBL+TG45 has a minimum operating temperature of -40 °C and a maximum operating temperature of 85 °C. Its peak reflow temperature is NOT SPECIFIED
The maximum slew rate of the MAX9717DEBL+TG45 given by the manufacturer is 8 mA.
The power supply range is: 3/5 V.
Related dimensions of MAX9717DEBL+TG45:
The width of MAX9717DEBL+TG45 is: 1.52 mm and the length is 1.52 mm. MAX9717DEBL+TG45 has 9 terminals. Its terminal position type is: BOTTOM. Terminal pitch is 0.5 mm. Total pins: 9
MAX9717DEBL+TG45 amplifier other information:
Its temperature grade is: INDUSTRIAL. MAX9717DEBL+TG45 does not comply with Rohs certification. The corresponding JESD-30 code is: S-PBGA-B9. The package code of MAX9717DEBL+TG45 is: VFBGA. The materials used in the MAX9717DEBL+TG45 package are mostly PLASTIC/EPOXY.
The package shape is SQUARE. The MAX9717DEBL+TG45 package pin formats are: GRID ARRAY, VERY THIN PROFILE, FINE PITCH. Its terminal forms are: BALL. The maximum seat height is 0.67 mm.

Basic information of MAX9717DEBL+TG45 amplifier:
Commonly used packaging methods are 3 X 3 MM, ROHS COMPLIANT, UCSP-9
MAX9717DEBL+TG45 amplifier core information:
The MAX9717DEBL+TG45 has a minimum operating temperature of -40 °C and a maximum operating temperature of 85 °C. Its peak reflow temperature is NOT SPECIFIED
The maximum slew rate of the MAX9717DEBL+TG45 given by the manufacturer is 8 mA.
The power supply range is: 3/5 V.
Related dimensions of MAX9717DEBL+TG45:
The width of MAX9717DEBL+TG45 is: 1.52 mm and the length is 1.52 mm. MAX9717DEBL+TG45 has 9 terminals. Its terminal position type is: BOTTOM. Terminal pitch is 0.5 mm. Total pins: 9
MAX9717DEBL+TG45 amplifier other information:
Its temperature grade is: INDUSTRIAL. MAX9717DEBL+TG45 does not comply with Rohs certification. The corresponding JESD-30 code is: S-PBGA-B9. The package code of MAX9717DEBL+TG45 is: VFBGA. The materials used in the MAX9717DEBL+TG45 package are mostly PLASTIC/EPOXY.
The package shape is SQUARE. The MAX9717DEBL+TG45 package pin formats are: GRID ARRAY, VERY THIN PROFILE, FINE PITCH. Its terminal forms are: BALL. The maximum seat height is 0.67 mm.
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Maxim |
| Parts packaging code | BGA |
| package instruction | 3 X 3 MM, ROHS COMPLIANT, UCSP-9 |
| Contacts | 9 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Nominal bandwidth | 22 kHz |
| Commercial integrated circuit types | AUDIO AMPLIFIER |
| JESD-30 code | S-PBGA-B9 |
| length | 1.52 mm |
| Number of channels | 1 |
| Number of functions | 1 |
| Number of terminals | 9 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Nominal output power | 1.4 W |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA9,3X3,20 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.67 mm |
| Maximum slew rate | 8 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 1.52 mm |
| Base Number Matches | 1 |

| MAX9717DEBL+TG45 | MAX9716EBL+TG45 | MAX9717 | MAX9716 | MAX9716_09 | MAX9717AEBL+TG45 | MAX9717BEBL+TG45 | MAX9717CEBL+TG45 | |
|---|---|---|---|---|---|---|---|---|
| Description | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 3 X 3 MM, ROHS COMPLIANT, UCSP-9 | 1.4 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8 | 1.4 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8 | 1.4 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8 | 1.4 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 3 X 3 MM, ROHS COMPLIANT, UCSP-9 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 3 X 3 MM, ROHS COMPLIANT, UCSP-9 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 3 X 3 MM, ROHS COMPLIANT, UCSP-9 |
| Number of channels | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 9 | 9 | 8 | 8 | 8 | 9 | 9 | 9 |
| Maximum operating temperature | 85 °C | 85 °C | 85 Cel | 85 Cel | 85 Cel | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 Cel | -40 Cel | -40 Cel | -40 °C | -40 °C | -40 °C |
| surface mount | YES | YES | Yes | Yes | Yes | YES | YES | YES |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | BALL | BALL | GULL WING | GULL WING | GULL WING | BALL | BALL | BALL |
| Terminal location | BOTTOM | BOTTOM | DUAL | DUAL | DUAL | BOTTOM | BOTTOM | BOTTOM |
| Is it Rohs certified? | conform to | conform to | - | - | - | conform to | conform to | conform to |
| Maker | Maxim | Maxim | - | - | - | Maxim | Maxim | Maxim |
| Parts packaging code | BGA | BGA | - | - | - | BGA | BGA | BGA |
| package instruction | 3 X 3 MM, ROHS COMPLIANT, UCSP-9 | VFBGA, BGA9,3X3,20 | - | - | - | 3 X 3 MM, ROHS COMPLIANT, UCSP-9 | 3 X 3 MM, ROHS COMPLIANT, UCSP-9 | 3 X 3 MM, ROHS COMPLIANT, UCSP-9 |
| Contacts | 9 | 9 | - | - | - | 9 | 9 | 9 |
| Reach Compliance Code | compliant | compli | - | - | - | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | - | - | - | EAR99 | EAR99 | EAR99 |
| Nominal bandwidth | 22 kHz | 22 kHz | - | - | - | 22 kHz | 22 kHz | 22 kHz |
| Commercial integrated circuit types | AUDIO AMPLIFIER | AUDIO AMPLIFIER | - | - | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 code | S-PBGA-B9 | S-PBGA-B9 | - | - | - | S-PBGA-B9 | S-PBGA-B9 | S-PBGA-B9 |
| length | 1.52 mm | 1.52 mm | - | - | - | 1.52 mm | 1.52 mm | 1.52 mm |
| Nominal output power | 1.4 W | 1.4 W | - | - | - | 1.4 W | 1.4 W | 1.4 W |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | VFBGA | VFBGA | - | - | - | VFBGA | VFBGA | VFBGA |
| Encapsulate equivalent code | BGA9,3X3,20 | BGA9,3X3,20 | - | - | - | BGA9,3X3,20 | BGA9,3X3,20 | BGA9,3X3,20 |
| Package shape | SQUARE | SQUARE | - | - | - | SQUARE | SQUARE | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | - | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3/5 V | 3/5 V | - | - | - | 3/5 V | 3/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 0.67 mm | 0.67 mm | - | - | - | 0.67 mm | 0.67 mm | 0.67 mm |
| Maximum slew rate | 8 mA | 8 mA | - | - | - | 8 mA | 8 mA | 8 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | - | - | - | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | - | - | - | 2.7 V | 2.7 V | 2.7 V |
| technology | BICMOS | BICMOS | - | - | - | BICMOS | BICMOS | BICMOS |
| Terminal pitch | 0.5 mm | 0.5 mm | - | - | - | 0.5 mm | 0.5 mm | 0.5 mm |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 1.52 mm | 1.52 mm | - | - | - | 1.52 mm | 1.52 mm | 1.52 mm |