
RJ45 JACK INT.MAG. 10/100 LED 1X1 INV.
| Parameter Name | Attribute value |
| Modular socket and plug interface types | RJ45 with integrated magnet |
| Modular socket and plug products | RJ type sockets and plugs |
| Connector type | socket |
| Grounding options | PCB ground |
| Sealable | no |
| Connectors and terminals terminate to | A printed circuit board |
| Connector and connector component types | Connector |
| keying | no |
| Port configuration | single port |
| Port matrix configuration | 1 x 1 |
| Connector terminal density | standard |
| Status Indicator | LED |
| Number of Positions | 8 |
| Number of loading locations | 8 |
| PCB mounting direction | right angle |
| Number of panel grounding lugs | 0 |
| PCB ground lug quantity | 2 |
| Data rate (Mb/s) | 10, 100 |
| shielding material | brass |
| Shield plating materials | nickel |
| Modular socket pin orientation | Reverse - Latching |
| shape | standard |
| LED color (lower left corner) | none |
| LED color (lower right corner) | none |
| LED color (upper left corner) | green |
| LED color (upper right corner) | yellow |
| PCB ground lug location | 3.05 mm [ .12 in ] |
| Shielding plating coating | matte |
| Insulator material | LCP |
| PCB terminal termination area plating materials | tin |
| Terminal base material | nickel |
| Terminal contact plating material | Nickel base gold plating |
| Terminal base material | copper alloy |
| Thickness of plating material in terminal bonding area | .76 µm [ 30 µin ] |
| PCB termination area electroplated coating | matte |
| PCB Termination Methods | Through Hole - Solder |
| PCB mounting fixation type | plate lock |
| plate lock material | LCP |
| access location | side |
| Shell color | black |
| Shell material | LCP (Liquid Crystal Polymer) |
| Connector height | 13.83 mm [ .544 in ] |
| Working group temperature range | -40 – 85 °C [ -40 – 185 °F ] |
| Housing material temperature | 260 |
| shield | yes |
| UL flame retardant rating | UL 94V-0 |
| performance category | Category 5 |
| Package quantity | 50 |
| Encapsulation method | Tray |
| Shielding layer panel grounding type | The shield has a bottom panel ground. |