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Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]
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A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
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On August 18th, Galaxis, a specialist in integrated intelligent intralogistics robotics, officially unveiled its next-generation, ultra-narrow aisle forklift mobile robot, the "VFR Ultra-Narrow Ser...[Details]
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According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
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A half-bridge is an inverter topology for converting DC to AC. A typical half-bridge circuit consists of two controller switches, a three-wire DC power supply, two feedback diodes, and two capacito...[Details]
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On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]
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According to Nikkei, a survey found that global electric vehicle battery supply is expected to reach more than three times the required quantity due to
cooling
demand for electric vehicles,...[Details]
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A patent disclosed by Ford proposes replacing traditional segmented side curtain airbags with integrated full-width side curtain airbags that span the side of the vehicle and can be deployed simult...[Details]
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Tiantai Robot's official Weibo account announced on the evening of August 20 that Tiantai Robot Co., Ltd., together with strategic partners including Shandong Future Robot Technology Co., Ltd., Sha...[Details]
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High-definition media consumption is experiencing a dual growth: an increase in the number of consumers and a transition to higher-definition content. This growth is driven by increasingly widespre...[Details]
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introduction
As core electronic components used in vastly different fields, automotive-grade chips and mobile/consumer-grade chips exhibit significant differences in their...[Details]
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introduction
The widespread use of air conditioner communication circuits began with the rise of household inverter air conditioners. With China's energy conservation and emission reduction in...[Details]
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Silicon Labs (also known as "Silicon Labs"), an innovative leader in low-power wireless connectivity, will showcase its cutting-edge artificial intelligence (AI) and Internet of Things (IoT) solu...[Details]
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Munich, Germany, August 19, 2025 –
Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, announced today that its AIROC™ CYW20829 Bluetooth® low e...[Details]
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Recently, UBTECH announced its patent for "robot self-battery replacement structure, device and method".
The Qichacha patent abstract shows that the robot's self-battery replacement stru...[Details]