DPAF-15-03.0-S-8-2-A-K-TR datasheet, PDF

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DPAF-15-03.0-S-8-2-A-K-TR: DescriptionBoard-to-Board & Mezzanine Connectors .085" X .100" DP Array Differential Pair Array Socket; CategoryThe connector The connector; File Size494KB，2 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/; Environmental Compliance

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DPAF-15-03.0-S-8-2-A-K-TR Overview

Board-to-Board & Mezzanine Connectors .085" X .100" DP Array Differential Pair Array Socket

DPAF-15-03.0-S-8-2-A-K-TR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMTEC
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	2 weeks
Other features	STAGGERED CONFIGURATION
Connector type	BOARD CONNECTOR
Contact completed and terminated	Gold (Au) - with Nickel (Ni) barrier
Contact point gender	FEMALE
DIN compliance	NO
Filter function	NO
IEC compliance	NO
JESD-609 code	e4
MIL compliance	NO
Plug information	MULTIPLE MATING PARTS AVAILABLE
Mixed contacts	NO
Installation method	STRAIGHT
Installation type	BOARD
Number of rows loaded	16
Options	GENERAL PURPOSE
Terminal pitch	2.16 mm
Termination type	SURFACE MOUNT
Total number of contacts	240

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F-214

DPAM–23–07.0–S–8–2–A

DPAF–23–03.0–S–8–2–A

(2,16 mm) .085"

DPAM, DPAF SERIES

HIGH DENSITY DIFFERENTIAL PAIR ARRAY

DPAM Mates with:

DPAF

DPAF Mates with:

DPAM

PAIRS

PER ROW

07.0

PLATING

OPTION

NO. OF

ROWS

SOLDER

TYPE

OPTION

SPECIFICATIONS

For complete speciﬁcations and

recommended PCB layouts see

www.samtec.com?DPAM or

www.samtec.com?DPAF

Insulator Material:

Black LCP

Contact Material:

Copper Alloy

Plating:

Au over 50µ" (1,27 µm) Ni

Current Rating (2x3):

2.9 A per pin

Operating Temp Range:

-55°C to +125°C

Contact Resistance:

10.4mΩ

Working Voltage:

300 VAC

Mated Cycles:

100 Cycles

RoHS Compliant:

Yes

Lead-Free Solderable:

Yes

– 04, –06

– 08, –15, –23

–8

–S

=30µ" (0,76 µm)

Gold on contact area,

Tin on solder tail

=Eight

Pair

Rows

–2

= Lead-Free

Tin Alloy

96.5% Sn/

3% Ag/.5% Cu

Solder Crimp

–K

=(20,00 mm) 0.80"

DIA Polyimide

ﬁlm Pick &

Place Pad

–3

=Three

Pair

Rows

(2,54)

.100

–TR

=Tape & Reel

Perimeter

Grounds (TYP)

–GP

=Guide Post

(–23 only)

(2,54)

.100

NO OF

ROWS

–8

–3

(24,59) .968

(11,89) .468

02 01 G2 03 04

Signal Pairs (TYP)

No. of positions x (2,16) .085 + (4,34) .171

(6,66)

.262

(2,16) .085

(1,27)

.050

(1,08) .0425

(1,27)

.050

DIA

(0,13)

.005

RECOGNITIONS

For complete scope of

recognitions see

www.samtec.com/quality

No. of positions x (2,16) .085 + (2,95) .116

DPAM/DPAF

Rated @ 3dB Insertion Loss*

10 mm Stack Height

Single-Ended Signaling

8 GHz / 16 Gbps

Differential Pair Signaling

7 GHz / 14 Gbps

*Performance data includes effects of a non-optimized PCB.

Complete test data available at www.samtec.com?DPAM,

www.samtec.com?DPAF or contact sig@samtec.com

cols

roto rted

Supp

note

Download app ppnote

com/a

www.samtec.

@ samtec.co

Contact SIG n protocols

for questions

Fibre Chann

Rapid I/O

PCI Express

SATA

™

InfiniBand

XAUI

et I/O)

MGT (Rock

s at

DPAF

PAIRS

PER ROW

03.0

PLATING

OPTION

NO. OF

ROWS

SOLDER

TYPE

OPTION

– 04, – 06, – 08,

–15, –23

–S

=30µ" (0,76 µm)

Gold on contact area,

Tin on solder tail

–8

=Eight

Pair Rows

–2

= Lead-Free Tin Alloy

96.5% Sn/ 3%Ag/

.5% Cu

Solder Crimp

–K

=(20,00 mm)

0.80" DIA

Polyimide

ﬁlm

Pick &

Place Pad

–3

=Three

Pair Rows

Signal

Pairs

(TYP)

No. of positions x (2,16) .085 + (4,34) .171

NO OF

ROWS

–8

–3

(23,32)

.918

(10,62)

.418

SIZE

–04 x –3

–06 x –3

–04 x –8

–06 x –8

–08 x –8

–15 x –8

–23 x –8

–08 x –3

–15 x –3

–23 x –3

USABLE PAIRS

PER ARRAY*

6 Pairs

12 Pairs

16 Pairs

32 Pairs

48 Pairs

–TR

=Tape

& Reel

ALSO AVAILABLE

(MOQ Required)

• Tin-Lead Solder Charge

• Other platings

Contact Samtec.

Note:

Patented

Note:

Some sizes, styles and

options are non-standard,

non-returnable.

(1,52)

.060

(1,27) .050

(2,54)

.100

Perimeter Grounds (TYP)

(6,45)

.254

(2,16) .085

Solder crimped on tail

(1,08) .0425

No. of positions x (2,16) .085 + (2,95) .116

(1,27)

.050

DIA

(0,13)

.005

DPAF

DPAM MATED

LEAD HEIGHT*

STYLE

–03.0

10 mm

–07.0

*Processing

conditions will

affect mated height.

(1,27)

.050

104 Pairs

168 Pairs

18 Pairs

39 Pairs

63 Pairs

*Assumes ﬁrst and last pair in

each row are grounded

WWW.SAMTEC.COM

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