• Fully programmable per-port charge rationing and
behaviors
• Per-port BC1.2 V
BUS
Discharge Function
• Wide Operating Temperature Range:
- -40°C to +105°C
• UL recognized and EN/IEC 60950-1 (CB) certified.
Description
The UCS2112 is a dual USB port power switch
configuration which can provide 3.0A continuous
current (3.4A maximum) per V
BUS
port with precision
overcurrent limiting (OCL), port power switch enables,
auto-recovery fault handling, undervoltage and
overvoltage lockout, back-drive protection and
back-voltage protection, and dynamic thermal
management.
The UCS2112 is well suited for both stand-alone and
applications having SMBus/I
2
C communications.
For applications with SMBus, the UCS2112 provides
per-port current monitoring and eight programmable
current limits per switch, ranging from 0.53A to 3.0A
continuous current (3.4A maximum). Per-port charge
rationing is also provided ranging from 3.8 mAh to
246.3 Ah.
In Stand-alone mode, the UCS2112 provides eight
current limits for both switches, ranging from
0.53A + 0.53A to 3A + 3A total continuous current
(see
Table 1-1).
Both power switches include an independent V
BUS
discharge function and constant current mode current
limiting for BC1.2 applications.
The UCS2112 is available in a 4x4 mm 20-pin QFN
package.
Package Type
UCS2112
4x4 QFN*
ALERT#1
SMDATA
SMCLK
17
ALERT#2
16
15 PWR_EN2
EP
21
14 A_DET#2
13 COMM_ILIM
12 V
BUS2
11 V
BUS2
6
V
S
7
V
S
8
V
DD
9
V
S
10
V
S
DS20005424C-page 1
20
PWR_EN1 1
A_DET#1 2
BOOST# 3
V
BUS1
4
V
BUS1
5
GND
19
18
*
Includes Exposed Thermal Pad (EP); see
Table 3-1.
2015 - 2017 Microchip Technology Inc.
UCS2112
Block Diagram
V
S
Power
Switch 1
V
BUS
UVLO,
OVLO
V
S
Power
Switch 2
V
BUS
discharge
V
BUS
Interface Logic
Temp.
BOOST#
V
DD
Charger
Control,
Measurement,
OCL
PWR_EN1
ALERT#1
A_DET#1
PWR_EN2
ALERT#2
A_DET#2
COMM_ILIM
SMCLK
SMDATA
GND
DS20005424C-page 2
2015 - 2017 Microchip Technology Inc.
UCS2112
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Voltage on V
DD
, V
S
, and V
BUS
pins .................................................................................................................-0.3 to +6V
Pull-Up Voltage (V
PULLUP
) ..................................................................................................................... -0.3 to V
DD
+ 0.3
Port Power Switch Current ..................................................................................................................... Internally limited
Voltage on any Other Pin to Ground ...................................................................................................-0.3 to V
DD
+ 0.3V
Current on any Other Pin ..................................................................................................................................... ±10 mA
Package Power Dissipation ........................................................................................................................ See
Table 1-1
Operating Ambient Temperature Range .................................................................................................-40°C to +105°C
Storage Temperature Range ..................................................................................................................-55°C to +150°C
† Notice:
Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
TABLE 1-1:
Board
High K
(Note
1)
Low K
(Note
1)
Note 1:
POWER DISSIPATION SUMMARY
Package
JC
6 °C/W
6 °C/W
JA
41 °C/W
60 °C/W
De-Rating Factor
T
A
< +25°C
T
A
= +70°C
T
A
= +85°C
above +25°C
Power Rating Power Rating Power Rating
24.4 mW/°C
16.67 mW/°C
2193 mW
1498 mW
1095 mW
748 mW
729 mW
498 mW
20-pin QFN
4x4 mm
20-pin QFN
4x4 mm
A High K board uses a thermal via design with the thermal landing soldered to the PCB ground plane with
0.3 mm (12 mil) diameter vias in a 3x3 matrix (9 total) at 0.5 mm (20 mil) pitch. The board is multi-layer
with 1-ounce internal power and ground planes and 2-ounce copper traces on top and bottom. A Low K
board is a two-layer board without thermal via design with 2-ounce copper traces on the top and bottom.
TABLE 1-2:
ELECTRICAL SPECIFICATIONS
Electrical Characteristics:
Unless otherwise specified, V
DD
= 4.5V to 5.5V, V
S
= 2.9V to 5.5V,
V
PULLUP
= 3V to 5.5V, T
A
= -40°C to 105°C. All typical values at V
DD
= V
S
= 5V, T
A
= 27°C.
Characteristic
Power and Interrupts – DC
Supply Voltage
Supply Current in Active
(I
DD_ACT
+ I
S1_ACT
+ I
S2_ACT
)
Supply Current in Sleep
(I
DD_SLEEP
+ I
S1_SLEEP
+
I
S2_SLEEP
)
Supply Current in Detect
(I
DD_DET
+ I
S1_DET
+ I
S2_DET
)
Note 1:
2:
3:
V
DD
I
ACTIVE
I
SLEEP
4.5
—
—
5
850
6
5.5
—
20
V
µA
µA
Average current I
BUS
= 0 mA
Average current V
PULLUP
V
DD
Symbol
Min.
Typ.
Max.
Unit
Conditions
I
DETECT
—
200
—
µA
Average current
No portable device attached
(Note
1)
This parameter is characterized, not 100% tested.
This parameter is ensured by design and not 100% tested.
The current measurement full scale range maximum value is 3.4A. However, the UCS2112 cannot report
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Embedded System
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