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S27KL0641DABHA023

Description
Dynamic Random Access MemoryNor
Categorysemiconductor    Memory IC    Dynamic random access memory   
File Size1MB,52 Pages
ManufacturerCypress Semiconductor
Environmental Compliance
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S27KL0641DABHA023 Overview

Dynamic Random Access MemoryNor

S27KL0641DABHA023 Parametric

Parameter NameAttribute value
MakerCypress Semiconductor
Product Categorydynamic random access memory
typeHyperRAM
seriesS27KL0641
EncapsulationReel
Factory packaging quantity2500
S27KL0641/S27KS0641
S70KL1281/S70KS1281
3.0 V/1.8 V, 64 Mb (8 MB)/128 Mb (16 MB),
HyperRAM™ Self-Refresh DRAM
Distinctive Characteristics
HyperRAM™ Low Signal Count Interface
Up to 333 MBps
Double-Data Rate (DDR) - two data transfers per clock
166 MHz clock rate (333 MBps) at 1.8 V V
CC
100 MHz clock rate (200 MBps) at 3.0 V V
CC
Sequential burst transactions
Configurable Burst Characteristics
Wrapped burst lengths:
• 16 bytes (8 clocks)
• 32 bytes (16 clocks)
• 64 bytes (32 clocks)
• 128 bytes (64 clocks)
Linear burst
Hybrid option - one wrapped burst followed by linear burst
Wrapped or linear burst type selected in each transaction
Configurable output drive strength
Low Power Modes
Deep Power Down
Package
24-ball FBGA
3.0 V I/O, 11 bus signals
Single ended clock (CK)
1.8 V I/O, 12 bus signals
Differential clock (CK, CK#)
Chip Select (CS#)
8-bit data bus (DQ[7:0])
Read-Write Data Strobe (RWDS)
Bidirectional Data Strobe / Mask
Output at the start of all transactions to indicate refresh la-
tency
Output during read transactions as Read Data Strobe
Input during write transactions as Write Data Mask
RWDS DCARS Timing
During read transactions RWDS is offset by a second clock,
phase shifted from CK
The Phase Shifted Clock is used to move the RWDS transi-
tion edge within the read data eye
High Performance
Performance Summary
Read Transaction Timings
Maximum Clock Rate at 1.8 V V
CC
/V
CC
Q
Maximum Clock Rate at 3.0 V V
CC
/V
CC
Q
Maximum Access Time, (t
ACC
at 166 MHz)
Maximum CS# Access Time to first word at
166 MHz (excluding refresh latency)
166 MHz
100 MHz
36 ns
56 ns
Maximum Current Consumption
Burst Read or Write (linear burst at 166 MHz, 1.8 V)
Power On Reset
Standby (CS# = HIGH, 3.0 V, 105 °C)
Deep Power Down (CS# = HIGH, 3.0 V, 105 °C)
Standby (CS# = HIGH, 1.8 V, 105 °C)
Deep Power Down (CS# = HIGH, 1.8 V, 105 °C)
64 MB
60 mA
50 mA
300 µA
40 µA
300 µA
20 µA
128 MB
72 mA
100 mA
600 µA
N/A
600 µA
N/A
Cypress Semiconductor Corporation
Document Number: 001-97964 Rev. *L
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised July 31, 2018
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