Analog Output MEMS Microphone Flex Evaluation Board User Guide
GENERAL DESCRIPTION
This user guide applies to the following MEMS microphone
evaluation boards:
•
EVAL-INMP401Z-FLEX
•
EVAL-INMP411Z-FLEX
•
EV_ICS-40300-FX
This is a simple evaluation board that allows quick evaluation
of the performance of analog MEMS microphones in a
package with a 4.72 mm × 3.76 mm footprint size. The small
size and low profile of the flexible PCB enables direct
placement of the microphone into a prototype or an existing
design for an in situ evaluation. The evaluation board consists
of a bottom port microphone soldered to a flexible PCB with
color-coded wires attached. The only other component on
the board is a 0.1
μF supply bypass capacitor.
Table 1
describes the functions of the three connection wires. Table 2
describes the functional differences between the different
microphones that are used with this flex circuit.
UG-445
EVALUATION BOARD CIRCUIT
Figure 1 shows the schematic of the evaluation board, and
Figure 2 shows the flex board layout. See the respective
microphone data sheets for complete descriptions and
specifications of the microphones.
V
DD
0.1µF
OUTPUT
MICROPHONE
GND
Figure 1. Evaluation Board Schematic
TABLE 1. PIN FUNCTION DESCRIPTIONS
Wire
Color
Red
White
Black
Microphone
Pin
VDD
OUTPUT
GND
Description
Power Supply. 1.5 V to 3.6 V DC
Analog Output Signal
Ground
4.30mm
13.5mm
Figure 2. Evaluation Board Layout (Top View)
TABLE 2. MICROPHONE FUNCTIONAL
DIFFERENCES
Microphone
INMP401
INMP411
ICS-40300
Sensitivity
−42 dBV
−46 dBV
−45 dBV
Maximum Output Voltage
0.158 V rms
0.355 V rms
0.355 V rms
Figure 3. Evaluation Board Dimensions in Millimeters (Wires Not
Included)
EVALUATION BOARD PHOTOGRAPH
Figure 4. Top and Bottom View
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: UG-445-00
Revision: 1.2
Rev Date:
05/13/2014
UG-445
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, ©2014
InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps,
DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of
the respective companies with which they are associated.
©2014 InvenSense, Inc. All rights reserved.
Document Number: UG-445-00
Revision: 1.2
Rev Date:
05/13/2014
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