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GS81302T37GE-350

Description
Static random access memory 1.8 or 1.5V 4M x 36 144M
Categorystorage    storage   
File Size2MB,31 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance
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GS81302T37GE-350 Overview

Static random access memory 1.8 or 1.5V 4M x 36 144M

GS81302T37GE-350 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeBGA
package instructionLBGA,
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Factory Lead Time12 weeks
Maximum access time0.45 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PBGA-B165
JESD-609 codee1
length17 mm
memory density75497472 bit
Memory IC TypeDDR SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals165
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX36
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width15 mm
GS81302T07/10/19/37E-450/400/350/333/300
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• 2.0 Clock Latency
• Simultaneous Read and Write SigmaDDR™ Interface
• Common I/O bus
• JEDEC-standard pinout and package
• Double Data Rate interface
• Byte Write controls sampled at data-in time
• Burst of 2 Read and Write
• On-Die Termination (ODT) on Data (D), Byte Write (BW),
and Clock (K, K) inputs
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation with self-timed Late Write
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• Data Valid pin (QVLD) Support
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
144Mb SigmaDDR
TM
-II+
Burst of 2 SRAM
450 MHz–300 MHz
1.8 V V
DD
1.8 V or 1.5 V I/O
SRAMs. The GS81302T07/10/19/37E SigmaDDR-II+
SRAMs are just one element in a family of low power, low
voltage HSTL I/O SRAMs designed to operate at the speeds
needed to implement economical high performance
networking systems.
Clocking and Addressing Schemes
The GS81302T07/10/19/37E SigmaDDR-II+ SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer.
Each internal read and write operation in a SigmaDDR-II+ B2
RAM is two times wider than the device I/O bus. An input data
bus de-multiplexer is used to accumulate incoming data before
it is simultaneously written to the memory array. An output
data multiplexer is used to capture the data produced from a
single memory array read and then route it to the appropriate
output drivers as needed. Therefore, the address field of a
SigmaDDR-II+ B2 RAM is always one address pin less than
the advertised index depth (e.g., the 16M x 8 has an 8M
addressable index).
SigmaDDR™ Family Overview
The GS81302T07/10/19/37E are built in compliance with the
SigmaDDR-II+ SRAM pinout standard for Common I/O
synchronous SRAMs. They are 150,994,944-bit (144Mb)
Parameter Synopsis
-450
tKHKH
tKHQV
2.2 ns
0.45 ns
-400
2.5 ns
0.45 ns
-350
2.86 ns
0.45 ns
-333
3.0 ns
0.45 ns
-300
3.3 ns
0.45 ns
Rev: 1.03b 8/2017
1/30
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS81302T37GE-350 Related Products

GS81302T37GE-350 GS81302T37E-350 GS81302T37GE-350I
Description Static random access memory 1.8 or 1.5V 4M x 36 144M Static random access memory 1.8 or 1.5V 4M x 36 144M Static random access memory 1.8 or 1.5V 4M x 36 144M
Is it lead-free? Lead free Contains lead Lead free
Is it Rohs certified? conform to incompatible conform to
Maker GSI Technology GSI Technology GSI Technology
Parts packaging code BGA BGA BGA
package instruction LBGA, LBGA, LBGA,
Contacts 165 165 165
Reach Compliance Code compliant compliant compliant
ECCN code 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
Factory Lead Time 12 weeks 12 weeks 12 weeks
Maximum access time 0.45 ns 0.45 ns 0.45 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code R-PBGA-B165 R-PBGA-B165 R-PBGA-B165
length 17 mm 17 mm 17 mm
memory density 75497472 bit 75497472 bit 75497472 bit
Memory IC Type DDR SRAM DDR SRAM DDR SRAM
memory width 36 36 36
Number of functions 1 1 1
Number of terminals 165 165 165
word count 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C
organize 2MX36 2MX36 2MX36
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 NOT SPECIFIED 260
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.5 mm 1.5 mm 1.5 mm
Maximum supply voltage (Vsup) 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal form BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15 mm 15 mm 15 mm
JESD-609 code e1 - e1
Humidity sensitivity level 3 - 3
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) - Tin/Silver/Copper (Sn/Ag/Cu)
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