GS8342S18BGD-300I datasheet, PDF

Datasheet> All Categories > storage> storage> GS8342S18BGD-300I

GS8342S18BGD-300I: DescriptionStatic random access memory 1.8 or 1.5V 2M x 18 36M; Categorystorage storage; File Size366KB，35 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/; Environmental Compliance

Download Datasheet Parametric View All

GS8342S18BGD-300I Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	GS8342S18BGD-300I	-	-	View	Buy Now

GS8342S18BGD-300I Overview

Static random access memory 1.8 or 1.5V 2M x 18 36M

GS8342S18BGD-300I Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	GSI Technology
Parts packaging code	BGA
package instruction	LBGA, BGA165,11X15,40
Contacts	165
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Factory Lead Time	7 weeks 4 days
Maximum access time	0.45 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	300 MHz
I/O type	SEPARATE
JESD-30 code	R-PBGA-B165
length	15 mm
memory density	37748736 bit
Memory IC Type	DDR SRAM
memory width	18
Number of functions	1
Number of terminals	165
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA165,11X15,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.5/1.8,1.8 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum standby current	0.21 A
Minimum standby current	1.7 V
Maximum slew rate	0.54 mA
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	13 mm

Preview

Download Datasheet

View All

GS8342S08/09/18/36BD-400/350/333/300/250

165-Bump BGA

Commercial Temp

Industrial Temp

Features

• Simultaneous Read and Write SigmaSIO™ Interface

• JEDEC-standard pinout and package

• Dual Double Data Rate interface

• Byte Write controls sampled at data-in time

• DLL circuitry for wide output data valid window and future

frequency scaling

• Burst of 2 Read and Write

• 1.8 V +100/–100 mV core power supply

• 1.5 V or 1.8 V HSTL Interface

• Pipelined read operation

• Fully coherent read and write pipelines

• ZQ mode pin for programmable output drive strength

• IEEE 1149.1 JTAG-compliant Boundary Scan

• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package

• RoHS-compliant 165-bump BGA package available

36Mb SigmaSIO DDR-II

Burst of 2 SRAM

Clocking and Addressing Schemes

400 MHz–250 MHz

1.8 V V

1.8 V and 1.5 V I/O

A Burst of 2SigmaSIO DDR-II SRAM is a synchronous

device. It employs dual input register clock inputs, K and K.

The device also allows the user to manipulate the output

K clocks are routed internally to fire the output registers

instead. Each Burst of 2SigmaSIO DDR-II SRAM also

supplies Echo Clock outputs, CQ and CQ, which are

synchronized with read data output. When used in a source

synchronous clocking scheme, the Echo Clock outputs can be

used to fire input registers at the data’s destination.

Each internal read and write operation in a SigmaSIO DDR-II

B2 RAM is two times wider than the device I/O bus. An input

data bus de-multiplexer is used to accumulate incoming data

before it is simultaneously written to the memory array. An

output data multiplexer is used to capture the data produced

from a single memory array read and then route it to the

appropriate output drivers as needed. Therefore, the address

field of a SigmaSIO DDR-II B2 is always one address pin less

than the advertised index depth (e.g., the 4M x 8 has an 2M

addressable index).

SigmaSIO™ Family Overview

GS8342S08/09/18/36BD are built in compliance with the

SigmaSIO DDR-II SRAM pinout standard for Separate I/O

synchronous SRAMs. They are 37,748,736-bit (36Mb)

SRAMs. These are the first in a family of wide, very low

voltage HSTL I/O SRAMs designed to operate at the speeds

needed to implement economical high performance

networking systems.

Parameter Synopsis

-400

tKHKH

tKHQV

2.5 ns

0.45 ns

-350

2.86 ns

0.45 ns

-333

3.0 ns

0.45 ns

-300

3.3 ns

0.45 ns

-250

4.0 ns

0.45 ns

Rev: 1.02b 8/2017

1/35

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

Recommended Resources

Ultrasonic anti-collision circuit diagram

Optical signal conversion amplifier circuit using photosensitive diode

AC isolated power supply circuit with adjustable output voltage

STR40090 series internal circuit diagram

Exhaust fan automatic control circuit

DTl000/CM4200 type 4 1/2 digit digital multimeter circuit

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components