Arria 10 SoC SoM
Full Specifications
Arria 10 SoC FPGA
2x DDR4 SDRAM
up to 2400MT/s
System-on-Module usage
(Bottom connectors only)
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Dual ARM® Cortex
TM
-A9 MPCore
TM
processor-based hard processor system (HPS)
270 KLE or 660 KLE - F34 package (1152 pins)
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Commercial or Industrial temp
grade
32-bit wide bank for FPGA (2GB with Lite and Indus or 4GB with Turbo version)
32-bit wide bank for HPS (2GB with Lite and Indus or 4GB with Turbo version)
1x FMC LPC bottom connector with HPS signals and 14 transceivers (Bottom-
Right)
1x FMC HPC or LPC bottom connector depending on FPGA density (Bottom-Left):
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LPC bottom connector for 270 KLE density with 10 transceivers
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HPC bottom connector for 660 KLE density with 10 transceivers
In addition to the System-on-Module usage,
1x FMC LPC Top connector with 10 transceivers, 1.8V VITA 57.1 (Top-Right)
1x FMC HPC or LPC Top connector with 10 transceivers, 1.8V VITA 57.1 (Top-
Left):
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LPC Top connector for 270 KLE density
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HPC Top connector for 660 KLE density
24 transceivers speed of 11.3Gbps, most optimized use
80 LVDS bidirectional (or 160 Single ended) on FMC HPC connector (Top-Left/Bot-
Left)
32 LVDS bidirectional (or 64 Single ended) on FMC LPC connector (Top-Right/Bot-
Right)
USB 3.0 device connectivity using Cypress FX3 super speed controller (660 KLE
version)
USB OTG support connected to the HPS
Max10 CPLD for system control
10/100/1000 Base-T Ethernet interfaces connected to the HPS
I
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C, UART connected to the HPS. UART connected to System controller
Store U-boot, Kernel and RootFS (8GB on 270 KLE and 32GB on 660 KLE)
AS configuration supported with EPCQL512, remote upgrade and failsafe
PMBus support / cooling solution provided
With heat spreader and active heatsink
86mm x 95mm (3,4 x 3,8 inches)
VHDL test designs
Mechanical files : 3D DWF/STEP models and 2D drawing (upon request)
Guidelines for baseboard development (upon request)
Module informations (power, decoupling, signal features, S-parameters) (upon
request)
Carrier board usage
(Bottom and Top connectors)
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LVDS, LVCMOS & XCVR
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USB 3.0 Device
USB 2.0 Device/Host
System Controller
2x Gigabit Ethernet
Serial interfaces
Soft programming /eMMC
FPGA programming
Power Management
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Module dimensions
Deliverable
Ordering information
Version
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Module "Lite" version
(Commercial grade)
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Module "Turbo" version
(Commercial grade)
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Module "Indus" version
(Industrial grade)
Part number
RXCA10S027PF34-SOM00L
Comments
270 KLE,
speed grade -2,
Commercial temp grade,
Two banks
DDR4
/ by 32bit /
4GBytes
/ @1866MT/s, eMMC 8GBytes, Bottom
connectors
660 KLE, speed grade -1,
Commercial temp grade, Two banks
DDR4 / by 32bit /
8GBytes
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@2400MT/s, eMMC 32GBytes,
USB3.0, Bottom & Top connectors
660 KLE, speed grade -1,
Industrial temp grade,
Two banks DDR4
/ by 32bit /
4GBytes
/ @2400MT/s, eMMC 32Gbytes, USB3.0,
Bottom & Top connectors
RXCA10S066PF34-SOM00T
RXCA10S066PF34-SOM00I
Development Kit
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For the Development Kit, ask information about the Achilles Instant-DevKit (flyer available)
The Kit is using the “Turbo” version
ACHILLES
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All Rights Reserved
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June/v3.0
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