S75WS-N Based MCPs
Stacked Multi-Chip Product (MCP)
256 Megabit (16M x 16-bit) CMOS 1.8 Volt-only
Simultaneous Read/Write, Burst-mode Flash Memory
with 128 Mb (8M x 16-Bit) RAM Type 4 and
512 Mb (32M x 16-bit) Data Flash or 1 Gb ORNAND Flash
Data Sheet
PRELIMINARY
Notice to Readers:
This document indicates states the current technical
specifications regarding the Spansion product(s) described herein. The
Preliminary status of this document indicates that a product qualification has
been completed, and that initial production has begun. Due to the phases of
the manufacturing process that require maintaining efficiency and quality, this
document may be revised by subsequent versions or modifications due to
changes in technical specifications.
Publication Number
S75WS-N_02
Revision
A
Amendment
2
Issue Date
October 6, 2005
P r e l i m i n a r y
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise
readers of product information or intended specifications throughout the product life cycle, in-
cluding development, qualification, initial production, and full production. In all cases, however,
readers are encouraged to verify that they have the latest information before finalizing their de-
sign. The following descriptions of Spansion data sheet designations are presented here to high-
light their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more spe-
cific products, but has not committed any design to production. Information presented in a doc-
ument with this designation is likely to change, and in some cases, development on the product
may discontinue. Spansion LLC therefore places the following conditions upon Advance Informa-
tion content:
“This document contains information on one or more products under development at Spansion LLC. The
information is intended to help you evaluate this product. Do not design in this product without con-
tacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a
commitment to production has taken place. This designation covers several aspects of the prod-
uct life cycle, including product qualification, initial production, and the subsequent phases in the
manufacturing process that occur before full production is achieved. Changes to the technical
specifications presented in a Preliminary document should be expected while keeping these as-
pects of production under consideration. Spansion places the following conditions upon Prelimi-
nary content:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. The Preliminary status of this document indicates that product qualification has been completed,
and that initial production has begun. Due to the phases of the manufacturing process that require
maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-
tions due to changes in technical specifications.”
Combination
Some data sheets will contain a combination of products with different designations (Advance In-
formation, Preliminary, or Full Production). This type of document will distinguish these products
and their designations wherever necessary, typically on the first page, the ordering information
page, and pages with DC Characteristics table and AC Erase and Program table (in the table
notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal
changes are expected, the Preliminary designation is removed from the data sheet. Nominal
changes may include those affecting the number of ordering part numbers available, such as the
addition or deletion of a speed option, temperature range, package type, or V
IO
range. Changes
may also include those needed to clarify a description or to correct a typographical error or incor-
rect specification. Spansion LLC applies the following conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. Spansion LLC deems the products to have been in sufficient production volume such that sub-
sequent versions of this document are not expected to change. However, typographical or specification
corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local AMD or Fujitsu
sales office.
ii
S75WS-N Based MCPs
S75WS-N_02_A2 October 6, 2005
S75WS-N Based MCPs
Stacked Multi-Chip Product (MCP)
256 Megabit (16M x 16-bit) CMOS 1.8 Volt-only
Simultaneous Read/Write, Burst-mode Flash Memory with
128 Mb (8M x 16-Bit) RAM Type 4 and
512 Mb (32M x 16-bit) Data Flash or 1Gb ORNAND Flash
Data Sheet
PRELIMINARY
General Description
The S75WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists
of the following items:
One or more S29WS-N code Flash
RAM Type 4
One or more S29WS-N data Flash, or one or more S30MS-P ORNAND Flash
The products covered by this document are listed in the table below:
Code Flash
Density
256 Mb
S75WS256NDF
S75WS256NEG
128 Mb
RAM
Density
256 Mb
NOR Data Flash
Density
512 Mb
ORNAND Data Flash
Density
1024 Mb
Device
Distinctive Characteristics
MCP Features
Power supply voltage of 1.7 V to 1.95 V
High Performance
— 54 MHz, 66 Mhz, 80 MHz
Packages
— 9 x 12 mm 84 ball FBGA
— 11 x 13 mm 115 ball FBGA
Operating Temperature
— Wireless, –25°C to +85°C
Publication Number
S75WS-N_02
Revision
A
Amendment
2
Issue Date
October 6, 2005
P r e l i m i n a r y
Contents
S75WS-N Based MCPs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i
1
2
3
4
5
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 NOR Flash + pSRAM + ORNAND Flash MCPs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Input/Output Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
MCP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams/Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
5.1 Special Handling Instructions for FBGA Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2 Connection Diagram – NOR Flash & 1.8 V RAM Type 4 Based Pinout, 9 x 12 mm . . . . . . . . . . . . . . . . . . . . . . . 8
5.3 Connection Diagram – ORNAND-Based Pinout, 11 x 13 mm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.4 Physical Dimensions – FEA084 – Fine Pitch Ball Grid Array 9 x 12 mm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
5.5 Physical Dimensions – FND115 – Fine Pitch Ball Grid Array 11 x 13 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
MCP Revisions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 2.1
Table 2.2
Table 3.1
Table 3.2
MCP Configurations and Valid Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
ORNAND Configurations and Valid Combinations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
NOR Flash and RAM Input/Output Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ORNAND Flash Input/Output Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Tables
6
Figures
Figure 4.1
Figure 4.2
MCP Block Diagram 1 ......................................................................................................................... 6
ORNAND Block Diagram ...................................................................................................................... 7
2
S75WS-N Based MCPs
S75WS-N_02_A2 October 6, 2005
Embedded System
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