S72WS-N Based MCP/PoP Products
1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus
256/512 Mb Simultaneous Read/Write, Burst Mode Flash Memory
512 Mb NAND Flash
1024 Mb NAND Interface ORNAND Flash Memory on Bus 1
512/256/128 Mb (8M/4M/2M x 16-bit x 4 Banks) Mobile SDRAM on Bus 2
Data Sheet
ADVANCE
INFORMATION
Notice to Readers:
This document states the current technical specifications
regarding the Spansion product(s) described herein. Each product described
herein may be designated as Advance Information, Preliminary, or Full
Production. See
“Notice On Data Sheet Designations”
for definitions.
Publication Number
S72WS-N_00
Revision
A
Amendment
8
Issue Date
June 1, 2006
A d v a n c e
I n f o r m a t i o n
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise
readers of product information or intended specifications throughout the product life cycle, includ-
ing development, qualification, initial production, and full production. In all cases, however,
readers are encouraged to verify that they have the latest information before finalizing their de-
sign. The following descriptions of Spansion data sheet designations are presented here to
highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more spe-
cific products, but has not committed any design to production. Information presented in a
document with this designation is likely to change, and in some cases, development on the prod-
uct may discontinue. Spansion LLC therefore places the following conditions upon Advance
Information content:
“This document contains information on one or more products under development at Spansion LLC. The
information is intended to help you evaluate this product. Do not design in this product without con-
tacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a
commitment to production has taken place. This designation covers several aspects of the product
life cycle, including product qualification, initial production, and the subsequent phases in the
manufacturing process that occur before full production is achieved. Changes to the technical
specifications presented in a Preliminary document should be expected while keeping these as-
pects of production under consideration. Spansion places the following conditions upon
Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. The Preliminary status of this document indicates that product qualification has been completed,
and that initial production has begun. Due to the phases of the manufacturing process that require
maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-
tions due to changes in technical specifications.”
Combination
Some data sheets will contain a combination of products with different designations (Advance In-
formation, Preliminary, or Full Production). This type of document will distinguish these products
and their designations wherever necessary, typically on the first page, the ordering information
page, and pages with the DC Characteristics table and the AC Erase and Program table (in the
table notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal
changes are expected, the Preliminary designation is removed from the data sheet. Nominal
changes may include those affecting the number of ordering part numbers available, such as the
addition or deletion of a speed option, temperature range, package type, or V
IO
range. Changes
may also include those needed to clarify a description or to correct a typographical error or incor-
rect specification. Spansion LLC applies the following conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. Spansion LLC deems the products to have been in sufficient production volume such that sub-
sequent versions of this document are not expected to change. However, typographical or specification
corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local AMD or Fujitsu
sales office.
ii
S72WS-N Based MCP/PoP Products
S72WS-N_00_A8 June 1, 2006
S72WS-N based MCP/PoP Products
1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus
256/512 Mb Simultaneous Read/Write, Burst Mode Flash Memory
512 Mb NAND Flash
1024 Mb NAND Interface ORNAND Flash Memory on Bus 1
512/256/128 Mb (8M/4M/2M x 16-bit x 4 Banks) Mobile SDRAM on Bus 2
Data Sheet
ADVANCE
INFORMATION
Distinctive Characteristics
MCP Features
Power supply voltage of 1.7 to 1.95V
High Performance
Flash access time: 80 ns for NOR Flash, 25 ns for ORNAND Flash
Flash burst frequencies: 54 MHz, 66MHz, 80MHz
Mobile SDRAM burst frequency: 104 MHz, 133 MHz (DDR)
Package:
— 9.0 x 12.0 mm MCP BGA
— 11.0 x 13.0 mm MCP BGA
— 15.0 x 15.0 x 1.2 mm MCP Package-on-Package (PoP)
Operating Temperature
— –25°C to +85°C (wireless)
General Description
The S72WS series is a product line of stacked Multi-Chip Product (MCP) packages and consists of:
One or two NOR flash memory dies
One NAND Interface ORNAND die
Separate bus for one or more Mobile SDRAM die
The products covered by this document are listed in the table below.
Device
S72WS256ND0
S72WS256NDE
S72WS256NEE
S72WS512NFG
S72WS512NEG
S72WS512NEF
S72WS512NFF
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
NOR Flash Density
512Mb
256Mb
X
128Mb
NAND Flash Density
1024Mb
512Mb
SDRAM Density
512Mb
256Mb
128Mb
X
X
Note:
For a list of PoP OPNs, please contact the local sales representative or refer to the
Ordering In-
formation
valid combinations tables.
For detailed specifications, please refer to the individual data sheets.
Document
S29WS256N
S30MS01GP/512P
128 Mb Mobile SDRAM Type 1
128 Mb Mobile SDRAM Type 2
128 Mb Mobile DDR-DRAM Type 5
256 Mb Mobile SDRAM Type 2
512 Mb Mobile DDR-DRAM Type 1
512 Mb Mobile SDRAM Type 4
512 Mb NAND Type 1
512 Mb Mobile DDR-DRAM Type 5
512 Mb Mobile DDR-DRAM Type 2
Publication Identification Number (PID)
S29WS-N_00
S30MS-P_00
SDRAM_01
SDRAM_05
SDRAM_07
SDRAM_05
SDRAM_09
SDRAM_06
NAND_01
DRAM_04
DRAM_05
Publication Number
S72WS-N_00
Revision
A
Amendment
8
Issue Date
June 1, 2006
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice
A d v a n c e
I n f o r m a t i o n
Table of Contents
S72WS-N Based MCP/PoP Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i
1
2
3
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 NOR Flash + DRAM Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 NOR Flash + ORNAND Flash + DRAM Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
MCP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 NOR Flash + ORNAND Flash + DRAM Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 2 x 256Mb NOR Flash with 256Mb SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.2 2 x 256Mb NOR Flash with 128Mb SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 256Mb NOR Flash with 128Mb SDR/DDR-DRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4 512 Mb NOR Flash with 1024-Mb ORNAND on Bus 1 and 512 or 256-Mb SDRAM on Bus 2 . . . . . . . . . . . . . . . 9
3.4.1 x16 ORNAND-based MCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.5 512Mb NOR Flash with 1024-Mb ORNAND on Bus 1 and 512 or 256 Mb SDRAM on Bus 2 . . . . . . . . . . . . . . . .10
3.5.1 x8 ORNAND-based MCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3.6 512Mb NOR Flash with 512-Mb NAND on Bus 1 and 512-Mb SDRAM on Bus 2 . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.6.1 x16 ORNAND-based MCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.6.2 Connection Diagram for 15 x 15 Package-on-Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.7 Lookahead Diagram on Split Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.8 NOR Flash and DRAM Input/Output Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
3.8.1 ORNAND Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.1 TLD137—137-ball Fine-Pitch Ball Grid Array (FBGA) 12 x 9 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.2 FEA137—137-ball Fine-Pitch Ball Grid Array (FBGA) 13 x 11 mm Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.3 FVD137—137-ball Fine-Pitch Ball Grid Array (FBGA) 11 x 13 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.4 BWA160—160-ball Fine-Pitch Ball Grid Array (FBGA) 15 x 15 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.5 BWB160—160-ball Fine-Pitch Ball Grid Array (FBGA) 15 x 15 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.6 BTA160—160-ball Fine-Pitch Ball Grid Array (FBGA) 15 x 15 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.7 ALH160—160-ball Fine-Pitch Ball Grid Array (FBGA) 15 x 15 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
MCP Revision Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4
5
6
2
S72WS-N Based MCP/PoP Products
S72WS-N_00_A8 June 1, 2006
A d v a n c e
I n f o r m a t i o n
1
1.1
Product Selector Guide
NOR Flash + DRAM Products
Device-Model#
S72WS256ND0BAWB7
S72WS256ND0BAWBB
S72WS256NDEBAWU7
S72WS256NDEBAWUB
S72WS256NEEBAWU7
S72WS256NEEBAWUB
S72WS256ND0BFWB7
S72WS256ND0BFWBB
S72WS256NDEBFWU7
S72WS256NDEBFWUB
S72WS256NEEBFWU7
S72WS256NEEBFWUB
S72WS256ND0KFWD3
256 Mb
S72WS256ND0BFW93
66 MHz
128
256 Mb
256 Mb
54 MHz
256
133 MHz
(DDR)
133 MHz
(DDR)
256 Mb
—
54 MHz
256 Mb
256 Mb
54 MHz
256
128
128
104 MHz
104 MHz
Flash
Density
(Code)
256 Mb
Flash
Density
(Data)
—
Burst
Speed
(MHz)
54 MHz
SDRAM
Density
128
128
104 MHz
SDRAM burst
Speed (MHz)
104 MHz
DRAM
Supplier
1
2
1
2
1
2
1
2
1
2
1
2
5
sector
unprotected
sector
unprotected
15x15x1.25
9x12x1.2
sector
unprotected
9x12x1.4
sector
unprotected
9x12x1.2
sector
unprotected
9x12x1.4
DYB
sector
unprotected
Package
9x12x1.2
June 1, 2006 S72WS-N_00_A8
S72WS-N Based MCP/PoP Products
3
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