S72WS512NEGBAW4Y0 datasheet, PDF

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S72WS512NEGBAW4Y0: DescriptionBased MCP/PoP Products; Categorystorage storage; File Size799KB，30 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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S72WS512NEGBAW4Y0 Overview

Based MCP/PoP Products

S72WS512NEGBAW4Y0 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	137
Reach Compliance Code	compli
Other features	MOBILE SDRAM IS ORGANIZED AS 4M X 16BIT X 4 BANKS; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 code	R-PBGA-B137
JESD-609 code	e0
length	13 mm
memory density	536870912 bi
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	137
word count	33554432 words
character code	32000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	32MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11 mm
Base Number Matches	1

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S72WS-N Based MCP/PoP Products

1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus

256/512 Mb Simultaneous Read/Write, Burst Mode Flash Memory

512 Mb NAND Flash

1024 Mb NAND Interface ORNAND Flash Memory on Bus 1

512/256/128 Mb (8M/4M/2M x 16-bit x 4 Banks) Mobile SDRAM on Bus 2

Data Sheet

ADVANCE

INFORMATION

Notice to Readers:

This document states the current technical specifications

regarding the Spansion product(s) described herein. Each product described

herein may be designated as Advance Information, Preliminary, or Full

Production. See

“Notice On Data Sheet Designations”

for definitions.

Publication Number

S72WS-N_00

Revision

Amendment

Issue Date

June 1, 2006

A d v a n c e

I n f o r m a t i o n

Notice On Data Sheet Designations

Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise

readers of product information or intended specifications throughout the product life cycle, includ-

ing development, qualification, initial production, and full production. In all cases, however,

readers are encouraged to verify that they have the latest information before finalizing their de-

sign. The following descriptions of Spansion data sheet designations are presented here to

highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion LLC is developing one or more spe-

cific products, but has not committed any design to production. Information presented in a

document with this designation is likely to change, and in some cases, development on the prod-

uct may discontinue. Spansion LLC therefore places the following conditions upon Advance

Information content:

“This document contains information on one or more products under development at Spansion LLC. The

information is intended to help you evaluate this product. Do not design in this product without con-

tacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a

commitment to production has taken place. This designation covers several aspects of the product

life cycle, including product qualification, initial production, and the subsequent phases in the

manufacturing process that occur before full production is achieved. Changes to the technical

specifications presented in a Preliminary document should be expected while keeping these as-

pects of production under consideration. Spansion places the following conditions upon

Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. The Preliminary status of this document indicates that product qualification has been completed,

and that initial production has begun. Due to the phases of the manufacturing process that require

maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-

tions due to changes in technical specifications.”

Combination

Some data sheets will contain a combination of products with different designations (Advance In-

formation, Preliminary, or Full Production). This type of document will distinguish these products

and their designations wherever necessary, typically on the first page, the ordering information

page, and pages with the DC Characteristics table and the AC Erase and Program table (in the

table notes). The disclaimer on the first page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal

changes are expected, the Preliminary designation is removed from the data sheet. Nominal

changes may include those affecting the number of ordering part numbers available, such as the

addition or deletion of a speed option, temperature range, package type, or V

range. Changes

may also include those needed to clarify a description or to correct a typographical error or incor-

rect specification. Spansion LLC applies the following conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. Spansion LLC deems the products to have been in sufficient production volume such that sub-

sequent versions of this document are not expected to change. However, typographical or specification

corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local AMD or Fujitsu

sales office.

S72WS-N Based MCP/PoP Products

S72WS-N_00_A8 June 1, 2006

A d v a n c e

I n f o r m a t i o n

Table of Contents

S72WS-N Based MCP/PoP Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1 NOR Flash + DRAM Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2 NOR Flash + ORNAND Flash + DRAM Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

MCP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1 NOR Flash + ORNAND Flash + DRAM Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3.1 2 x 256Mb NOR Flash with 256Mb SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3.2 2 x 256Mb NOR Flash with 128Mb SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.3 256Mb NOR Flash with 128Mb SDR/DDR-DRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.4 512 Mb NOR Flash with 1024-Mb ORNAND on Bus 1 and 512 or 256-Mb SDRAM on Bus 2 . . . . . . . . . . . . . . . 9

3.4.1 x16 ORNAND-based MCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.5 512Mb NOR Flash with 1024-Mb ORNAND on Bus 1 and 512 or 256 Mb SDRAM on Bus 2 . . . . . . . . . . . . . . . .10

3.5.1 x8 ORNAND-based MCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.6 512Mb NOR Flash with 512-Mb NAND on Bus 1 and 512-Mb SDRAM on Bus 2 . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.6.1 x16 ORNAND-based MCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.6.2 Connection Diagram for 15 x 15 Package-on-Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

3.7 Lookahead Diagram on Split Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3.8 NOR Flash and DRAM Input/Output Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

3.8.1 ORNAND Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.1 TLD137—137-ball Fine-Pitch Ball Grid Array (FBGA) 12 x 9 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.2 FEA137—137-ball Fine-Pitch Ball Grid Array (FBGA) 13 x 11 mm Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

5.3 FVD137—137-ball Fine-Pitch Ball Grid Array (FBGA) 11 x 13 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.4 BWA160—160-ball Fine-Pitch Ball Grid Array (FBGA) 15 x 15 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.5 BWB160—160-ball Fine-Pitch Ball Grid Array (FBGA) 15 x 15 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5.6 BTA160—160-ball Fine-Pitch Ball Grid Array (FBGA) 15 x 15 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.7 ALH160—160-ball Fine-Pitch Ball Grid Array (FBGA) 15 x 15 mm Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

MCP Revision Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

S72WS-N Based MCP/PoP Products

S72WS-N_00_A8 June 1, 2006

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