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MXSMCG150ATR

Description
1500W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-215AB, PLASTIC PACKAGE-2
Categorydiode   
File Size187KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

MXSMCG150ATR Overview

1500W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-215AB, PLASTIC PACKAGE-2

MXSMCG150ATR Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeDO-215AB
package instructionR-PDSO-G2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Other featuresHIGH RELIABILITY
Maximum breakdown voltage185 V
Minimum breakdown voltage167 V
Breakdown voltage nominal value176 V
Maximum clamping voltage243 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 codeDO-215AB
JESD-30 codeR-PDSO-G2
JESD-609 codee0
Humidity sensitivity level1
Maximum non-repetitive peak reverse power dissipation1500 W
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation1.56 W
Certification statusNot Qualified
GuidelineMIL-19500
Maximum repetitive peak reverse voltage150 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
Website: http://www.microsemi.com
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
SURFACE MOUNT 1500 Watt
Transient Voltage Suppressor
- High Reliability controlled devices
- Unidirectional (A) and Bidirectional (CA) construction
- Available in both J-bend and Gull-wing terminations
- Selections for 5.0 to 170 V standoff voltages (V
WM
)
LEVELS
M, MA, MX, MXL
DEVICES
MSMCJ5.0A thru MSMCJ170CA, e3
and MSMCG5.0A thru MSMCG170CA, e3
FEATURES
High reliability controlled devices with fabrication and assembly lot traceability
100 % surge tested devices
Optional upscreening available by replacing the M prefix with MA, MX or MXL prefixes.
These prefixes specify various screening and conformance inspection options based on
MIL-PRF-19500. Refer to
MicroNote 129
for more details on the screening options.
Axial-lead equivalent packages for thru-hole mounting available as 1.5KE6.8A to
1.5KE200CA or 1N6267 thru 1N6303A and 1N5908 (consult factory for other surface mount
options).
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B
RoHS compliant devices available by adding an “e3” suffix
3σ lot norm screening performed on Standby Current I
D
Refer to table below
for dimensions
APPLICATIONS / BENEFITS
Protection from switching transients and induced RF
Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4
Secondary lightening protection per IEC 61000-4-5 with 42 Ohms source impedance:
o
Class 1: MSMC5.0A to MSMC170CA
o
Class 2: MSMC5.0A to MSMC150CA
o
Class 3: MSMC5.0A to MSMC75CA
o
Class 4: MSMC5.0A to MSMC36CA
Secondary lightening protection per IEC 61000-4-5 with 12 Ohms source impedance:
o
Class 1: MSMC5.0A to MSMC90CA
o
Class 2: MSMC5.0A to MSMC45CA
o
Class 3: MSMC5.0A to MSMC24CA
o
Class 4: MSMC5.0A to MSMC11CA
Secondary lightening protection per IEC 61000-4-5 with 2 Ohms source impedance:
o
Class 2: MSMC5.0A to MSMC22CA
o
Class 3: MSMC5.0A to MSMC10CA
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25 ºC: 1500 watts at 10/1000
μs
(also see Figures 1,2, and
3) with impulse repetition rate (duty factor) of 0.01 % or less
t
clamping
(0 volts to V
BR
min.): < 100 ps theoretical for unidirectional and <5 ns for bidirectional
Operating and Storage temperature: -65 ºC to +150 ºC
Thermal resistance: 20 ºC/W junction to lead, or 80 ºC/W junction to ambient when mounted
on FR4 PC board (1oz Cu) with recommended footprint (see page 2)
Steady-State Power dissipation: 6 watts at TL = 30 ºC, or 1.56 watts at TA = 25 ºC when
mounted on FR4 PC board with recommended footprint (see page 2)
Forward Surge: 200 Amps peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional
only)
Solder temperatures: 260 ºC for 10 s (maximum)
RF01001 Rev B, Sept 2011
High Reliability Product Group
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