SJA1105P/Q/R/S
Rev. 1 — 1 November 2017
Objective short data sheet
1
Features and benefits
1.1 General features
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5-port store and forward architecture
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Each port individually configurable for 10/100 Mbit/s when operated as MII/RMII and
10/100/1000 Mbit/s when operated as RGMII or SGMII
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Independent I/O voltage domains: selectable 1.8/2.5/3.3 V operation for MII/RMII/
RGMII; selectable 1.8/2.5/3.3 V for host interfacing; 1.2 V core voltage domains
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Small footprint: LFBGA159 (12 mm × 12 mm) package
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Automotive Grade 2 ambient operating temperature: -40 °C to +105 °C
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Automotive product qualification in accordance with AEC-Q100 Rev-H
1.2 Ethernet switching and AVB features
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IEEE 802.3 compliant
IEEE 802.1Q defined tag support
4096 VLANs supported
Priority-based QoS handling as specified in IEEE 802.1Q
Hardware support for IEEE 802.1AS timestamping and IEEE 802.1Qav AVB traffic
shaping
16 credit-based shapers available according to IEEE 802.1Qav; shapers can be freely
allocated to any priority queue on a per port basis
Support for SR Class A, Class B, and Class C traffic
IEEE 1588v2 one-step sync forwarding in hardware
Statistics for dropped frames and buffer load
1.3 Interface features
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MII/RMII for interfacing with 10/100 Mbit/s PHYs/host processor (Fast Ethernet)
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RGMII for interfacing with 10/100/1000 Mbit/s PHYs/host processor/cascading (Gigabit
Ethernet); internal delay for interface connection without external delay components
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SGMII for interfacing with 10/100/1000 Mbit/s PHYs/host processor/cascading
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MAC and PHY modes for interfacing (MII/RMII/RGMII/SGMII) directly with another
switch or host processor
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Programmable drive strength for MII/RMII/RGMII interfaces
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SPI for host processor access
NXP Semiconductors
SJA1105P/Q/R/S
4
Legal information
4.1 Data sheet status
Document status
[1][2]
Product status
Development
Qualification
Production
[3]
Definition
This document contains data from the objective specification for product
development.
This document contains data from the preliminary specification.
This document contains the product specification.
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
Applications
— Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values
— Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale
— NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license
— Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Suitability for use in automotive applications
— This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
© NXP B.V. 2017. All rights reserved.
4.2 Definitions
Draft
— The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet
— A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification
— The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
4.3 Disclaimers
Limited warranty and liability
— Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes
— NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SJA1105PQRS_SDS
All information provided in this document is subject to legal disclaimers.
Objective short data sheet
Rev. 1 — 1 November 2017
4/6
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