This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S71WS-N_00
Revision
A
Amendment
6
Issue Date
July 19, 2006
Data
Sheet
(Advan ce
Infor m a tio n)
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
ii
S71WS-N
S71WS-N_00_A6 July 19, 2006
S71WS-N
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
™
Data Sheet
(Advance Information)
Features
Power supply voltage of 1.7 V to 1.95 V
Burst Speed: 54 MHz, 66 MHz, 80 MHz
Package
– 8 x 11.6 mm, 9 x 12 mm
Operating Temperature
– Wireless, –25° C to +85° C
General Description
The S71WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of the following items:
One or more flash memory die (for the S71WS512N, two S29WS256N devices are used)
CellularRAM Type 2 pSRAM
The products covered by this document are listed in the table below. For details about their specifications, please refer to the
individual constituent datasheet for further details.
pSRAM
Flash Density
S29WS128N
S29WS256N
S29WS512N
32 Mb
S71WS128NB0
64 Mb
S71WS128NC0
S71WS256NC0
S71WS512NC0
S71WS256ND0
S71WS512ND0
128 Mb
For detailed specifications, please refer to the individual data sheets.
Document
S29WS-N
128 M CellularRAM Type 2
32 M CellularRAM Type 2
64 M CellularRAM Type 2
Publication Identification Number (PID)
S29WS-N_00
Cellram_04
Cellram_06
Cellram_07
Publication Number
S71WS-N_00
Revision
A
Amendment
6
Issue Date
July 19, 2006
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
(Advan ce
Infor m a tio n)
1.
Product Selector Guide
Model
Numbers
AK
54
AP
AJ
S71WS128NB0
AN
AH
80
AM
AK
54
AP
AJ
S71WS128NC0
AN
AH
80
AM
AK
54
AP
AJ
S71WS256NC0
AN
AH
80
AM
WS256N
YK
54
YP
YJ
S71WS256ND0
YN
YH
80
YM
AK
54
AP
TJ
S71WS512NC0
TN
TH
80
TM
WS512N
EK
54
EP
EJ
S71WS512ND0
EN
EH
80
EM
Note:
0 (Protected), 1 (Unprotected [Default State])
80
1
128
66
66
1
0
54
1
0
2
9x12x1.4
0
80
1
64
66
66
1
11.6x8.0x1.4
0
2
54
1
0
2
80
1
0
2
11.6x8.0x1.2
128
66
66
1
0
54
1
0
2
9x12x1.2
0
80
1
64
66
66
1
0
2
54
1
0
2
11.6x8.0x1.2
80
1
0
2
WS128N
64
66
66
1
0
54
1
0
2
8.0X11.6X1.2
80
1
0
WS128N
32
66
66
1
0
54
1
0
2
8.0X11.6X1.2
pSRAM
Density
(Mb)
Flash
Speed
(MHz)
pSRAM
Speed
(MHz)
DYB
Power-Up
State
(See
Note)
0
pSRAM
(Cellular RAM)
Supplier
Package
(mm)
Device
Flash
2
S71WS-N
S71WS-N_00_A6 July 19, 2006
D at a
S hee t
(Adva nce
In for m ation)
2.
Ordering Information
The order number is formed by a valid combinations of the following:
S71WS
256
N
C
0
BA
W
A
K
0
Packing Type
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
RAM Supplier, DYB Power Up, Speed Combinations
K = 2 = CellularRAM 2, 0, 54 MHz
P = 2 = CellularRAM 2, 1, 54 MHz
J = 2 = CellularRAM 2, 0, 66 MHz
N = 2 = CellularRAM 2, 1, 66 MHz
H = 2 = CellularRAM 2, 0, 80 MHz
M = 2 = CellularRAM 2, 1, 80 MHz
Package Modifier
A = 8x11.6x1.2 mm, 84-ball FBGA
T = 8x11.6x1.4 mm, 84-ball FBGA
E = 9x12x1.4 mm, 84-ball FBGA
Y = 9x12x1.2 mm, 84-ball FBGA
Temperature Range
W = Wireless (-25°C to +85°C)
Package Type
BA = Very Thin FIne-Pitch BGA, Lead (Pb)-free Compliant Package
BF = Very Thin FIne-Pitch BGA, Lead (Pb)-free Package
This circuit is to restart the power bank from sleep mode. After I added the circuit at the back end, the power bank voltage in sleep mode will be pulled down to 0.8V. This circuit will not work. Plea...
When I was looking at 432 programs recently, I suddenly found a problem. For example, when calling a library function, such as MAP_WDT_A_holdTimer(); this statement is a macro definition, pointing to ...
You have all tested the DC characteristics and dynamic characteristics. Let me tell you my feelings. The test board is quite small. I found a resistor on the back. After measurement, the resistance va...
[i=s]This post was last edited by qwqwqw2088 on 2020-4-6 17:37[/i]This website has relevant information about TI's Da Vinci series, including schematics and Gerber files of related development boards....
If you need it, please contact me. The deadline for free service is 2009.6.28 (I have no time because I am at work) [[i] This post was last edited by sjl105105 on 2009-6-26 12:44 [/i]]...
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Administration (USPTO) for a patent for a remote vehicle control system that may be used in future ...[Details]
In the electronics manufacturing industry, surface mount technology (SMT) placement machines are core equipment for production lines. However, with many different models available on the market, ch...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
1. Fault phenomenon and cause analysis
1. During the operation of the equipment, the expansion sleeve is subjected to a large torque, and the mating surfaces of the shaft and the sleeve move...[Details]
Chinese characters are extensive and profound, and there are many different names for ESD tubes. How many of them do you know?
As far as I know, ESD diodes are currently known as ESD p...[Details]
In the field of communications power supplies, AC/DC rectifier power supplies are called primary power supplies or basic power supplies, while DC/DC converters are called secondary power supplies. ...[Details]
When American cartoonist Chester Gould sketched the watch on Dick Tracy's wrist, he had no idea that science fiction would become reality 70 years later. As a comic strip artist, Gould imagined fut...[Details]
1. Introduction
In 2015, Apple's new MacBook and Apple Watch both featured force-sensing technology, which Apple calls Force Touch. Each time a user presses the touchpad, the device not only p...[Details]
01. Introduction
As in-vehicle networks migrate from the CAN
bus
to
Ethernet
, traditional millisecond-level synchronization accuracy can no longer meet the requirements of mul...[Details]
On August 20, Huawei Device announced that the all-new M7 is the first to feature an in-cabin laser vision solution. This solution offers enhanced active safety capabilities compared to primary vis...[Details]
The Waveshare ESP32-P4-ETH is a compact ESP32-P4 development board with Ethernet and PoE support. It looks very similar to the Olimex ESP32-P4-DevKit, minus the pUEXT connector. However, we've also...[Details]
Charge your electric car for just six minutes and you'll get 1,000 kilometers! This isn't just a scene from a science fiction film, but a reality made possible by Guoxuan High-Tech's Jinshi solid-s...[Details]
Motor potting compound is a high-performance sealing material widely used for motor encapsulation and insulation. It is essential for motor protection and packaging. Its ideal moisture and water re...[Details]
Fast charging is a method and means of quickly replenishing a vehicle's power. It is the core and most important part of electric vehicles. Speaking of fast charging, everyone is familiar with it. ...[Details]
Compared to gasoline-powered vehicles, electric vehicles have a simpler structure, allowing for greater flexibility in the layout of various components. While electric and gasoline-powered vehicles...[Details]