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PHT2010E2084DGTE

Description
Fixed Resistor, Thin Film, 0.2W, 2080000ohm, 300V, 0.5% +/-Tol, 30ppm/Cel, Surface Mount, 2010, CHIP
CategoryPassive components    The resistor   
File Size117KB,6 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

PHT2010E2084DGTE Overview

Fixed Resistor, Thin Film, 0.2W, 2080000ohm, 300V, 0.5% +/-Tol, 30ppm/Cel, Surface Mount, 2010, CHIP

PHT2010E2084DGTE Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid145010785727
package instructionCHIP
Reach Compliance Codeunknown
Country Of OriginFrance
ECCN codeEAR99
YTEOL7.6
Other featuresANTI-SULFUR
structureRectangular
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature230 °C
Minimum operating temperature-55 °C
Package height0.4 mm
Package length5.08 mm
Package formSMT
Package width2.54 mm
method of packingTR, PLASTIC
Rated power dissipation(P)0.2 W
Rated temperature215 °C
resistance2080000 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyTHIN FILM
Temperature Coefficient30 ppm/°C
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage300 V
PHT
www.vishay.com
Vishay Sfernice
High Stability - High Temperature (230 °C)
Thin Film Wraparound Chip Resistors, Sulfur Resistant
FEATURES
• Operating temperature range:
-55 °C; +215 °C
• Storage temperature: -55 °C; +230 °C
• Gold terminations (< 1 μm thick)
• 5 sizes available (0402, 0603, 0805, 1206,
2010); other sizes upon request
• Temperature coefficient down to 15 ppm
(-55 °C; +215 °C)
• Tolerance down to 0.05 %
• Load life stability: 0.35 % max. after 2000 h at 220 °C
(ambient) at Pn
• Shelf life stability: 0.7 % typ. (1 % max.) after 15 000 h at
230 °C
• SMD wraparound
• TCR remains constant after long term storage at 230 °C
(15 000 h)
• Sulfur resistant (per ASTM B809-95 humid vapor test)
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
DESIGN SUPPORT TOOLS
Models
Available
click logo to get started
INTRODUCTION
For applications such as down hole applications, the need
for parts able to withstand very severe conditions
(temperature as high as 215 °C powered or up to 230 °C
un-powered) has leaded Vishay Sfernice to push out the
limit of the thin film technology.
Designers might read the application note: Power
Dissipation Considerations in High Precision Vishay
Sfernice Thin Film Chip Resistors and Arrays
(P, PRA etc…) (High Temperature Application)
www.vishay.com/doc?53047
in conjunction with this
datasheet to help them to properly design their PCBs and
get the best performances of the PHT.
Vishay Sfernice R&D engineers will be willing to support any
customer design considerations.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
PHT0402
PHT0603
PHT0805
PHT1206
PHT2010
SIZE
0402
0603
0805
1206
2010
RESISTANCE
RANGE
10 to 130K
10 to 320K
10 to 720K
10 to 2.7M
10 to 7.5M
RATED POWER
(1)(2)
P
215 °C
W
0.0189
0.0375
0.06
0.1
0.2
(4)
LIMITING ELEMENT
VOLTAGE
V
50
75
150
200
300
TOLERANCE
(2)
±%
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
0.05, 0.1, 0.5, 1
TEMPERATURE
COEFFICIENT
(3)
± ppm/°C
10, 15, 25, 30, 50, 55
10, 15, 25, 30, 50, 55
10, 15, 25, 30, 50, 55
10, 15, 25, 30, 50, 55
10, 15, 25, 30, 50, 55
Notes
(1)
For power handling improvement, please refer to application note 53047: “Power Dissipation Considerations in High Precision Vishay
Sfernice Thin Film Chip Resistors and Arrays (High Temperature Applications)”
www.vishay.com/doc?53047
and consult Vishay Sfernice
(2)
See Table 2 on next page
(3)
See Table 1 on next page
(4)
It is possible to dissipate up to 0.3 W, but there will be an additional drift of 0.1 % after load life
CLIMATIC SPECIFICATIONS
Operating temperature range
Storage temperature range
-55 °C; +215 °C
-55 °C; +230 °C
MECHANICAL SPECIFICATIONS
Substrate
Resistive Element
Passivation
Protection
Terminations
Alumina
Nichrome (NiCr)
Silicon nitride (Si
3
N
4
)
Epoxy + silicone
Gold (< 1 μm) over nickel barrier
PERFORMANCE VS. HUMID SULFUR VAPOR
Test conditions
Test results
Revision: 03-Jan-2019
50 °C ± 2 °C, 85 % ± 4 % RH,
exposure time 500 h
Resistance drift < (0.05 %
R
+ 0.05
),
no corrosion products observed
Note
• For other terminations, please consult
Document Number: 53050
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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