82635DSASMDLPRQ datasheet, PDF

Datasheet> All Categories > Embedded solution> Video module> 82635DSASMDLPRQ

82635DSASMDLPRQ: DescriptionVideo module Real Sense Vision Processor D4 card; CategoryEmbedded solution Video module; File Size4MB，120 Pages; ManufacturerIntel; Websitehttp://www.intel.com/; Environmental Compliance

Download Datasheet Parametric View All

82635DSASMDLPRQ Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	82635DSASMDLPRQ	-	-	View	Buy Now

82635DSASMDLPRQ Overview

Video module Real Sense Vision Processor D4 card

82635DSASMDLPRQ Parametric

Parameter Name	Attribute value
Maker	Intel
Product Category	Video module
product	Camera Modules
Supported video formats	RGB
frames per second	90 fps
Display resolution—pixels	1920 x 1080
Interface Type	CSI, GPIO, I2C, SPI, USB
Working power voltage	5 V
Maximum operating temperature	+ 35 C
size	89.7 mm x 10 mm x 4.7 mm
Description/Function	Real sense vision processor D4 card
series	RealSense D400
Minimum operating temperature	0 C
Working power current	700 mA
Factory packaging quantity	100

Preview

Download Datasheet

View All

Intel

RealSense

D400 Series Product Family

Datasheet

Intel

RealSense™ Vision Processor D4, Intel

RealSense™ Vision

Processor D4 Board, Intel

RealSense™ Depth Module D400, Intel

RealSense™ Depth Module D410, Intel

RealSense™ Depth Module D415,

Intel

RealSense™ Depth Camera D415, Intel

RealSense™ Depth Module

D420, Intel

RealSense™ Depth Module D430, Intel

RealSense™ Depth

Camera D435, Intel® RealSense™ Depth Camera D435i

Revision 004

November 2018

Document Number: 337029-004

Description and Features

Contents

Description and Features .................................................................................. 11

Introduction .................................................................................................... 12

2.1

2.2

2.3

2.4

2.5

2.6

3.1

3.2

3.3

Purpose and Scope of this Document .......................................................

Terminology .........................................................................................

Stereo Vision Depth Technology Overview ................................................

Camera System Block Diagram ...............................................................

Intel

RealSense™ Depth Module D400 series Product SKUs ......................

Intel

RealSense™ Depth Camera D400 series Product SKUs .....................

Component Specification .................................................................................. 18

Vision Processor D4 Camera System Components ..................................... 18

Host Processor ..................................................................................... 18

Intel

RealSense™ Vision Processor D4 ................................................... 18

3.3.1

Vision Processor D4 Features .................................................... 18

3.3.2

Vision Processor D4 Signal Description ....................................... 19

3.3.3

Vision Processor D4 Package Mechanical Attributes ...................... 24

3.3.4

Vision Processor D4 Power Requirements.................................... 30

3.3.5

Vision Processor D4 Power Sequencing ....................................... 30

3.3.6

Vision Processor D4 Spec Code .................................................. 31

3.3.7

Vision Processor D4 Storage and Operating Conditions ................. 31

3.3.8

Vision Processor D4 Thermals ................................................... 32

Clock ................................................................................................... 32

Serial (SPI) Flash Memory ...................................................................... 32

Stereo Depth Module ............................................................................. 32

3.6.1

Left and Right Imagers ............................................................. 34

3.6.2

Infrared Projector .................................................................... 35

3.6.3

Color Sensor ........................................................................... 36

3.6.4

Depth Module Connector .......................................................... 37

3.6.5

Stereo Depth Module Label ....................................................... 37

3.6.6

Stiffener ................................................................................. 38

3.6.7

Temperature Sensor ................................................................ 38

3.6.8

Other Stereo Depth Module Components .................................... 38

3.6.9

Mechanical Dimensions............................................................. 39

3.6.10 Stereo Depth Module Power Sequence........................................ 40

3.6.11 Stereo Depth Module Storage and Operating Conditions ............... 40

Intel

RealSense™ Vision Processor D4 Board .......................................... 41

3.7.1

Mechanical Dimensions............................................................. 42

3.7.2

Depth Module Receptacle .......................................................... 42

3.7.3

Flex and Rigid Interposer Interconnect ....................................... 42

3.7.4

External Sensor Sync Connector ................................................ 47

3.7.5

USB Peripheral Connector – Type-C ........................................... 47

3.7.6

Color Image Signal Processor (ISP) ............................................ 49

3.7.7

Vision Processor D4 Board Power Requirements .......................... 49

3.7.8

Vision Processor D4 Board Thermals .......................................... 49

3.7.9

Vision Processor D4 Board Storage and Operating Conditions ........ 50

3.7.10 Intel

RealSense™ Vision Processor D4 Board Product Identifier and

Material Code .......................................................................... 50

RealSense™ Depth Camera D400 Series ......................................... 50

Intel

3.4

3.5

3.6

3.7

3.8

337029-004

3.8.1

Depth Camera D400 Series Mechanical Dimensions ..................... 51

3.8.2

Depth Camera D400 Series Thermals ......................................... 52

3.8.3

Depth Camera D400 Series Storage and Operating Conditions ...... 52

(1) Controlled conditions should be used for long term storage of product. (2)

Short exposure represents temporary max limits acceptable for

transportation conditions. ......................................................... 53

3.8.4

Depth Camera D400 Series Product Identifier and Material Code ... 53

3.8.5

Camera Lens Cleaning Procedure ............................................... 53

Functional Specification .................................................................................... 54

4.1

4.2

4.3

4.4

4.5

4.6

4.7

4.8

4.9

4.10

4.11

4.12

5.1

5.2

6.1

7.1

7.2

Vendor Identification (VID) and Device Identification (DID) ........................

Vision Processor D4 Data Streams ..........................................................

Depth Field of View (FOV) ......................................................................

Depth Field of View at Distance (Z) .........................................................

Invalid Depth Band ...............................................................................

Minimum-Z Depth .................................................................................

Depth Quality Specification ....................................................................

Measured Power ...................................................................................

Depth Start Point (Ground Zero Reference) ..............................................

4.9.1

Depth Origin X-Y Coordinates ....................................................

Depth Camera Functions ........................................................................

Color Camera Functions .........................................................................

IMU Specifications.................................................................................

Firmware ........................................................................................................ 69

Update ................................................................................................ 69

5.1.1

Update Limits .......................................................................... 69

Recovery ............................................................................................. 69

Intel

RealSense™ Software Development Kit 2.0 ..................................... 70

System Level Block Diagram ..................................................................

Vision Processor D4 System Integration ...................................................

7.2.1

Vision Processor D4 Board ........................................................

7.2.2

Vision Processor D4 on Motherboard ..........................................

D4 Camera System Power Delivery .........................................................

Vision Processor D4 Board for Integrated Peripheral ..................................

7.4.1

USB 3.1 Gen 1 Receptacle ........................................................

7.4.2

USB 3.1 Gen 1 High Speed Cable Assembly ................................

7.4.3

Transmit to Receive Crossover ..................................................

7.4.4

Motherboard Receptacle ...........................................................

7.4.5

Vision Processor D4 Board for Integrated Peripheral Power

Requirements..........................................................................

Thermals .............................................................................................

Stereo Depth Module Flex ......................................................................

Stereo Depth Module Mounting Guidance .................................................

7.7.1

Screw Mount ...........................................................................

7.7.2

Bracket Mount .........................................................................

7.7.3

Stereo Depth Module Air gap.....................................................

Thermal Interface Material .....................................................................

Heat Sink .............................................................................................

Software......................................................................................................... 70

System Integration .......................................................................................... 71

7.3

7.4

7.5

7.6

7.7

7.8

7.9

337029-004

Description and Features

7.10

7.11

7.12

7.13

7.14

7.15

8.1

8.2

Cover Design and Material Guidance .......................................................

Gaskets ...............................................................................................

7.11.1 Optical Isolation ......................................................................

7.11.2 Dust Protection .......................................................................

Firmware Recovery ...............................................................................

Calibration Support ...............................................................................

Multi-Camera Hardware Sync .................................................................

Handling Conditions ..............................................................................

Platform Design Guidelines ............................................................................... 87

Vision Processor D4 on Motherboard ....................................................... 87

Kaby Lake U and Kaby Lake Y platforms .................................................. 88

8.2.1

Kaby Lake Platform Introduction ................................................ 88

8.2.2

Supported PCB Stack-Up and Routing Geometries ....................... 88

8.2.3

Vision Processor D4 on Motherboard with USB Host Interface ........ 89

8.2.4

Vision Processor D4 on Motherboard with MIPI Host Interface ....... 90

8.2.5

Vision Processor D4 Board for Integrated Peripheral (USB 3.1 Gen 1

Host to Vision Processor D4 Routing) ......................................... 92

8.2.6

USB2.0 Design Guidelines (USB2 Host to Vision Processor D4

Routing) ................................................................................. 93

Cherry Trail T4 Platform......................................................................... 94

8.3.1

Cherry Trail T4 Platform Introduction ......................................... 94

8.3.2

Vision Processor D4 Platform Design Guidelines ........................... 94

System Laser Compliance ......................................................................

9.1.1

Certification Statement.............................................................

9.1.2

Explanatory Label ....................................................................

9.1.3

Cautionary Statements .............................................................

9.1.4

Manufacturer’s Information .......................................................

9.1.5

US FDA Accession Number ........................................................

9.1.6

NRTL Statement ......................................................................

Ecology Compliance ..............................................................................

9.2.1

China RoHS Declaration ............................................................

9.2.2

Waste Electrical and Electronic Equipment (WEEE) .......................

8.3

Regulatory Compliance ..................................................................................... 95

9.1

9.2

Mechanical Drawings ........................................................................................ 99

Connector Drawings ........................................................................................ 107

Appendix A – Vision Processor D4 on Motherboard Schematic Checklist ................. 109

12.1

Power Delivery .................................................................................... 116

Appendix B- Cover Material .............................................................................. 119

Figures

Figure

2-1.

2-2.

2-3.

3-1.

3-2.

Active Infrared (IR) Stereo Vision Technology .........................................................

Depth Measurement (Z) versus Range (R) ..............................................................

Vision Processor D4 Camera System Block Diagram ................................................

Vision Processor D4 Package Drawing ....................................................................

Vision Processor D4 Ball-out .................................................................................

337029-004

Recommended Resources

Simple AC power short circuit protection circuit

Another forward and reverse control circuit to prevent phase short circuit

W723 7-36V regulated power supply

Low voltage bulbs are used on 220 volt power supply

Angle measurement circuit

Rain sound generator circuit

DM6437 cannot load .out file and displays disable edma: DM6437 development board, can load out file at first. Later, after loading, it shows disable edma. After loading, click run and nothing happens. Please answer[/color][/align][align=left][color=#000]Af...; henrrylee DSP and ARM Processors

Crest Factor Reduction for OFDMA Systems: IntroductionCrest factor reduction (CFR) is a technique for reducing the peak-to-average ratio (PAR) of an orthogonal frequency division multiplexing (OFDM) waveform. An OFDM signal is made up in the ...; xiaoxin1 FPGA/CPLD

"ADI Analog University" Basic Accelerometer Sensor: [b]「ADI Analog University」Basic Accelerometer Sensor[/b][size=5][color=rgb(0, 0, 0)][font=Helvetica, Arial, sans-serif][font=Helvetica, Arial, sans-serif][color=#000080](One copy of information per da...; chen8710 ADI Reference Circuit

Does anyone have the pxa270 ce5.0 power management source code? Can you give me a copy for reference?: I am currently working on a pxa270 platform, Windows CE 5.0 system. Right now, I can only do simple hibernation, suspension, etc. Has anyone implemented a slightly more complex function, such as reduc...; hoyden Embedded System

Atmel SAM V71 Xplained Ultra Development Board: [i=s]This post was last edited by kaiyueperfect on 2016-9-30 21:37[/i] [p=28, null, left][color=rgb(85, 85, 85)][font="][size=16px]I have an Atmel SAM V71 Xplained Ultra development board. It is in un...; kaiyueperfect Buy&Sell

Does marketing require deception and fraud to be successful?: : [p=26, null, left][color=#000][font=Arial][size=14px]Recently, I have encountered many such things. I found that some colleagues often cheat customers. My suppliers also cheated me, which made me ve...; gooogleman Embedded System

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components