RoHS Recast Compliant
M.2 2242 Flash Drive
SM220-M242 Product Specifications
July 21, 2017
Version 1.3
Apacer Technology Inc.
1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C
Tel: +886-2-2267-8000
www.apacer.com
Fax: +886-2-2267-2261
M.2 2242 Flash Drive
APM2T42SM22xxxGXN-4XTMXX
Features:
Compliance with SATA Interface
–
Serial ATA Revision 3.1
–
SATA 6.0 Gbps
–
ATA-8 command set
–
Backward compatible with SATA 1.5/3.0
Gbps
Capacity
–
8, 16, 32, 64, 128, 256 GB
Performance*
–
Interface burst read/write: 600 MB/sec
–
Sequential read: up to 525 MB/sec
–
Sequential write: up to 355 MB/sec
–
Random read 4K: up to 76,000 IOPS
–
Random write 4K: up to 43,000 IOPS
Flash Management
–
Built-in hardware ECC
–
Global Wear Leveling
–
Flash bad-block management
–
Flash Translation Layer: Page Mapping
–
S.M.A.R.T.
–
Power Failure Management
–
ATA Secure Erase
–
TRIM
SATA Power Management
NAND Flash Type:
MLC
MTBF:
>1,000,000 hours
Endurance (in Terabytes Written: TBW)
–
8 GB: 13 TBW
–
16 GB: 27 TBW
–
32 GB: 66 TBW
–
64 GB: 126 TBW
–
128 GB: 277 TBW
–
256 GB: 305 TBW
Temperature Range
–
Operating:
Standard: 0°C to 70°C
Extended: -40°C to 85°C
–
Storage: -40°C to 100°C
Supply Voltage
–
3.3 V
±
5%
Power Consumption*
–
Active mode: 750 mA
–
Idle mode: 80 mA
Connector Type
–
75-pin SATA-based M.2 module pinout
Form Factor
–
M.2 2242-D2-B-M
–
Dimensions: 42.00 x 22.00 x 3.60, unit:
㎜
Shock & Vibration**
–
Shock:1,500 G
–
Vibration: 15 G
Thermal Sensor
Thermal Management Technique (optional)
Device Sleep (optional)
LED Indicators for Drive Behavior
RoHS Recast Compliant (Complies with
2011/65/EU Standard)
*Varies from capacities. The values for performances and power consumptions presented are typical and may vary depending on flash configurations
or platform settings. The term idle refers to the standby state of the device.
**Non-operating
1
© 2017 Apacer Technology Inc.
Rev. 1.3
M.2 2242 Flash Drive
APM2T42SM22xxxGXN-4XTMXX
Table of Contents
1. General Description .............................................................................. 3
2. Functional Block ................................................................................... 3
3. Pin Assignments .................................................................................... 4
4. Product Specifications.......................................................................... 7
4.1 Capacity ............................................................................................................................................... 7
4.2 Performance ........................................................................................................................................ 7
4.3 Environmental Specifications .............................................................................................................. 8
4.4 Mean Time Between Failures (MTBF) ................................................................................................ 8
4.5 Certification and Compliance .............................................................................................................. 8
4.6 Endurance ........................................................................................................................................... 9
4.7 LED Indicator Behavior........................................................................................................................ 9
5. Flash Management .............................................................................. 10
5.1 Error Correction/Detection ................................................................................................................. 10
5.2 Bad Block Management .................................................................................................................... 10
5.3 Global Wear Leveling ........................................................................................................................ 10
5.4 Power Failure Management .............................................................................................................. 10
5.5 ATA Secure Erase ............................................................................................................................. 10
5.6 TRIM .................................................................................................................................................. 11
5.7 Flash Translation Layer – Page Mapping.......................................................................................... 11
5.8 DEVSLP (DevSleep or DEVSLP) Mode (optional) ............................................................................ 11
5.9 Thermal Sensor ................................................................................................................................. 11
5.10 Thermal Management Technique (optional) ................................................................................... 12
5.11 SATA Power Management .............................................................................................................. 12
6. Software Interface .............................................................................. 13
6.1 Command Set .................................................................................................................................... 13
6.2 S.M.A.R.T. ......................................................................................................................................... 13
7. Electrical Specifications .................................................................... 15
8. Mechanical Specifications ................................................................. 16
8.1 Dimensions ........................................................................................................................................ 16
9. Product Ordering Information ............................................................. 17
9.1 Product Code Designations ............................................................................................................... 17
9.2 Valid Combinations ............................................................................................................................ 18
2
© 2017 Apacer Technology Inc.
Rev. 1.3
M.2 2242 Flash Drive
APM2T42SM22xxxGXN-4XTMXX
1. General Description
Apacer’s SM220-M242 (M.2 2242) is the next generation modularized Solid State Drive (SSD) with the
shape of all new M.2 form factor, with the aim to be the more suitable for mobile and compact computers
with standard width at only 22.00 mm. SM220-M242 appears in M.2 2242 mechanical dimensions and is
believed to be the leading add-in storage solution for future host computing systems.
The M.2 SSD is designed with SATA-based connector pinouts, providing full compliance with the latest
SATA Revision 3.1 interface specifications. Aside from SATA compliance, SM220-M242 delivers
exceptional performance and power efficiency. On the other hand, the extreme thin and light form factor
makes SM220-M242 the ideal choice for mobile computing systems, which appears to be the trend in
near future.
Regarding reliability, SM220-M242 is built with a powerful SATA controller that supports on-the-module
ECC as well as efficient wear leveling scheme. Since it is operating under SATA 6.0 Gbps interface,
SM220-M242 is provided with Apacer latest S.M.A.R.T. that are primarily oriented for the latest SATA
interface SSD, for drive lifetime monitoring and analyzing.
2. Functional Block
Apacer SM220-M242 includes a single-chip SATA 6.0 Gbps and the flash media. The controller
integrates the flash management unit to support multi-channel, multi-bank flash arrays. Figure 2-1 shows
the functional block diagram.
Flash data bus & ECC engine
DDR3
DRAM
SATA 6.0
Gbps Interface
Flash
SATAI/O & PHY
Controller
Host
Interface
Flash
Figure 2-1
Block Diagram
3
© 2017 Apacer Technology Inc.
Rev. 1.3
M.2 2242 Flash Drive
APM2T42SM22xxxGXN-4XTMXX
3. Pin Assignments
This connector does not support hot plug capability. There are a total of 75 pins. 12 pin locations are used
for mechanical key locations; this allows such a module to plug into both Key B and Key M connectors.
Notch M
Notch B
Pin1
Table 3-1
Pin Assignments
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
Type
CONFIG_3
3.3V
GND
3.3V
No connect
Not available
Not available
Not available
No connect
DAS/DSS
No connect
(removed for key)
(removed for key)
(removed for key)
(removed for key)
(removed for key)
(removed for key)
(removed for key)
(removed for key)
Description
Ground (according to M.2 configurations for SSD-SATA definition)
Supply Pin, 3.3V
Ground
Supply pin, 3.3V
No connect
No connect (used for other purposes)
No connect (used for other purposes)
No connect (used for other purposes)
No connect
Device Activity Signal/Disable Staggered Spin-up
No connect (used for other purposes)
Mechanical notch B
Mechanical notch B
Mechanical notch B
Mechanical notch B
Mechanical notch B
Mechanical notch B
Mechanical notch B
Mechanical notch B
4
© 2017 Apacer Technology Inc.
Rev. 1.3
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