TruStability™ Board Mount Pressure Sensors
RSC Series—High Resolution, High Accuracy, Compensated
±1.6 mbar to ±10 bar | ±160 Pa to ±1 MPa | ±0.5 inH
2
O to ±150 psi
24-bit Digital SPI-Compatible Output
32321348
Issue C
Datasheet
FEATURES
• Pressure range: ±1.6 mbar to ±10 bar | ±160 Pa to ±1 MPa |
±0.5 inH
2
O to ±150 psi; absolute range 1 bar to 8 bar |
15 psi to 150 psi
• Pressure types: Absolute: internal vacuum reference and
an output value proportional to absolute pressure; Gage:
referenced to atmospheric pressure and provide an output
proportional to pressure variations from atmosphere;
Differential: allows measurement of pressure between the
two pressure ports
• Total Error Band: As low as ±0.25 %FSS depending on
pressure range (after auto zero)
• Accuracy: ±0.1 %FSS BFSL (Full Scale Span Best Fit Straight Line)
• Compensated temperature range: -40ºC to 85ºC [-40ºF to 185ºF]
• Power consumption: Less than 10 mW, typ.
• Size: Miniature 10 mm x 12,5 mm [0.39 in x 0.49 in] package
• Output: 24-bit digital SPI-compatible
• Meets IPC/JEDEC J-STD-020D.1 Moisture Sensitivity
Level 1 requirements
DIFFERENTIATION
• Industry-leading long-term stability: Minimizes system
calibration needs and significantly reduces downtime.
• Industry-leading accuracy: Reduces software to correct
system inaccuracies, which minimizes design time, helps
improve efficiency, and often simplifies development.
• Industry-leading flexibility: Modular design with many
package styles and options simplify integration.
• Total Error Band: Provides true performance over the
compensated temperature range, which eliminates the
need to test and calibrate every sensor, thereby reducing
manufacturing cost. Improves system accuracy and offers
ease of sensor interchangeability due to minimal part-to-
part variation (see Figure 1 on page 3).
POTENTIAL APPLICATIONS
• Medical: Airflow monitors, anesthesia machines, blood
analysis machines, gas chromatography, gas flow
instrumentation, hospital room air pressure, kidney dialysis
machines, nebulizers, pneumatic controls, respiratory
machines, sleep apnea equipment, spirometers, ventilators
• Industrial: Barometry, drones, flow calibrators, gas
chromatography, gas flow instrumentation, HVAC clogged
filter detection, HVAC systems, HVAC transmitters, indoor
air quality, life sciences, pneumatic control, VAV (Variable
Air Volume) control, weather balloons
PORTFOLIO
Honeywell offers a variety of board mount pressure sensors
for potential use in medical and industrial applications. Our
categories of pressure sensor measurement include absolute,
differential, gage or vacuum gage, with unamplified or
amplified sensors and covering a wide pressure range.
DESCRIPTION
The RSC Series is a piezoresistive silicon pressure sensor
offering a digital output for reading pressure over the
specified full scale pressure span and temperature range. It
is calibrated and temperature compensated for sensor offset,
sensitivity, temperature effects, and non-linearity using a
24-bit analog-to-digital converter with integrated EEPROM.
Pressure data may be acquired at rates between 20 and 2000
samples per second over an SPI interface. It is intended for
use with non-corrosive, non-ionic gases, such as air and other
dry gases, designed and manufactured according to ISO
9001 standards, and is REACH and RoHS compliant.
VALUE TO CUSTOMERS
• Enhances performance: Output accelerates performance
through reduced conversion requirements and direct
interface to microprocessors. Proprietary Honeywell
technology combines high sensitivity with high burst
and over pressure while providing industry leading
stability (performance factors difficult to achieve in the
same sensor), providing flexibility in implementation and
minimizing requirements for protecting the sensor without
sacrificing ability to sense very small changes in pressure.
• Cost-effective, high volume solution with a variety of
options.
• Enhances reliability: High burst pressures promote system
reliability, minimize downtime, and can simplify design.
High working pressures allow ultra-low sensors to be used
continuously above the calibrated pressure range.
• Easy to design in: Package is small when compared to many
similar sensors, occupying less area on the PCB. Port and
housing options simplify integration. Wide pressure range
simplifies use.
• Meets IPC/JEDEC J-STD-020D.1 Moisture Sensitivity
Level 1 requirements: Allows avoidance of thermal and
mechanical damage during solder reflow attachment
and/or repair that lesser rated sensors would incur, allows
unlimited floor life when stored as specified (simplifying
storage and reducing scrap), eliminates lengthy bakes prior
to reflow, and allows for lean manufacturing due to stability
and usability shortly after reflow.
• Energy efficient: Reduces system power requirements and
enables extended battery life.
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TruStability™ Board Mount Pressure Sensors
RSC Series
Table of Contents
General Specifications
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Nomenclature and Order Guide
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Pressure Range Specifications
±1.6 mbar to ±10 bar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
±160 Pa to ±1 MPa . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
±0.5 inH
2
O to ±150 psi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Dimensional Drawings
DIP Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-12
SMT Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-14
Recommended PCB Pad Layouts
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Pinout
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Recommended Circuit
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.0
System Overview
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.1 Major System Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.2 High-level Operating Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.3 Compensation Mathematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.0
System Initialization – EEPROM
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.1 EEPROM Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18-19
2.2 EEPROM Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-21
3.0
System Operation – ADC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.1 ADC Communications and Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.2 Programming the Data Rate and Pressure/Temperature Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.3 ADC Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4 ADC Programming Sequence – Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.5 ADC Programming and Read Sequence – Temperature Reading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-24
3.6 ADC Programming and Read Sequence – Pressure Reading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.0
Example Software
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.1 Data Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.2 Function Descriptions – Pressure_Comp.c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-26
4.3 Checksum Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.4 Compensation Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.5 Constraints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.0
Sensor Offset Zero Correction Procedure
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Additional Information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . back page
2
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TruStability™ Board Mount Pressure Sensors
RSC Series
Figure 1. TEB Components for TruStability™ Board Mount Pressure Sensors
Sources of Error
Offset
Full Scale Span
Pressure Non-Linearity
Pressure Hysteresis
Pressure Non-Repeatability
Thermal Effect on Offset
Thermal Effect on Span
Thermal Hysteresis
Table 1. Absolute Maximum Ratings
1
Characteristic
Supply voltage (V
supply
)
Voltage on any pin
Digital interface clock frequency
ESD susceptibility (human body
model)
Storage temperature
Soldering time and temperature:
lead solder temperature (DIP)
peak reflow temperature (SMT)
1
Accuracy
BFSL
Total
Error
Band
Min.
2.7
-0.3
—
—
-40 [-40]
Max.
6.0
V
supply
+ 0.3
5
2
85 [185]
4 s max. at 250°C [482°F]
15 s max. at 250°C [482°F]
Unit
Vdc
V
MHz
kV
°C [°F]
Absolute maximum ratings are the extreme limits the device will withstand without damage.
Table 2. Environmental Specifications
Characteristic
Humidity (gases only)
Vibration
Shock
Life
1
Solder reflow
1
Parameter
0% to 95% RH, non-condensing
15 g, 10 Hz to 2 Hz
100 g, 6 ms duration
1 million pressure cycles minimum
J-STD-020-D.1 Moisture Sensitivity Level 1
(unlimited shelf life when stored at <30°C/85 % RH)
Life may vary depending on specific application in which the sensor is utilized.
Table 3. Wetted Materials
1
Component
Ports and covers
Substrate
Adhesives
Electronic components
1
Port 1 (Pressure Port)
high temperature polyamide
alumina ceramic
epoxy, silicone
plastic, silicon, glass, solder
Port 2 (Reference Port)
high temperature polyamide
alumina ceramic
epoxy, silicone
silicon, glass, gold
Contact Honeywell Customer Service for detailed material information.
Table 4. Sensor Pressure Types
Pressure Type
Absolute
Differential
Gage
Description
Output is proportional to the difference between applied pressure and a built-in vacuum reference.
Output is proportional to the difference between the pressures applied to each port (Port 1 – Port 2).
Output is proportional to the difference between applied pressure and atmospheric (ambient) pressure.
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TruStability™ Board Mount Pressure Sensors
RSC Series
Characteristic
Supply voltage (V
supply
):
1, 2, 3
pressure ranges >60 mbar | 6 kPa | 1 psi:
3.3 Vdc
5.0 Vdc
pressure ranges <40 mbar | 4 kPa | 20 inH
2
O:
3.3 Vdc
5.0 Vdc
Supply current:
3.3 Vdc:
standby mode
active mode
5.0 Vdc:
standby mode
active mode
Operating temperature range
4
Compensated temperature range:
5
medical
industrial
extended
Startup time (power up to data ready)
Data rate
SPI voltage level:
low
high
Pull up on MISO, SCLK, CS_ADC, CS_EE, MOSI
Accuracy
6
Orientation sensitivity (±1 g):
7, 9
pressure ranges <40 mbar | 4 kPa | 20 inH
2
O
pressure ranges <2.5 mbar | 250 Pa | 1 inH
2
O
1
2
Table 5. Digital Operating Specifications
Min.
Typ.
Max.
Unit
3.0
4.75
3.27
4.95
3.3
5.0
3.3
5.0
3.6
5.25
3.33
5.05
Vdc
—
—
—
—
-40 [-40]
0 [32]
-20 [-4]
-40 [-40]
—
1.3
1.7
2.1
2.6
—
—
—
—
—
—
—
—
—
85 [185]
50 [122]
85 [185]
85 [185]
0.3
mA
°C [°F]
°C [°F]
ms
samples per
second
%Vsupply
kOhm
%FSS BFSL
6
%FSS
8
20, 40, 45, 90, 175, 180, 330, 350, 600, 660,
1000, 1200, 2000
—
80
1
—
—
—
—
—
—
—
±0.1
±0.2
20
—
—
0.1
—
—
Sensors are either 3.3 Vdc or 5.0 Vdc based on the catalog listing selected.
Ratiometricity of the sensor (the ability of the device output to scale to the supply voltage) is achieved within the specified operating voltage.
3
The sensor is not reverse polarity protected. Incorrect application of supply voltage or ground to the wrong pin may cause electrical failure.
4
Operating temperature range: The temperature range over which the sensor will produce an output proportional to pressure.
5
Compensated temperature range: The temperature range over which the sensor will produce an output proportional to pressure within the specified
performance limits (Total Error Band).
6
Accuracy: The maximum deviation in output from a Best Fit Straight Line (BFSL) fitted to the output measured over the pressure range. Includes all
errors due to pressure non-linearity, pressure hysteresis, and non-repeatability.
7
Orientation sensitivity: The maximum change in offset of the sensor due to a change in position or orientation relative to Earth’s gravitational field.
8
Full Scale Span (FSS): The algebraic difference between the output signal measured at the maximum (Pmax.) and minimum (Pmin.) limits of the
pressure range. (See Figure 1 for ranges.)
9
Insignificant for pressure ranges above 40 mbar | 4 kPa | 20 inH
2
O.
4
sensing.honeywell.com
TruStability™ Board Mount Pressure Sensors
RSC Series
Figure 2. SPI Timing Requirements
1
t
w(CSH)
CS
t
d(CSSC)
SCLK
t
c(SC)
t
w(SCH)
t
d(SCCS)
t
su(DI)
DIN
t
h(DI)
t
w(SCL)
t
p(CSDO)
DOUT
t
p(SCDO)
t
p(CSDOZ)
Hi-Z
Hi-Z
Characteristic
Description
delay time; CS falling edge to first SCLK rising edge
delay time,;final SCLK falling edge to CS rising edge
pulse duration; CS high
SCLK period
pulse duration; SCLK high
pulse duration; SCLK low
setup time; DIN valid before SCLK falling edge
hold time; DIN valid after SCLK falling edge
propagation delay time; CS falling edge to DOUT driven
propagation delay time; SCLK rising edge to valid new DOUT
propagation delay time; CS rising edge to DOUT high impedance
Min.
50
30
80
150
75
75
50
25
—
0
—
Max.
—
—
—
—
—
—
—
—
50
50
50
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
t
d(CSSC)
t
d(SCCS)
t
w(CSH)
t
c(SC)
t
w(SCH)
t
w(SCL)
t
su(DI)
t
h(DI)
t
p(CSDO)
t
p(SCDO)
t
p(CSDOZ)
1
Single byte communication is shown. Actual communication may be several bytes.
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