This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S71WS-N_00
Revision
A
Amendment
6
Issue Date
July 19, 2006
Data
Sheet
(Advan ce
Infor m a tio n)
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
ii
S71WS-N
S71WS-N_00_A6 July 19, 2006
S71WS-N
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
™
Data Sheet
(Advance Information)
Features
Power supply voltage of 1.7 V to 1.95 V
Burst Speed: 54 MHz, 66 MHz, 80 MHz
Package
– 8 x 11.6 mm, 9 x 12 mm
Operating Temperature
– Wireless, –25° C to +85° C
General Description
The S71WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of the following items:
One or more flash memory die (for the S71WS512N, two S29WS256N devices are used)
CellularRAM Type 2 pSRAM
The products covered by this document are listed in the table below. For details about their specifications, please refer to the
individual constituent datasheet for further details.
pSRAM
Flash Density
S29WS128N
S29WS256N
S29WS512N
32 Mb
S71WS128NB0
64 Mb
S71WS128NC0
S71WS256NC0
S71WS512NC0
S71WS256ND0
S71WS512ND0
128 Mb
For detailed specifications, please refer to the individual data sheets.
Document
S29WS-N
128 M CellularRAM Type 2
32 M CellularRAM Type 2
64 M CellularRAM Type 2
Publication Identification Number (PID)
S29WS-N_00
Cellram_04
Cellram_06
Cellram_07
Publication Number
S71WS-N_00
Revision
A
Amendment
6
Issue Date
July 19, 2006
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
(Advan ce
Infor m a tio n)
1.
Product Selector Guide
Model
Numbers
AK
54
AP
AJ
S71WS128NB0
AN
AH
80
AM
AK
54
AP
AJ
S71WS128NC0
AN
AH
80
AM
AK
54
AP
AJ
S71WS256NC0
AN
AH
80
AM
WS256N
YK
54
YP
YJ
S71WS256ND0
YN
YH
80
YM
AK
54
AP
TJ
S71WS512NC0
TN
TH
80
TM
WS512N
EK
54
EP
EJ
S71WS512ND0
EN
EH
80
EM
Note:
0 (Protected), 1 (Unprotected [Default State])
80
1
128
66
66
1
0
54
1
0
2
9x12x1.4
0
80
1
64
66
66
1
11.6x8.0x1.4
0
2
54
1
0
2
80
1
0
2
11.6x8.0x1.2
128
66
66
1
0
54
1
0
2
9x12x1.2
0
80
1
64
66
66
1
0
2
54
1
0
2
11.6x8.0x1.2
80
1
0
2
WS128N
64
66
66
1
0
54
1
0
2
8.0X11.6X1.2
80
1
0
WS128N
32
66
66
1
0
54
1
0
2
8.0X11.6X1.2
pSRAM
Density
(Mb)
Flash
Speed
(MHz)
pSRAM
Speed
(MHz)
DYB
Power-Up
State
(See
Note)
0
pSRAM
(Cellular RAM)
Supplier
Package
(mm)
Device
Flash
2
S71WS-N
S71WS-N_00_A6 July 19, 2006
D at a
S hee t
(Adva nce
In for m ation)
2.
Ordering Information
The order number is formed by a valid combinations of the following:
S71WS
256
N
C
0
BA
W
A
K
0
Packing Type
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
RAM Supplier, DYB Power Up, Speed Combinations
K = 2 = CellularRAM 2, 0, 54 MHz
P = 2 = CellularRAM 2, 1, 54 MHz
J = 2 = CellularRAM 2, 0, 66 MHz
N = 2 = CellularRAM 2, 1, 66 MHz
H = 2 = CellularRAM 2, 0, 80 MHz
M = 2 = CellularRAM 2, 1, 80 MHz
Package Modifier
A = 8x11.6x1.2 mm, 84-ball FBGA
T = 8x11.6x1.4 mm, 84-ball FBGA
E = 9x12x1.4 mm, 84-ball FBGA
Y = 9x12x1.2 mm, 84-ball FBGA
Temperature Range
W = Wireless (-25°C to +85°C)
Package Type
BA = Very Thin FIne-Pitch BGA, Lead (Pb)-free Compliant Package
BF = Very Thin FIne-Pitch BGA, Lead (Pb)-free Package
The Sino-US trade war has already started. Trump's series of actions have had a negative impact on the global economy, such as increasing tariffs on Chinese companies and restricting domestic compa...[Details]
Recently, the U.S. Department of Commerce announced that it would prohibit companies in the country from selling any electronic technology or communication components to ZTE, a Chinese communicatio...[Details]
On April 20, the Photovoltaic Summit, guided by Jiangsu Renewable Energy Industry Association, hosted by Growatt, and supported by LONGi Solar Technology Co., Ltd. and Jiangsu Bigo New Energy Group...[Details]
1. Problem When developing STM32 with IAR, I found that I could not print floating point numbers by redirecting printf to the serial port. The code is as follows: The output is as follows: It can...[Details]
In the actual project development process, hardware circuits often need to be modified, and the modified parts need to modify the driver. Thinking about the coming and going of such requirements is t...[Details]
I have read the source code of mbed these days, and the interface encapsulation for upper-level application calls is quite good. The code quality is relatively high, the comments are also very detai...[Details]
1. Usage scenarios In the first case, when using a common STM32 delay function, similar to HAL_Delay(time), since this function uses a loop to judge and delay, when executing this function, the ent...[Details]
In simple terms, high-end chips solve many complex problems, mid-range chips solve a single complex problem, and low-end chips solve a simple problem. Let's learn more about the relevant content wi...[Details]
LAN8720 test code arrangement 1. Modified based on two projects, namely "Experiment 55 Network Communication Experiment" of Zhengdian Atom ATK and "STSW-STM32070" routine of ST official The hardware ...[Details]
I have been working on this i2c for several days. Many people on the Internet say that this is a problem with the ST package library, and they basically talk about the STM32F1 series of chips, and ev...[Details]
After studying the F4 FSMC method to drive the touch screen for a few days, I have gained some understanding, which are listed below. The unorganized record is only for my own reference in the future...[Details]
Recently, the relevant person in charge of the Energy Conservation Division of the Energy Conservation and Technology Equipment Department of the National Energy Administration said on the issue of...[Details]
On April 18-19, 2018, at the "Second Distributed Photovoltaic Carnival" held in Hangzhou, Jinko Power and China New Energy Assets Investment, Financing and Trading Platform (hereinafter referred to as...[Details]
The F1 racetrack is roaring with engines, and a fierce F1 race is about to begin. I am not a fan of racing cars, and I have nothing to do with this world, but
I spent a special day here
because...[Details]
What is SYSTICK: This is a 24-bit system tick timer, SysTick, with automatic reload and overflow interrupt functions. All microcontrollers based on the Cortex_M3 processor can obtain a certain time ...[Details]