WT32i BLUETOOTH AUDIO MODULE
DATA SHEET
Monday, 18 March 2019
Version 1.3.1
VERSION HISTORY
VERSION
1.0
1.1
1.2
1.21
1.22
1.23
1.24
1.3
1.3.1
COMMENT
First version
Added example how to protect the battery by shutting down the regulators at
certain voltage level
Fixed PCM pin numbering
Design check list added
UART brake signal updated
Chapter 9.3.1 added
Added note to reset section
Updated order codes and added more information about iWRAP versions.
Fixed one wrong build number
Silicon Labs
TABLE OF CONTENTS
1
2
3
4
5
Design Check List..........................................................................................................................................6
WT32i Product Numbering ............................................................................................................................7
Block diagram ................................................................................................................................................8
Pinout and Terminal Description ...................................................................................................................9
Electrical Characteristics ............................................................................................................................ 12
5.1
5.2
5.3
5.4
Absolute Maximum Ratings ................................................................................................................ 12
Recommended Operating Conditions ................................................................................................. 12
Digital Terminals.................................................................................................................................. 12
Audio Characteristics .......................................................................................................................... 13
ADC .............................................................................................................................................. 13
DAC .............................................................................................................................................. 14
A2DP Codecs............................................................................................................................... 14
5.4.1
5.4.2
5.4.3
5.5
RF Characteristics ............................................................................................................................... 16
RF Transceiver ............................................................................................................................ 16
Antenna Characteristics ............................................................................................................... 17
5.5.1
5.5.2
5.6
6
Current Consumption .......................................................................................................................... 20
Power Control and Regulation ................................................................................................................... 21
6.1
6.2
Protecting the Battery by Configuring the Module to Turn Off at Certain Voltage .............................. 23
Reset ................................................................................................................................................... 24
Internal POR ................................................................................................................................ 24
6.2.1
7
8
Battery Charger .......................................................................................................................................... 26
GPIO and AIO Functions ............................................................................................................................ 27
8.1
8.2
8.3
8.4
iWRAP supported GPIO Functions ..................................................................................................... 27
Outputting Internal Clocks ................................................................................................................... 27
Auxiliary ADC ...................................................................................................................................... 28
Software I2C Interface ........................................................................................................................ 28
9
Serial Interfaces.......................................................................................................................................... 29
9.1
UART Interface.................................................................................................................................... 29
Resetting Through UART Break Signal ....................................................................................... 30
UART Configuration While Reset is Active .................................................................................. 30
UART Bypass Mode .................................................................................................................... 30
9.1.1
9.1.2
9.1.3
9.2
9.3
USB Interface ...................................................................................................................................... 31
Programming and Debug Interface (SPI) ............................................................................................ 32
Multi-slave Operation ................................................................................................................... 32
9.3.1
10
10.1
10.1.1
Audio Interfaces ...................................................................................................................................... 33
Stereo Audio Codec Interface ...................................................................................................... 33
ADC .............................................................................................................................................. 33
Silicon Labs
10.1.2
10.1.3
10.1.4
10.1.5
10.1.6
10.1.7
10.2
10.3
10.4
11
11.1
11.1.1
11.1.2
11.2
11.3
12
13
14
15
15.1
15.2
15.3
15.3.1
15.4
15.5
16
16.1
16.2
16.3
16.4
16.4.1
16.5
16.6
16.7
DAC .............................................................................................................................................. 35
Microphone Input ......................................................................................................................... 36
Line Input ..................................................................................................................................... 37
Output Stage ................................................................................................................................ 38
Mono Operation ........................................................................................................................... 40
Side Tone ..................................................................................................................................... 40
PCM Interface .............................................................................................................................. 40
I2S Interface ................................................................................................................................. 40
IEC 60958 Interface ..................................................................................................................... 42
Design Guidelines ................................................................................................................................... 44
Audio Layout Guide ..................................................................................................................... 44
EMC Considerations .................................................................................................................... 44
Choosing Capacitors and Resistors ............................................................................................ 44
RF Layout Guide .......................................................................................................................... 45
Example Application Schematics ................................................................................................. 48
Physical Dimensions ............................................................................................................................... 52
Soldering Recommendations .................................................................................................................. 54
Package .................................................................................................................................................. 55
Certification Guidance for an End Product Using WT32i ....................................................................... 57
Bluetooth End Product Listing...................................................................................................... 57
CE Approval of an End-Product ................................................................................................... 57
FCC Certification of an End Product ............................................................................................ 58
Co-location with Other Transmitters ............................................................................................ 59
IC Certification of an End Product ............................................................................................... 59
MIC Japan Certification of an End Product .................................................................................. 59
WT32i Certifications ................................................................................................................................ 59
Bluetooth ...................................................................................................................................... 59
CE ................................................................................................................................................ 59
FCC .............................................................................................................................................. 60
IC .................................................................................................................................................. 61
IC .................................................................................................................................................. 61
MIC Japan .................................................................................................................................... 62
KCC (South-Korea) ...................................................................................................................... 62
Qualified Antenna Types for WT32i-E ......................................................................................... 62
Silicon Labs
WT32i
Bluetooth®
Audio Module
DESCRIPTION
KEY FEATURES:
•
•
Bluetooth
3.0 compliant
Excellent Radio Performance
o
Transmit power: +6.5 dBm
o
Receiver sensitivity: -90 dBm
o
Link budget: 96.5 dB
•
•
Integrated chip antenna
antenna connector
Audio features
o
Integrated DSP
o
16-bit stereo codec
o
44.1kHz ADC, 48kHz DAC
o
Analog, I2S, PCM, SPDIF, and
microphone interfaces
o
Optional aptX
®
and AAC stereo
audio codecs
o
Optional
cancellation
o
Wide Band Speech
•
•
•
•
•
•
•
•
Built-in battery charger
UART host interface
802.11 co-existence interface
10 software programmable IO pins
Operating voltage: 1.8V to 3.6V
Temperature range: -40C to +85C
Bluetooth,
CE, FCC, IC,
Korea
and
Japan qualified
Integrated iWRAP6
Bluetooth
stack
o
13
Bluetooth
profiles
o
Apple
iAP1
compatibility
and
iAP2
CVC
®
echo
or
U.FL
WT32i is an audio specific
Bluetooth
3.0
module with excellent radio frequency
performance and enhanced audio features,
enabling a best in class
Bluetooth
audio
experience.
In
addition
to
a
certified
Bluetooth
radio and software stack,
WT32i also contains a DSP, stereo audio
codec, and battery charger making it ideal
for fixed and portable audio applications.
WT32i
includes
Bluegiga's
iWRAP6
Bluetooth
stack software which
implements A2DP, AVRCP v.1.5 profiles
and supports
aptX
®
and AAC audio codecs
for stereo audio applications. For hands-free
applications
iWRAP6
software
also
supports HFP v.1.6, HSP, MAP and
PBAP and CVC
®
echo cancellation software.
For data communications to Android and
iOS
applications
iWRAP6
also
implements
Bluetooth
Serial Port Profile
(SPP) and Apple iAP profiles. WT32i is an
ideal solution for developers who want to
quickly integrate the latest
Bluetooth
audio
technologies without the time and costs
typically involved with a
Bluetooth
audio
chipset design.
APPLICATIONS:
•
•
•
•
Stereo speakers and sound bars
Hi-Fi devices
Hands-free kits
Stereo headsets
Figure 1: WT32i Bluetooth Audio Module
Silicon Labs
Microcontroller MCU
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