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GS8673EQ18BGK-550S

Description
Static random access memory 1.2/1.5V 4M x 18 72M
Categorysemiconductor    Memory IC    Static random access memory   
File Size193KB,25 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance
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GS8673EQ18BGK-550S Overview

Static random access memory 1.2/1.5V 4M x 18 72M

GS8673EQ18BGK-550S Parametric

Parameter NameAttribute value
MakerGSI Technology
Product Categorystatic random access memory
storage72 Mbit
organize4 M x 18
maximum clock frequency550 MHz
Interface TypeParallel
Supply voltage - max.1.4 V
Supply voltage - min.1.3 V
Supply current—max.1.93 A
Minimum operating temperature0 C
Maximum operating temperature+ 85 C
Installation styleSMD/SMT
Package/boxBGA-260
EncapsulationTray
storage typeQDR-III
seriesGS8673EQ18BGK
typeSigmaQuad-IIIe B2
humidity sensitivityYes
Factory packaging quantity8
GS8673EQ18/36BK-725S/625S/550S
260 Pin BGA
Commercial Temp
Industrial Temp
Features
• For use with GSI SRAM Port IP
• 2Mb x 36 and 4Mb x 18 organizations available
• 725 MHz maximum operating frequency
• 1.45 BT/s peak transaction rate (in billions per second)
• 104 Gb/s peak data bandwidth (in x36 devices)
• Separate I/O DDR Data Buses
• Non-multiplexed DDR Address Bus
• Two operations - Read and Write - per clock cycle
• Burst of 2 Read and Write operations
• 3 cycle Read Latency
• On-chip ECC with virtually zero SER
• 1.35V core voltage
• 1.2V or 1.35V or 1.5V I/O interface (HSTL or SSTL)
• Configurable ODT (on-die termination)
• ZQ pin for programmable driver impedance
• ZT pin for programmable ODT impedance
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 260 pin, 14 mm x 22 mm, 1 mm ball pitch BGA package
–K: 5/6 RoHS-compliant package
–GK: 6/6 RoHS-compliant package
72Mb SigmaQuad-IIIe™
Burst of 2 ECCRAM™
Up to 725 MHz
1.35V V
DD
1.2V or 1.35V or 1.5V V
DDQ
Clocking and Addressing Schemes
The GS8673EQ18/36BK SigmaQuad-IIIe ECCRAMs are
synchronous devices. They employ three pairs of positive and
negative input clocks; one pair of master clocks, CK and CK,
and two pairs of write data clocks, KD[1:0] and KD[1:0]. All
six input clocks are single-ended; that is, each is received by a
dedicated input buffer.
CK and CK are used to latch address and control inputs, and to
control all output timing. KD[1:0] and KD[1:0] are used solely
to latch data inputs.
Each internal read and write operation in a SigmaQuad-IIIe B2
ECCRAM is two times wider than the device I/O bus. An input
data bus de-multiplexer is used to accumulate incoming data
before it is simultaneously written to the memory array. An
output data multiplexer is used to capture the data produced
from a single memory array read and then route it to the
appropriate output drivers as needed. Therefore, the address
field of a SigmaQuad-IIIe B2 ECCRAM is always one address
pin less than the advertised index depth (e.g. the 4M x 18 has
2M addressable index).
SigmaQuad-IIIe™ Family Overview
SigmaQuad-IIIe ECCRAMs are the Separate I/O half of the
SigmaQuad-IIIe/SigmaDDR-IIIe family of high performance
ECCRAMs. Although very similar to GSI's second generation
of networking SRAMs (the SigmaQuad-II/SigmaDDR-II
family), these third generation devices offer several new
features that help enable significantly higher performance.
On-Chip ECC
GSI's ECCRAMs implement an ECC algorithm that detects
and corrects all single-bit memory errors, including those
induced by SER events such as cosmic rays, alpha particles,
etc. The resulting Soft Error Rate of these devices is
anticipated to be <0.002 FITs/Mb — a 5-order-of-magnitude
improvement over comparable SRAMs with no on-chip ECC,
which typically have an SER of 200 FITs/Mb or more.
All quoted SER values are at sea level in New York City.
Parameter Synopsis
Speed Grade
-725S
-625S
-550S
Max Operating Frequency
725 MHz
625 MHz
550 MHz
Read Latency
3 cycles
3 cycles
3 cycles
V
DD
1.3V to 1.4V
1.3V to 1.4V
1.3V to 1.4V
Rev: 1.03 6/2014
1/25
© 2012, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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