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S71WS128JA0BFWAY2

Description
Stacked Multi-Chip Product (MCP)
Categorystorage    storage   
File Size2MB,186 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
Download Datasheet Parametric View All

S71WS128JA0BFWAY2 Overview

Stacked Multi-Chip Product (MCP)

S71WS128JA0BFWAY2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeBGA
package instruction8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84
Contacts84
Reach Compliance Codeunknow
JESD-30 codeR-PBGA-B84
JESD-609 codee1
length11.6 mm
memory density134217728 bi
Memory IC TypeMEMORY CIRCUIT
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals84
word count8388608 words
character code8000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize8MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width8 mm
S71WS-J Based MCPs
Stacked Multi-Chip Product (MCP)
128/64 Megabit (8M/4M x 16-bit) CMOS 1.8 Volt-only,
Simultaneous Read/Write, Burst Mode Flash Memory
with CosmoRAM
Data Sheet
PRELIMINARY
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Publication Number
S71WS-J_04
Revision
A
Amendment
2
Issue Date
August 19, 2005

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