S70GL-P MirrorBit
TM
Flash
S70GL02GP
2 Gigabit, 3.0 Volt-only Page Mode Flash Memory featuring
90 nm MirrorBit Process Technology
Data Sheet
(Advance Information)
S70GL-P MirrorBit
TM
Flash Cover Sheet
Notice to Readers:
This document contains information on one or more products under development at
Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product
without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this
proposed product without notice.
Publication Number
S70GL-P_00
Revision
01
Issue Date
December 4, 2006
Data
Sheet
(Advan ce
Infor m a tio n)
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
ii
S70GL-P MirrorBit
TM
Flash
S70GL-P_00_01 December 4, 2006
S70GL-P MirrorBit
TM
Flash Family
S70GL02GP
2 Gigabit, 3.0 Volt-only Page Mode Flash Memory featuring
90 nm MirrorBit Process Technology
Data Sheet
(Advance Information)
General Description
The Spansion S70GL02GP 2 Gigabit Mirrorbit™ Flash memory device is fabricated on 90 nm process technology. This device
offers a fast page access time of 25 ns with a corresponding random access time of 120 ns. It features a Write Buffer that
allows a maximum of 32 words/64 bytes to be programmed in one operation, resulting in faster effective programming time than
standard programming algorithms. This makes the device an ideal product for today’s embedded applications that require
higher density, better performance and lower power consumption.
Distinctive Characteristics
Two 1024 Megabit (S29GL01GP) in a single 64-ball Fortified-
BGA package
(see publication S29GL-P_00 for full
specifications)
Single 3V read/program/erase (2.7-3.6 V)
Enhanced VersatileI/O™ control
– All input levels (address, control, and DQ input levels) and outputs
are determined by voltage on V
IO
input. V
IO
range is 1.65 to V
CC
Offered Packages
– 64-ball Fortified BGA
Suspend and Resume commands for Program and Erase
operations
Write operation status bits indicate program and erase
operation completion
Unlock Bypass Program command to reduce programming
time
Support for CFI (Common Flash Interface)
Persistent and Password methods of Advanced Sector
Protection
WP#/ACC input
– Accelerates programming time (when V
ACC
is applied) for greater
throughput during system production
– Protects first or last sector of each die, regardless of sector
protection settings
90 nm MirrorBit process technology
8-word/16-byte page read buffer
32-word/64-byte write buffer reduces overall programming
time for multiple-word updates
Secured Silicon Sector region
– 128-word/256-byte sector for permanent, secure identification
through an 8-word/16-byte random Electronic Serial Number
– Can be programmed and locked at the factory or by the customer
Uniform 64Kword/128KByte Sector Architecture
– S70GL02GP: two thousand forty-eight sectors
Hardware reset input (RESET#) resets device
Ready/Busy# output (RY/BY#) detects program or erase
cycle completion
100,000 erase cycles per sector typical
20-year data retention typical
Performance Characteristics
Max. Read Access Times (ns)*
2 Gb
Parameter
Random Access Time (t
ACC
)
Page Access Time (t
PACC
)
CE# Access Time (t
CE
)
OE# Access Time (t
OE
)
V1
110
25
110
25
V2
120
25
120
25
V3
130
25
130
30
Program & Erase Times (typical values)
Single Word Programming
Effective Write Buffer Programming (V
CC
) Per Word
Effective Write Buffer Programming (V
ACC
) Per Word
Sector Erase Time (64 Kword Sector)
60 µs
15 µs
15 µs
0.5 s
Current Consumption (typical values)
Random Access Read
8-Word Page Read
Program/Erase
Standby
30 mA
1 mA
50 mA
1 µA
* Access times are dependent on V
CC
and V
IO
operating ranges. See
Ordering
Information
page for further details.
V1: V
CC
= 3.0–3.6 V. V2: V
CC
= V
IO
= 2.7–3.6 V.
V3: V
IO
= 1.65–V
CC
, V
CC
= 3 V.
** Contact a sales representative for availability.
Publication Number
S70GL-P_00
Revision
01
Issue Date
December 4, 2006
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
(Advan ce
Infor m a tio n)
Table of Contents
General Description
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Distinctive Characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Performance Characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of Contents
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
List of Figures
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
List of Tables
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.
2.
Ordering Information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Recommended Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Input/Output Descriptions & Logic Symbol
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Special Handling Instructions for BGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2
LSE064—64 ball Fortified Ball Grid Array, 13 x 11 mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Memory Map
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Autoselect
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Erase And Programming Performance.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
BGA Package Capacitance
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Common Flash Memory Interface.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision Summary
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.
4.
5.
6.
7.
8.
List of Figures
Figure 2.1
Figure 2.2
64-ball Fortified Ball Grid Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
LSE064—64-ball Fortified Ball Grid Array (FBGA), 13 x 11 mm . . . . . . . . . . . . . . . . . . . . . . .6
List of Tables
Table 2.1
Table 3.1
Table 4.1
Table 5.1
Table 7.1
Table 7.2
Table 7.3
Table 7.4
Input/Output Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
S70GL02GP Sector & Memory Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Autoselect Addresses in System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Erase And Programming Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
CFI Query Identification String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
System Interface String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Device Geometry Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Primary Vendor-Specific Extended Query . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2
S70GL-P MirrorBit
TM
Flash Family
S70GL-P_00_01 December 4, 2006
D at a
S hee t
(Adva nce
In for m ation)
1.
Ordering Information
The ordering part number is formed by a valid combination of the following:
10
F
A
I
01
0
PACKING TYPE
0 = Tray (standard; see
(Note 1)
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER (V
IO
range, protection when WP# =V
IL
)
01 = V
IO
= V
CC
= 2.7 to 3.6 V, highest address sector protected
02 = V
IO
= V
CC
= 2.7 to 3.6 V, lowest address sector protected
V1 = V
IO
= 1.65 to V
CC
, V
CC
= 2.7 to 3.6 V, highest address sector protected
V2 = V
IO
= 1.65 to V
CC
, V
CC
= 2.7 to 3.6 V, lowest address sector protected
R1 = V
IO
= V
CC
= 3.0 to 3.6 V, highest address sector protected
R2 = V
IO
= V
CC
= 3.0 to 3.6 V, lowest address sector protected
TEMPERATURE RANGE
I = Industrial (–40
°
C to +85
°
C)
PACKAGE MATERIALS SET
A = Pb
(Note 3)
F = Pb-free
PACKAGE TYPE
F = Fortified Ball Grid Array, 1.0 mm pitch package
SPEED OPTION
11 = 110 ns
12 = 120 ns
13 = 130 ns
DEVICE NUMBER/DESCRIPTION
S70GL02GP
3.0 Volt-only, 2048 Megabit (256 M x 16-Bit/512 M x 8-Bit) Page-Mode Flash Memory
Manufactured on 90 nm MirrorBit
TM
process technology
S70GL02GP
S70GL02GP Valid Combinations
Base Part Number
Speed (ns)
11
S70GL02GP
12
13
Notes
1. Type 0 is standard. Specify other options as required.
2. BGA package marking omits leading “S70” and packing type designator from ordering part number.
3. Contact local sales representative for availability.
FAI , FFI
(Note 3)
Package &
Temperature
Model Number
R1, R2
01
(Note 3),
02
V1
(Note 3),
V2
0, 2, 3
(Note 1)
LSE064 (Fortified BGA)
(Note 2)
Pack Type
Package Description
1.1
Recommended Combinations
Recommended Combinations list configurations planned to be supported in volume for this device. Consult
your local sales office to confirm availability of specific recommended combinations and to check on newly
released combinations.
December 4, 2006 S70GL-P_00_01
S70GL-P MirrorBit
TM
Flash Family
3
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