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DPAM-08-14.0-S-8-2-A-K

Description
Board-to-Board & Mezzanine Connectors .085" X .100" DP Array Differential Pair Array Terminal
CategoryThe connector    The connector   
File Size506KB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
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DPAM-08-14.0-S-8-2-A-K Overview

Board-to-Board & Mezzanine Connectors .085" X .100" DP Array Differential Pair Array Terminal

DPAM-08-14.0-S-8-2-A-K Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSAMTEC
Reach Compliance Codecompliant
Factory Lead Time2 weeks
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD (30) OVER NICKEL (50)
Contact completed and terminatedMatte Tin (Sn) - with Nickel (Ni) barrier
Contact materialCOPPER ALLOY
JESD-609 codee3
F-214
DPAM–23–07.0–S–8–2–A
®
DPAF–23–03.0–S–8–2–A
(2,16 mm) .085"
DPAM, DPAF SERIES
HIGH DENSITY DIFFERENTIAL PAIR ARRAY
DPAM Mates with:
DPAF
DPAF Mates with:
DPAM
DPAM
PAIRS
PER ROW
07.0
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
OPTION
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?DPAM or
www.samtec.com?DPAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au over 50µ" (1,27 µm) Ni
Current Rating (2x3):
2.9 A per pin
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
10.4mΩ
Working Voltage:
300 VAC
Mated Cycles:
100 Cycles
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
– 04, –06
– 08, –15, –23
–8
–S
=30µ" (0,76 µm)
Gold on contact area,
Tin on solder tail
=Eight
Pair
Rows
–2
= Lead-Free
Tin Alloy
96.5% Sn/
3% Ag/.5% Cu
Solder Crimp
–K
=(20,00 mm) 0.80"
DIA Polyimide
film Pick &
Place Pad
–3
=Three
Pair
Rows
(2,54)
.100
–TR
=Tape & Reel
G1
Perimeter
Grounds (TYP)
–GP
=Guide Post
(–23 only)
A
(2,54)
.100
NO OF
ROWS
–8
–3
A
(24,59) .968
(11,89) .468
02 01 G2 03 04
Signal Pairs (TYP)
No. of positions x (2,16) .085 + (4,34) .171
(6,66)
.262
(2,16) .085
(1,27)
.050
(1,08) .0425
(1,27)
.050
DIA
(0,13)
.005
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
No. of positions x (2,16) .085 + (2,95) .116
DPAM/DPAF
Rated @ 3dB Insertion Loss*
10 mm Stack Height
Single-Ended Signaling
8 GHz / 16 Gbps
Differential Pair Signaling
7 GHz / 14 Gbps
*Performance data includes effects of a non-optimized PCB.
Complete test data available at www.samtec.com?DPAM,
www.samtec.com?DPAF or contact sig@samtec.com
cols
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Download app ppnote
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Contact SIG n protocols
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for questions
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PCI Express
SATA
InfiniBand
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MGT (Rock
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DPAF
PAIRS
PER ROW
03.0
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
OPTION
– 04, – 06, – 08,
–15, –23
–S
=30µ" (0,76 µm)
Gold on contact area,
Tin on solder tail
–8
=Eight
Pair Rows
–2
= Lead-Free Tin Alloy
96.5% Sn/ 3%Ag/
.5% Cu
Solder Crimp
–K
=(20,00 mm)
0.80" DIA
Polyimide
film
Pick &
Place Pad
–3
=Three
Pair Rows
Signal
Pairs
(TYP)
04
No. of positions x (2,16) .085 + (4,34) .171
G1
NO OF
ROWS
–8
–3
A
(23,32)
.918
(10,62)
.418
SIZE
–04 x –3
–06 x –3
–04 x –8
–06 x –8
–08 x –8
–15 x –8
–23 x –8
–08 x –3
–15 x –3
–23 x –3
USABLE PAIRS
PER ARRAY*
6 Pairs
12 Pairs
16 Pairs
32 Pairs
48 Pairs
–TR
=Tape
& Reel
ALSO AVAILABLE
(MOQ Required)
• Tin-Lead Solder Charge
• Other platings
Contact Samtec.
Note:
Patented
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
A
(1,52)
.060
(1,27) .050
G2
02
(2,54)
01
.100
Perimeter Grounds (TYP)
03
(6,45)
.254
(2,16) .085
Solder crimped on tail
(1,08) .0425
No. of positions x (2,16) .085 + (2,95) .116
(1,27)
.050
DIA
(0,13)
.005
DPAF
DPAM MATED
LEAD HEIGHT*
STYLE
–03.0
10 mm
–07.0
*Processing
conditions will
affect mated height.
(1,27)
.050
104 Pairs
168 Pairs
18 Pairs
39 Pairs
63 Pairs
*Assumes first and last pair in
each row are grounded
WWW.SAMTEC.COM

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