DPAM-08-14.0-S-8-2 datasheet, PDF

Datasheet> All Categories > The connector> The connector> DPAM-08-14.0-S-8-2

DPAM-08-14.0-S-8-2: DescriptionBoard-to-Board & Mezzanine Connectors .085" X .100" DP Array Differential Pair Array Terminal; CategoryThe connector The connector; File Size506KB，2 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/

Download Datasheet Parametric View All

DPAM-08-14.0-S-8-2 Overview

Board-to-Board & Mezzanine Connectors .085" X .100" DP Array Differential Pair Array Terminal

DPAM-08-14.0-S-8-2 Parametric

Parameter Name	Attribute value
Maker	SAMTEC
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	2 weeks
subject depth	0.262 inch
Connector type	BOARD STACKING CONNECTOR
Contact to complete cooperation	GOLD (30)
Contact completed and terminated	MATTE TIN
Contact point gender	MALE
Contact material	COPPER ALLOY
contact mode	RECTANGULAR
Contact resistance	10.4 mΩ
Contact style	BELLOWED TYPE
DIN compliance	NO
Durability	100 Cycles
Filter function	NO
IEC compliance	NO
Insulator color	BLACK
insulator material	LIQUID CRYSTAL POLYMER (LCP)
JESD-609 code	e3
MIL compliance	NO
Plug contact pitch	0.085 inch
Mixed contacts	NO
Installation option 1	LOCKING
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	16
Number of rows loaded	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Options	GENERAL PURPOSE
PCB contact pattern	MIXED
Plating thickness	30u inch
Rated current (signal)	2.9 A
Guideline	UL
reliability	COMMERCIAL
Terminal pitch	2.16 mm
Termination type	SURFACE MOUNT
Total number of contacts	48

Preview

Download Datasheet

View All

F-214

DPAM–23–07.0–S–8–2–A

DPAF–23–03.0–S–8–2–A

(2,16 mm) .085"

DPAM, DPAF SERIES

HIGH DENSITY DIFFERENTIAL PAIR ARRAY

DPAM Mates with:

DPAF

DPAF Mates with:

DPAM

PAIRS

PER ROW

07.0

PLATING

OPTION

NO. OF

ROWS

SOLDER

TYPE

OPTION

SPECIFICATIONS

For complete speciﬁcations and

recommended PCB layouts see

www.samtec.com?DPAM or

www.samtec.com?DPAF

Insulator Material:

Black LCP

Contact Material:

Copper Alloy

Plating:

Au over 50µ" (1,27 µm) Ni

Current Rating (2x3):

2.9 A per pin

Operating Temp Range:

-55°C to +125°C

Contact Resistance:

10.4mΩ

Working Voltage:

300 VAC

Mated Cycles:

100 Cycles

RoHS Compliant:

Yes

Lead-Free Solderable:

Yes

– 04, –06

– 08, –15, –23

–8

–S

=30µ" (0,76 µm)

Gold on contact area,

Tin on solder tail

=Eight

Pair

Rows

–2

= Lead-Free

Tin Alloy

96.5% Sn/

3% Ag/.5% Cu

Solder Crimp

–K

=(20,00 mm) 0.80"

DIA Polyimide

ﬁlm Pick &

Place Pad

–3

=Three

Pair

Rows

(2,54)

.100

–TR

=Tape & Reel

Perimeter

Grounds (TYP)

–GP

=Guide Post

(–23 only)

(2,54)

.100

NO OF

ROWS

–8

–3

(24,59) .968

(11,89) .468

02 01 G2 03 04

Signal Pairs (TYP)

No. of positions x (2,16) .085 + (4,34) .171

(6,66)

.262

(2,16) .085

(1,27)

.050

(1,08) .0425

(1,27)

.050

DIA

(0,13)

.005

RECOGNITIONS

For complete scope of

recognitions see

www.samtec.com/quality

No. of positions x (2,16) .085 + (2,95) .116

DPAM/DPAF

Rated @ 3dB Insertion Loss*

10 mm Stack Height

Single-Ended Signaling

8 GHz / 16 Gbps

Differential Pair Signaling

7 GHz / 14 Gbps

*Performance data includes effects of a non-optimized PCB.

Complete test data available at www.samtec.com?DPAM,

www.samtec.com?DPAF or contact sig@samtec.com

cols

roto rted

Supp

note

Download app ppnote

com/a

www.samtec.

@ samtec.co

Contact SIG n protocols

for questions

Fibre Chann

Rapid I/O

PCI Express

SATA

™

InfiniBand

XAUI

et I/O)

MGT (Rock

s at

DPAF

PAIRS

PER ROW

03.0

PLATING

OPTION

NO. OF

ROWS

SOLDER

TYPE

OPTION

– 04, – 06, – 08,

–15, –23

–S

=30µ" (0,76 µm)

Gold on contact area,

Tin on solder tail

–8

=Eight

Pair Rows

–2

= Lead-Free Tin Alloy

96.5% Sn/ 3%Ag/

.5% Cu

Solder Crimp

–K

=(20,00 mm)

0.80" DIA

Polyimide

ﬁlm

Pick &

Place Pad

–3

=Three

Pair Rows

Signal

Pairs

(TYP)

No. of positions x (2,16) .085 + (4,34) .171

NO OF

ROWS

–8

–3

(23,32)

.918

(10,62)

.418

SIZE

–04 x –3

–06 x –3

–04 x –8

–06 x –8

–08 x –8

–15 x –8

–23 x –8

–08 x –3

–15 x –3

–23 x –3

USABLE PAIRS

PER ARRAY*

6 Pairs

12 Pairs

16 Pairs

32 Pairs

48 Pairs

–TR

=Tape

& Reel

ALSO AVAILABLE

(MOQ Required)

• Tin-Lead Solder Charge

• Other platings

Contact Samtec.

Note:

Patented

Note:

Some sizes, styles and

options are non-standard,

non-returnable.

(1,52)

.060

(1,27) .050

(2,54)

.100

Perimeter Grounds (TYP)

(6,45)

.254

(2,16) .085

Solder crimped on tail

(1,08) .0425

No. of positions x (2,16) .085 + (2,95) .116

(1,27)

.050

DIA

(0,13)

.005

DPAF

DPAM MATED

LEAD HEIGHT*

STYLE

–03.0

10 mm

–07.0

*Processing

conditions will

affect mated height.

(1,27)

.050

104 Pairs

168 Pairs

18 Pairs

39 Pairs

63 Pairs

*Assumes ﬁrst and last pair in

each row are grounded

WWW.SAMTEC.COM

Recommended Resources

Three-phase multi-switch Buck type rectifier circuit

Recording and playback circuit with Dolby noise reduction function and detection method

Pulse width modulator circuit (1)

Circuit diagram of square wave generator with adjustable duty cycle composed of 555

Driving control circuit diagram operated by eight-speed button

DMAl2 composition diagram

【C2000 LaunchPad】High-precision CNC constant current and constant voltage synchronous rectification power supply: [color=#000000][font=宋体][size=5][b]【C2000 LaunchPad】High-precision CNC constant current and constant voltage synchronous rectification power supply [color=red]Function description: [/color][/b]Use C20...; IC爬虫 Microcontroller MCU

Abbreviations of some terms in hardware design: 1. What is BOM 2. What is LDO 3. What is ESR 4. What is TTL 5. What are MOS, NMOS, PMOS, CMOS 6. What are OC and OD 7. What are wired OR logic and wired AND logic 8. What is push-pull structure 9. Wha...; 呱呱 Embedded System

TI's Q&A on 12v lithium battery pure power measurement management chip: [b][size=4]TI's BQ series battery management system is very powerful, but sometimes problems arise when using it, especially for novices who want to do battery management. I have recently been working...; qwqwqw2088 Analogue and Mixed Signal

Design of airborne video identification card based on MB90092: Abstract : This paper introduces the design principle and hardware and software implementation of the dedicated video overlay chip MB90092 and the video identification card in a certain type of airbor...; rain MCU

Earn points, let me sink~~~: ...; jiangxuewz Embedded System

How to use the bootloader of LM3S5749: How to download the bootloader on the 5749 board. I know its function, but the board does not respond after downloading. Has anyone been able to do this? Can you tell me the steps to operate the bootl...; guozhiyang Microcontroller MCU

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components