defining a degree of excellence
HIGH SPEED LAN MAGNETICS
960017C
• Designed for use with AMD 79C872 10/100 Mbps
PHY transceiver
• Dual, 2-port and quad, 4-port design options offer
best board space, performance and cost per port
efficiency
• 40 pin, low profile surface mount package rated to
225ºC peak IR reflow temperature
• 2000 Vrms isolation
• 350µH OCL with 8mA DC bias applied
Return Loss
(dB) Min
30MHz-60MHz
Crosstalk
(dB) Min
1MHz-100MHz
Common to Diff
Mode Rej (dB) Min
30MHz 100MHz
Common to Common
Mode Rej (dB) Min
30MHz 100MHz
Schematic
ELECTRICALS AT 25ºC
Part No.
Insertion Loss
(dB) Typ
1MHz-100MHz
1MHz-30MHz
60MHz-80MHz
S558-5999-72
S558-5999-73
-1.0
-1.0
-16
-16
16-20log(f/30MHz)
16-20log(f/30MHz)
-10
-10
-35
-35
-50
-50
-40
-40
-40
-40
-30
-30
A
B
SCHEMATICS
A
B
MECHANICAL
Specifications subject to change without notice.
Bel Fuse Inc.
198 Van Vorst Street, Jersey City, NJ 07302 • Tel: 201-432-0463 • Fax: 201-432-9542 • E-Mail: BelFuse@belfuse.com
Website: http://www.belfuse.com
defining a degree of excellence
HIGH SPEED LAN MAGNETICS
960017C
APPLICATION CIRCUIT
APPLICATION NOTES
• Bel has designed these part types for use in either 100 Mbps or 10/100 Mbps multi-port applications with AMD's
79C872 PHY transceiver. These dual, 2-port and quad, 4-port devices provide high isolation transformers, wave
shaping, fast rise times, EMI and common mode noise suppression. All part types meet the IEEE 802.3 standards,
which includes a requirement for 350µH OCL (inductance) at 8mA DC bias applied.
• The S558-5999-72 includes impedance matching common mode termination on the transmit channel. Good circuit
balance on the board layout along with precise selection of the values and tolerances of the discrete external
components is critical for proper functionality of this termination. Refer to Bel's application note for proper implementation
of the impedance matched common mode termination and possible design considerations to eliminate its use.
• Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped on
tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility
with high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability. Each
part is optically inspected to meet rigid coplanarity requirements.
Specifications subject to change without notice.
Bel Fuse Inc.
198 Van Vorst Street, Jersey City, NJ 07302 • Tel: 201-432-0463 • Fax: 201-432-9542 • E-Mail: BelFuse@belfuse.com
Website: http://www.belfuse.com
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