RSCMNNI100KASE5 datasheet, PDF

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RSCMNNI100KASE5: DescriptionBoard Mount Pressure Sensor SMT, No Ports Absolute, 5V; CategoryThe sensor Pressure sensor Machine interface pressure sensor; File Size3MB，29 Pages; ManufacturerHoneywell; Websitehttp://www.ssec.honeywell.com/

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RSCMNNI100KASE5 Overview

Board Mount Pressure Sensor SMT, No Ports Absolute, 5V

RSCMNNI100KASE5 Parametric

Parameter Name	Attribute value
Maker	Honeywell
Product Category	Board interface pressure sensor
Shipping restrictions	Mouser does not currently sell this product.
series	RSC

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TruStability™ Board Mount Pressure Sensors

RSC Series—High Resolution, High Accuracy, Compensated

±1.6 mbar to ±10 bar | ±160 Pa to ±1 MPa | ±0.5 inH

O to ±150 psi

24-bit Digital SPI-Compatible Output

32321348

Issue C

Datasheet

FEATURES

• Pressure range: ±1.6 mbar to ±10 bar | ±160 Pa to ±1 MPa |

±0.5 inH

O to ±150 psi; absolute range 1 bar to 8 bar |

15 psi to 150 psi

• Pressure types: Absolute: internal vacuum reference and

an output value proportional to absolute pressure; Gage:

referenced to atmospheric pressure and provide an output

proportional to pressure variations from atmosphere;

Differential: allows measurement of pressure between the

two pressure ports

• Total Error Band: As low as ±0.25 %FSS depending on

pressure range (after auto zero)

• Accuracy: ±0.1 %FSS BFSL (Full Scale Span Best Fit Straight Line)

• Compensated temperature range: -40ºC to 85ºC [-40ºF to 185ºF]

• Power consumption: Less than 10 mW, typ.

• Size: Miniature 10 mm x 12,5 mm [0.39 in x 0.49 in] package

• Output: 24-bit digital SPI-compatible

• Meets IPC/JEDEC J-STD-020D.1 Moisture Sensitivity

Level 1 requirements

DIFFERENTIATION

• Industry-leading long-term stability: Minimizes system

calibration needs and significantly reduces downtime.

• Industry-leading accuracy: Reduces software to correct

system inaccuracies, which minimizes design time, helps

improve efficiency, and often simplifies development.

• Industry-leading flexibility: Modular design with many

package styles and options simplify integration.

• Total Error Band: Provides true performance over the

compensated temperature range, which eliminates the

need to test and calibrate every sensor, thereby reducing

manufacturing cost. Improves system accuracy and offers

ease of sensor interchangeability due to minimal part-to-

part variation (see Figure 1 on page 3).

POTENTIAL APPLICATIONS

• Medical: Airflow monitors, anesthesia machines, blood

analysis machines, gas chromatography, gas flow

instrumentation, hospital room air pressure, kidney dialysis

machines, nebulizers, pneumatic controls, respiratory

machines, sleep apnea equipment, spirometers, ventilators

• Industrial: Barometry, drones, flow calibrators, gas

chromatography, gas flow instrumentation, HVAC clogged

filter detection, HVAC systems, HVAC transmitters, indoor

air quality, life sciences, pneumatic control, VAV (Variable

Air Volume) control, weather balloons

PORTFOLIO

Honeywell offers a variety of board mount pressure sensors

for potential use in medical and industrial applications. Our

categories of pressure sensor measurement include absolute,

differential, gage or vacuum gage, with unamplified or

amplified sensors and covering a wide pressure range.

DESCRIPTION

The RSC Series is a piezoresistive silicon pressure sensor

offering a digital output for reading pressure over the

specified full scale pressure span and temperature range. It

is calibrated and temperature compensated for sensor offset,

sensitivity, temperature effects, and non-linearity using a

24-bit analog-to-digital converter with integrated EEPROM.

Pressure data may be acquired at rates between 20 and 2000

samples per second over an SPI interface. It is intended for

use with non-corrosive, non-ionic gases, such as air and other

dry gases, designed and manufactured according to ISO

9001 standards, and is REACH and RoHS compliant.

VALUE TO CUSTOMERS

• Enhances performance: Output accelerates performance

through reduced conversion requirements and direct

interface to microprocessors. Proprietary Honeywell

technology combines high sensitivity with high burst

and over pressure while providing industry leading

stability (performance factors difficult to achieve in the

same sensor), providing flexibility in implementation and

minimizing requirements for protecting the sensor without

sacrificing ability to sense very small changes in pressure.

• Cost-effective, high volume solution with a variety of

options.

• Enhances reliability: High burst pressures promote system

reliability, minimize downtime, and can simplify design.

High working pressures allow ultra-low sensors to be used

continuously above the calibrated pressure range.

• Easy to design in: Package is small when compared to many

similar sensors, occupying less area on the PCB. Port and

housing options simplify integration. Wide pressure range

simplifies use.

• Meets IPC/JEDEC J-STD-020D.1 Moisture Sensitivity

Level 1 requirements: Allows avoidance of thermal and

mechanical damage during solder reflow attachment

and/or repair that lesser rated sensors would incur, allows

unlimited floor life when stored as specified (simplifying

storage and reducing scrap), eliminates lengthy bakes prior

to reflow, and allows for lean manufacturing due to stability

and usability shortly after reflow.

• Energy efficient: Reduces system power requirements and

enables extended battery life.

Sensing and Internet of Things

TruStability™ Board Mount Pressure Sensors

RSC Series

Table of Contents

General Specifications

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5

Nomenclature and Order Guide

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Pressure Range Specifications

±1.6 mbar to ±10 bar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

±160 Pa to ±1 MPa . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

±0.5 inH

O to ±150 psi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Dimensional Drawings

DIP Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-12

SMT Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-14

Recommended PCB Pad Layouts

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Pinout

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Recommended Circuit

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

1.0

System Overview

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

1.1 Major System Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

1.2 High-level Operating Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

1.3 Compensation Mathematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.0

System Initialization – EEPROM

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2.1 EEPROM Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18-19

2.2 EEPROM Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-21

3.0

System Operation – ADC

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.1 ADC Communications and Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.2 Programming the Data Rate and Pressure/Temperature Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.3 ADC Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.4 ADC Programming Sequence – Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.5 ADC Programming and Read Sequence – Temperature Reading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-24

3.6 ADC Programming and Read Sequence – Pressure Reading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

4.0

Example Software

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

4.1 Data Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

4.2 Function Descriptions – Pressure_Comp.c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-26

4.3 Checksum Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

4.4 Compensation Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

4.5 Constraints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

5.0

Sensor Offset Zero Correction Procedure

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Additional Information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . back page

sensing.honeywell.com

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