Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
QSOP
Junction-to-Ambient Thermal Resistance (θ
JA
)...............105°C/W
Junction-to-Case Thermal Resistance (θ
JC
)......................37°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
DD
= 2.7V to 3.6V (MAX11635/MAX11637), V
DD
= 4.75V to 5.25V (MAX11634/MAX11636), f
SAMPLE
= 300kHz, f
SCLK
= 4.8MHz
(external clock, 50% duty cycle), V
REF
= 2.5V (MAX11635/MAX11637), V
REF
= 4.096V (MAX11634/MAX11636) T
A
= T
MIN
to T
MAX
,
unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER
DC ACCURACY (Note 3)
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Offset Error Temperature
Coefficient
Gain Temperature Coefficient
Channel-to-Channel Offset
Matching
DYNAMIC SPECIFICATIONS (30kHz sine-wave input, 300ksps, f
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Microcontroller MCU
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