S29GL032M10TCCR30 datasheet, PDF

Datasheet> All Categories > S29GL032M10TCCR30

Preview

S29GL032M10TCCR30: Description256,128,64,32,Megabit 3.0 Volt-only Page Mode Flash Memory featuring 0.23 レm MirrorBit Process Technology; File Size2MB，116 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

Download Datasheet View All

S29GL032M10TCCR30 Overview

256,128,64,32,Megabit 3.0 Volt-only Page Mode Flash Memory featuring 0.23 レm MirrorBit Process Technology

Preview

Download Datasheet

View All

S29GL-M MirrorBit

Flash Family

S29GL256M, S29GL128M, S29GL064M, S29GL032M

256 Megabit, 128 Megabit, 64 Megabit, and 32 Megabit,

3.0 Volt-only Page Mode Flash Memory featuring

0.23 µm MirrorBit Process Technology

Data Sheet

This product family has been retired and is not recommended for designs. For new and current designs, S29GL032A, S29GL064A, S29GL128N, and S29GL256N supersede S29GL032M,

S29GL064M, S29GL128M, and S29GL256M respectively. These are the factory-recommended migration paths. Please refer to the S29GL-A and S29GL-N Datasheets for specifications

and ordering information. Availability of this document is retained for reference and historical purposes only.

Notice to Readers:

This document states the current technical specifications

regarding the Spansion product(s) described herein. Spansion Inc. deems the

products to have been in sufficient production volume such that subsequent

versions of this document are not expected to change. However, typographical

or specification corrections, or modifications to the valid combinations offered

may occur.

Publication Number

S29GL-M_00

Revision

Amendment

Issue Date

October 10, 2006

D a t a

S h e e t

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise

readers of product information or intended specifications throughout the product life cycle, in-

cluding development, qualification, initial production, and full production. In all cases, however,

readers are encouraged to verify that they have the latest information before finalizing their de-

sign. The following descriptions of Spansion data sheet designations are presented here to high-

light their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more

specific products, but has not committed any design to production. Information presented in a

document with this designation is likely to change, and in some cases, development on the prod-

uct may discontinue. Spansion Inc. therefore places the following conditions upon Advance Infor-

mation content:

“This document contains information on one or more products under development at Spansion Inc. The

information is intended to help you evaluate this product. Do not design in this product without con-

tacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a

commitment to production has taken place. This designation covers several aspects of the prod-

uct life cycle, including product qualification, initial production, and the subsequent phases in the

manufacturing process that occur before full production is achieved. Changes to the technical

specifications presented in a Preliminary document should be expected while keeping these as-

pects of production under consideration. Spansion places the following conditions upon Prelimi-

nary content:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. The Preliminary status of this document indicates that product qualification has been completed,

and that initial production has begun. Due to the phases of the manufacturing process that require

maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-

tions due to changes in technical specifications.”

Combination

Some data sheets will contain a combination of products with different designations (Advance In-

formation, Preliminary, or Full Production). This type of document will distinguish these products

and their designations wherever necessary, typically on the first page, the ordering information

page, and pages with DC Characteristics table and AC Erase and Program table (in the table

notes). The disclaimer on the first page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal

changes are expected, the Preliminary designation is removed from the data sheet. Nominal

changes may include those affecting the number of ordering part numbers available, such as the

addition or deletion of a speed option, temperature range, package type, or V

range. Changes

may also include those needed to clarify a description or to correct a typographical error or incor-

rect specification. Spansion Inc. applies the following conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. Spansion Inc. deems the products to have been in sufficient production volume such that sub-

sequent versions of this document are not expected to change. However, typographical or specification

corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local sales office.

S29GL-M MirrorBit

Flash Family

S29GL-M_00_B6 October 10, 2006

D a t a

S h e e t

General Description

The S29GL256/128/064/032M family of devices are 3.0 V single power Flash memory manufac-

tured using 0.23 µm MirrorBit technology. The S29GL256M is a 256†Mbit, organized as 16,777,216

words or 33,554,432 bytes. The S29GL128M is a 128 Mbit, organized as 8,388,608 words or

16,777,216 bytes. The S29GL064M is a 64 Mbit, organized as 4,194,304 words or 8,388,608 bytes.

The S29GL032M is a 32 Mbit, organized as 2,097,152 words or 4,194,304 bytes. Depending on the

model number, the devices have an 8-bit wide data bus only, 16-bit wide data bus only, or a 16-bit

wide data bus that can also function as an 8-bit wide data bus by using the BYTE# input. The devices

can be programmed either in the host system or in standard EPROM programmers.

Access times as fast as 90 ns (S29GL128M, S29GL064M, S29GL032M) or 100 ns (S29GL256M) are

available. Note that each access time has a specific operating voltage range (V

) as specified in

Product Selector Guide

and the

Ordering Information

sections starting on

page 16.

Package offer-

ings include 40-pin TSOP, 48-pin TSOP, 56-pin TSOP, 48-ball fine-pitch BGA, 63-ball fine-pitch BGA

and 64-ball Fortified BGA, depending on model number. Each device has separate chip enable

(CE#), write enable (WE#) and output enable (OE#) controls.

Each device requires only a

single 3.0 volt power supply

for both read and write functions. In

addition to a V

input, a high-voltage

accelerated program (ACC)

feature provides shorter pro-

gramming times through increased current on the WP#/ACC input. This feature is intended to

facilitate factory throughput during system production, but may also be used in the field if desired.

The device is entirely command set compatible with the

JEDEC single-power-supply Flash stan-

dard.

Commands are written to the device using standard microprocessor write timing. Write cycles

also internally latch addresses and data needed for the programming and erase operations.

The

sector erase architecture

allows memory sectors to be erased and reprogrammed without

affecting the data contents of other sectors. The device is fully erased when shipped from the

factory.

Device programming and erasure are initiated through command sequences. Once a program or

erase operation starts, the host system need only poll the DQ7 (Data# Polling) or DQ6 (toggle)

sta-

tus bits

or monitor the

Ready/Busy# (RY/BY#)

output to determine whether the operation is

complete. To facilitate programming, an

Unlock Bypass

mode reduces command sequence over-

head by requiring only two write cycles to program data instead of four.

Hardware data protection

measures include a low V

detector that automatically inhibits write

operations during power transitions. The hardware sector protection feature disables both program

and erase operations in any combination of sectors of memory. This can be achieved in-system or

via programming equipment.

The

Erase Suspend/Erase Resume

feature allows the host system to pause an erase operation

in a given sector to read or program any other sector and then complete the erase operation. The

Program Suspend/Program Resume

feature enables the host system to pause a program op-

eration in a given sector to read any other sector and then complete the program operation.

The

hardware RESET# pin

terminates any operation in progress and resets the device, after

which it is then ready for a new operation. The RESET# pin may be tied to the system reset circuitry.

A system reset would thus also reset the device, enabling the host system to read boot-up firmware

from the Flash memory device.

The device reduces power consumption in the

standby mode

when it detects specific voltage levels

on CE# and RESET#, or when addresses are stable for a specified period of time.

The

Write Protect (WP#)

feature protects the first or last sector by asserting a logic low on the

WP#/ACC pin or WP# pin, depending on model number. The protected sector is still protected even

during accelerated programming.

The

Secured Silicon Sector

provides a 128-word/256-byte area for code or data that can be per-

manently protected. Once this sector is protected, no further changes within the sector can occur.

Spansion MirrorBit flash technology combines years of Flash memory manufacturing experience to

produce the highest levels of quality, reliability and cost effectiveness. The device electrically erases

all bits within a sector simultaneously via hot-hole assisted erase. The data is programmed using

hot electron injection.

S29GL-M MirrorBit

Flash Family

S29GL-M_00_B6 October 10, 2006

D a t a

S h e e t

Table of Contents

Distinctive Characteristics . . . . . . . . . . . . . . . . . . . . 1

General Description . . . . . . . . . . . . . . . . . . . . . . . . 2

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . .5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .6

For S29GL064M (model R0) only ....................................................................7

For S29GL064M (model R0) only .................................................................. 10

For S29GL032M (model R0) only .................................................................. 12

Unprotection Address Table ................................................. 49

Table 23. S29GL064M (Models R1, R2, R8, R9) Sector Group

Protection/Unprotection Addresses ....................................... 49

Table 24. S29GL064M (Model R3) Sector Group Protection/

Unprotection Address Table ................................................. 50

Table 26. S29GL064M (Model R5) Sector Group Protection/

Unprotection Addresses ...................................................... 51

Table 27. S29GL064M (Models R6, R7) Sector Group Protection/

Unprotection Address ......................................................... 51

Table 28. S29GL128M Sector Group Protection/Unprotection

Addresses ......................................................................... 51

Table 29. S29GL256M Sector Group Protection/Unprotection

Addresses ......................................................................... 52

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Logic Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

S29GL064M (Models R1, R2, R8, R9) ............................................................ 14

S29GL064M (Models R3, R4) .......................................................................... 14

S29GL064M (Model R5) .....................................................................................15

S29GL064M (Model R6, R7) .............................................................................15

S29GL128M .............................................................................................................15

Temporary Sector Group Unprotect .......................................................... 53

Figure 1. Temporary Sector Group Unprotect Operation.......... 53

Figure 2. In-System Sector Group Protect/Sector Group Unprotect

Algorithms........................................................................ 54

Ordering Information: S29GL032M . . . . . . . . . . . . 16

S29GL032M Standard Products ...................................................................... 16

Table 1. S29GL032M Ordering Options ................................. 17

Ordering Information: S29GL064M . . . . . . . . . . . 18

S29GL064M Standard Products ...................................................................... 18

Table 2. S29GL064M Ordering Options ................................. 19

Ordering Information: S29GL128M . . . . . . . . . . . .20

Table 3. S29GL128M Ordering Options ................................. 20

Secured Silicon Sector Flash Memory Region ........................................... 55

Write Protect (WP#) ....................................................................................... 56

Hardware Data Protection ............................................................................. 56

Low VCC Write Inhibit ................................................................................ 56

Write Pulse “Glitch” Protection ............................................................... 56

Logical Inhibit ................................................................................................... 56

Power-Up Write Inhibit ............................................................................... 56

Common Flash Memory Interface (CFI) . . . . . . . 57

Table 30. CFI Query Identification String .............................. 57

Table 31. System Interface String ........................................ 57

Table 32. Device Geometry Definition ................................... 58

Table 33. Primary Vendor-Specific Extended Query ................ 59

Ordering Information: S29GL256M . . . . . . . . . . . . 21

Table 4. S29GL256M Ordering Options ................................. 21

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 22

Table 5. Device Bus Operations ........................................... 22

Word/Byte Configuration ............................................................................... 22

Requirements for Reading Array Data ........................................................ 22

Page Mode Read ..................................................................................................23

Writing Commands/Command Sequences .................................................23

Write Buffer .....................................................................................................23

Accelerated Program Operation ...............................................................23

Autoselect Functions .....................................................................................23

Standby Mode ...................................................................................................... 24

Automatic Sleep Mode ..................................................................................... 24

RESET#: Hardware Reset Pin ........................................................................ 24

Output Disable Mode ....................................................................................... 24

Table 6. S29GL032M (Model R0) Sector Addresses ................ 25

Table 7. S29GL032M (Models R1, R2) Sector Addresses ......... 26

Table 8. S29GL032M (Model R3)

Top Boot Sector Addresses ................................................. 27

Table 9. S29GL032M (Model R4)

Bottom Boot Sector Addresses ............................................ 28

Table 11. S29GL064M (Models R1, R2, R8, R9)

Sector Addresses .............................................................. 30

Table 14. S29GL064M (Model R5, R6, R7) Sector Addresses ... 37

Table 16. S29GL256M Sector Address Table ......................... 41

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 60

Reading Array Data ...........................................................................................60

Reset Command .................................................................................................60

Autoselect Command Sequence .....................................................................61

Enter/Exit Secured Silicon Sector Command Sequence ..........................61

Word Program Command Sequence .......................................................61

Unlock Bypass Command Sequence ........................................................ 62

Write Buffer Programming .......................................................................... 62

Accelerated Program .................................................................................... 63

Figure 3. Write Buffer Programming Operation ...................... 64

Figure 4. Program Operation ............................................... 65

Program Suspend/Program Resume Command Sequence .................... 65

Figure 5. Program Suspend/Program Resume........................ 66

Chip Erase Command Sequence ...................................................................66

Sector Erase Command Sequence ................................................................66

Figure 6. Erase Operation ................................................... 67

Erase Suspend/Erase Resume Commands ..................................................68

Command Definitions .......................................................................................69

Write Operation Status .................................................................................... 71

DQ7: Data# Polling ............................................................................................. 71

Table 34. Command Definitions( x16 Mode, BYTE# = V

) ...... 69

Table 35. Command Definitions (x8 Mode, BYTE# = V

) ........ 70

Autoselect Mode .................................................................................................47

Table 17. Autoselect Codes, (High Voltage Method) ............... 47

Table 18. S29GL032M (Model R0) Sector Group Protection/

Unprotection Addresses ...................................................... 48

Table 19. S29GL032M (Models R1, R2) Sector Group Protection/

Unprotection Addresses ...................................................... 48

Table 20. S29GL032M (Model R3) Sector Group Protection/

Unprotection Address Table ................................................ 48

Table 21. S29GL032M (Model R4) Sector Group Protection/

Unprotection Address Table ................................................ 49

Table 22. S29GL064M (Model 00) Sector Group Protection/

Figure 7. Data# Polling Algorithm ........................................ 72

RY/BY#: Ready/Busy# ....................................................................................... 72

DQ6: Toggle Bit I ............................................................................................... 72

Figure 8. Toggle Bit Algorithm ............................................. 74

DQ2: Toggle Bit II .............................................................................................. 74

DQ5: Exceeded Timing Limits ........................................................................ 75

DQ3: Sector Erase Timer ................................................................................ 75

DQ1: Write-to-Buffer Abort ........................................................................... 75

Table 36. Write Operation Status ......................................... 76

October 10, 2006 S29GL-M_00_B6

S29GL-M MirrorBit

Flash Family

Recommended Resources

Boost circuit topology

Monolithic voltage stabilizing integrated block HV-2405 circuit

DC motor speed control circuit

Entertainment heart rhythm monitor

B ultra high voltage generator circuit

BX-1387/Bx-1407 (TV, VCR, audio equipment and air conditioner) infrared remote control receiving circuit

EEWORLD University Hall----Live Replay: Renesas Electronics R-Car Advanced Driver Assistance System Solution: Live replay: Renesas Electronics R-Car Advanced Driver Assistance System Solution : https://training.eeworld.com.cn/course/67823...; hi5 Integrated technical exchanges

ARM7+W5300 source code: I want to complete the analog-to-digital conversion experiment of two channels through ARM7+W5300, but I don’t know how to write the source code? ? Can anyone help me?...; Horace88 ARM Technology

What do you think of this type of training provided by Mingda Technology?: What do you think of the training provided by Mindak? There is also a chance to go to Japan?...; succeedzcs Embedded System

【Contribute to C2000】【Recommended Papers by the Organizing Committee】Excellent Papers of Hubei TI Cup: Excellent paper of Hubei Province.[[i] This post was last edited by wanghongyang on 2011-4-25 20:23[/i]]...; wanghongyang Microcontroller MCU

Keysight Technologies Live Review: Evolution and Updates in Signal Integrity Testing: Live broadcast time: April 30 (Friday) 10:00-11:30 amLive broadcast topic: Evolution and updates of signal integrity testingWatch replay: Click to watchQA summary:1. What operating systems does the MX...; EEWORLD社区 Test/Measurement

The use and explanation of TMS320F28335 interrupt priority and interrupt nesting: When using interrupts, it is necessary to deal with nested interrupts. Let's take a look at how 28335 implements nested interrupts. 1,28335 interrupts are disabled by default. After entering the inter...; 灞波儿奔 Microcontroller MCU

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components