Write Flash Memory with VersatileI/O™ featuring 170 nm
Process Technology
Data Sheet
PRELIMINARY
Notice to Readers:
This document states the current technical specifications
regarding the Spansion product(s) described herein. The Preliminary status of
this document indicates that product qualification has been completed, and
that initial production has begun. Due to the phases of the manufacturing
process that require maintaining efficiency and quality, this document may be
revised by subsequent versions or modifications due to changes in technical
specifications.
Note:
This document supercedes datasheet information for the S29CD016G revision A4, and
S29CD032G revision B0. The S29CD-G device is the factory-recommended migration path.
Please refer to specifications and ordering information found in this document.
Publication Number
S29CD-G_00
Revision
B
Amendment
0
Issue Date
November 14, 2005
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
P r e l i m i n a r y
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise
readers of product information or intended specifications throughout the product life cycle, includ-
ing development, qualification, initial production, and full production. In all cases, however,
readers are encouraged to verify that they have the latest information before finalizing their de-
sign. The following descriptions of Spansion data sheet designations are presented here to
highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more spe-
cific products, but has not committed any design to production. Information presented in a
document with this designation is likely to change, and in some cases, development on the prod-
uct may discontinue. Spansion LLC therefore places the following conditions upon Advance
Information content:
“This document contains information on one or more products under development at Spansion LLC. The
information is intended to help you evaluate this product. Do not design in this product without con-
tacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a
commitment to production has taken place. This designation covers several aspects of the product
life cycle, including product qualification, initial production, and the subsequent phases in the
manufacturing process that occur before full production is achieved. Changes to the technical
specifications presented in a Preliminary document should be expected while keeping these as-
pects of production under consideration. Spansion places the following conditions upon
Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. The Preliminary status of this document indicates that product qualification has been completed,
and that initial production has begun. Due to the phases of the manufacturing process that require
maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-
tions due to changes in technical specifications.”
Combination
Some data sheets will contain a combination of products with different designations (Advance In-
formation, Preliminary, or Full Production). This type of document will distinguish these products
and their designations wherever necessary, typically on the first page, the ordering information
page, and pages with DC Characteristics table and AC Erase and Program table (in the table
notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal
changes are expected, the Preliminary designation is removed from the data sheet. Nominal
changes may include those affecting the number of ordering part numbers available, such as the
addition or deletion of a speed option, temperature range, package type, or V
IO
range. Changes
may also include those needed to clarify a description or to correct a typographical error or incor-
rect specification. Spansion LLC applies the following conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s) described
herein. Spansion LLC deems the products to have been in sufficient production volume such that sub-
sequent versions of this document are not expected to change. However, typographical or specification
corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local AMD or Fujitsu
sales office.
ii
S29CD-G Flash Family
S29CD-G_00_B0 November 14, 2005
S29CD-G Flash Family
S29CD032G, S29CD016G
32 Megabit (1M x 32-Bit), 16 Megabit (512K x 32-Bit)
Write Flash Memory with VersatileI/O™ featuring 170 nm
Process Technology
Data Sheet
PRELIMINARY
Distinctive Characteristics
Architecture Advantages
Simultaneous Read/Write operations
— Read data from one bank while executing erase/
program functions in other bank
— Zero latency between read and write operations
— Two bank architecture: large bank/small bank
75%/25%
User-Defined x32 Data Bus
Dual Boot Block
— Top and bottom boot sectors in the same device
Flexible sector architecture
— CD032G: Eight 2K Double Word, Sixty-two 16K
Double Word, and Eight 2K Double Word sectors
— CD016G: Eight 2K Double Word, Thirty-two 16K
Double Word, and Eight 2K Double Word sectors
Secured Silicon Sector (256 Bytes)
—
Factory locked and identifiable:
16 bytes for secure,
random factory Electronic Serial Number; Also know
as Electronic Marking
Manufactured on 170 nm Process Technology
Programmable Burst interface
— Interfaces to any high performance processor
— Linear Burst Read Operation: 2, 4, and 8 double
word linear burst with or without wrap around
Program Operation
— Performs synchronous and asynchronous write
operations of burst configuration register settings
independently
Single power supply operation
— Optimized for 2.5 to 2.75 volt read, erase, and
program operations
Compatibility with JEDEC standards (JC42.4)
— Software compatible with single-power supply Flash
— Backward-compatible with AMD/Fujitsu Am29LV/
MBM29LV and Am29F/MBM29F flash memories
— Standby mode: CMOS: 60 µA max
1 million write cycles per sector typical
20 year data retention typical
VersatileI/O™ control
— Generates data output voltages and tolerates data
input voltages as determined by the voltage on the
V
IO
pin
— 1.65 V to 3.60 V compatible I/O signals
Software Features
Persistent Sector Protection
— Locks combinations of individual sectors and sector
groups to prevent program or erase operations
within that sector (requires only V
CC
levels)
Password Sector Protection
— Locks combinations of individual sectors and sector
groups to prevent program or erase operations
within that sector using a user-definable 64-bit
password
Supports Common Flash Interface (CFI)
Unlock Bypass Program Command
— Reduces overall programming time when issuing
multiple program command sequences
Data# Polling and toggle bits
— Provides a software method of detecting program or
erase operation completion
Hardware Features
Program Suspend/Resume & Erase Suspend/
Resume
— Suspends program or erase operations to allow
reading, programming, or erasing in same bank
Hardware Reset (RESET#), Ready/Busy# (RY/
BY#), and Write Protect (WP#) inputs
ACC input
— Accelerates programming time for higher throughput
during system production
Package options
— 80-pin PQFP
— 80-ball Fortified BGA
— Pb-free package option also available
— Known Good Die
Performance Characteristics
High performance read access
— Initial/random access times of 48 ns (32 Mb) and 54
ns (16 Mb)
— Burst access times of 7.5 ns (32 Mb) or 9 ns (16Mb)
Ultra low power consumption
— Burst Mode Read: 90 mA @ 75 MHz max
— Program/Erase: 50 mA max
Publication Number
S29CD-G_00
Revision
B
Amendment
0
Issue Date
November 14, 2005
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
P r e l i m i n a r y
General Description
The S29CD-G Flash Family is a burst mode, Dual Boot, Simultaneous Read/Write family of Flash
Memory with VersatileI/O™ manufactured on 170 nm Process Technology.
The S29CD032G is a 32 Megabit, 2.6 Volt-only (2.50 V - 2.75 V) single power supply burst mode
flash memory device that can be configured for 1,048,576 double words.
The S29CD016G is a 16 Megabit, 2.6 Volt-only (2.50 V - 2.75 V) single power supply burst mode
flash memory device that can be configured for 524,288 double words.
To eliminate bus contention, each device has separate chip enable (CE#), write enable (WE#) and
output enable (OE#) controls. Additional control inputs are required for synchronous burst oper-
ations: Load Burst Address Valid (ADV#), and Clock (CLK).
Each device requires only a single 2.6 Volt-only (2.50 V – 2.75 V) for both read and write func-
tions. A 12.0-volt V
PP
is not required for program or erase operations, although an acceleration
pin is available if faster programming performance is required.
The device is entirely command set compatible with the JEDEC single-power-supply Flash stan-
dard. The software command set is compatible with the command sets of the 5 V Am29F or
MBM29F and 3 V Am29LV or MBM29LV Flash families. Commands are written to the command
register using standard microprocessor write timing. Register contents serve as inputs to an in-
ternal state-machine that controls the erase and programming circuitry. Write cycles also
internally latch addresses and data needed for the programming and erase operations. Reading
data out of the device is similar to reading from other Flash or EPROM devices.
The
Unlock Bypass
mode facilitates faster programming times by requiring only two write cycles
to program data instead of four.
The
Simultaneous Read/Write architecture
provides simultaneous operation by dividing the
memory space into two banks. The device can begin programming or erasing in one bank, and
then simultaneously read from the other bank, with zero latency. This releases the system from
waiting for the completion of program or erase operations. See
Simultaneous Read/Write Opera-
tions Overview.
The device provides a 256-byte
Secured Silicon Sector
that contains Electronic Marking Infor-
mation for easy device traceability.
In addition, the device features several levels of sector protection, which can disable both the pro-
gram and erase operations in certain sectors or sector groups:
Persistent Sector Protection
is
a command sector protection method that replaces the old 12 V controlled protection method;
Password Sector Protection
is a highly sophisticated protection method that requires a pass-
word before changes to certain sectors or sector groups are permitted;
WP# Hardware
Protection
prevents program or erase in the two outermost 8 Kbytes sectors of the larger bank.
The device defaults to the Persistent Sector Protection mode. The customer must then choose if
the Standard or Password Protection method is most desirable. The WP# Hardware Protection
feature is always available, independent of the other protection method chosen.
The
VersatileI/O™ (V
CCQ
)
feature allows the output voltage generated on the device to be de-
termined based on the V
IO
level. This feature allows this device to operate in the 1.8 V I/O
environment, driving and receiving signals to and from other 1.8 V devices on the same bus.
The host system can detect whether a program or erase operation is complete by observing the
RY/BY# pin, by reading the DQ7 (Data# Polling), or DQ6 (toggle)
status bits.
After a program
or erase cycle is completed, the device is ready to read array data or accept another command.
The
sector erase architecture
allows memory sectors to be erased and reprogrammed without
affecting the data contents of other sectors. The device is fully erased when shipped from the
factory.
2
S29CD-G Flash Family
S29CD-G_00_B0 November 14, 2005
P r e l i m i n a r y
Hardware data protection
measures include a low V
CC
detector that automatically inhibits write
operations during power transitions. The
password and software sector protection
feature
disables both program and erase operations in any combination of sectors of memory. This can
be achieved in-system at V
CC
level.
The
Program/Erase Suspend/Erase Resume
feature enables the user to put erase on hold
for any period of time to read data from, or program data to, any sector that is not selected for
erasure. True background erase can thus be achieved.
The
hardware RESET# pin
terminates any operation in progress and resets the internal state
machine to reading array data.
The device offers two power-saving features. When addresses are stable for a specified amount
of time, the device enters the
automatic sleep mode.
The system can also place the device into
the
standby mode.
Power consumption is greatly reduced in both these modes.
AMD’s Flash technology combines years of Flash memory manufacturing experience to produce
the highest levels of quality, reliability and cost effectiveness. The device electrically erases all
bits within a sector simultaneously via Fowler-Nordheim tunnelling. The data is programmed
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Embedded System
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