S29AL016M10FAI023 datasheet, PDF

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S29AL016M10FAI023: Description16 Megabit (2 M x 8-Bit/1 M x 16-Bit) 3.0 Volt-only Boot Sector Flash Memory Featuring MirrorBit⑩ Technology; Categorystorage storage; File Size979KB，62 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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S29AL016M10FAI023 Overview

16 Megabit (2 M x 8-Bit/1 M x 16-Bit) 3.0 Volt-only Boot Sector Flash Memory Featuring MirrorBit⑩ Technology

S29AL016M10FAI023 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SPANSION
Parts packaging code	BGA
package instruction	13 X 11 MM, FBGA-64
Contacts	64
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum access time	100 ns
Other features	BOTTOM BOOT BLOCK
Spare memory width	8
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B64
JESD-609 code	e0
length	13 mm
memory density	16777216 bi
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	1,2,1,31
Number of terminals	64
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.4 mm
Department size	16K,8K,32K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
switch bit	YES
type	NOR TYPE
width	11 mm

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S29AL016M

16 Megabit (2 M x 8-Bit/1 M x 16-Bit)

3.0 Volt-only Boot Sector Flash Memory

Featuring MirrorBit™ Technology

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not recommended for designs. For new

and current designs, S29AL016D supersedes S29AL016M and is the factory-

recommended migration path for this device. Please refer to the S29AL016D

Datasheet for specifications and ordering information. Availability of this

document is retained for reference and historical purposes only.

Notice to Readers:

This document states the current technical specifications

regarding the Spansion product(s) described herein. Spansion Inc. deems the

products to have been in sufficient production volume such that subsequent

versions of this document are not expected to change. However, typographical

or specification corrections, or modifications to the valid combinations offered

may occur.

Publication Number

S29AL016M_00

Revision

Amendment

Issue Date

October 11, 2006

D a t a

S h e e t

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise

readers of product information or intended specifications throughout the product life cycle, includ-

ing development, qualification, initial production, and full production. In all cases, however,

readers are encouraged to verify that they have the latest information before finalizing their de-

sign. The following descriptions of Spansion data sheet designations are presented here to

highlight their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more spe-

cific products, but has not committed any design to production. Information presented in a

document with this designation is likely to change, and in some cases, development on the prod-

uct may discontinue. Spansion Inc. therefore places the following conditions upon Advance

Information content:

“This document contains information on one or more products under development at Spansion Inc. The

information is intended to help you evaluate this product. Do not design in this product without con-

tacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a

commitment to production has taken place. This designation covers several aspects of the product

life cycle, including product qualification, initial production, and the subsequent phases in the

manufacturing process that occur before full production is achieved. Changes to the technical

specifications presented in a Preliminary document should be expected while keeping these as-

pects of production under consideration. Spansion places the following conditions upon

Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. The Preliminary status of this document indicates that product qualification has been completed,

and that initial production has begun. Due to the phases of the manufacturing process that require

maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-

tions due to changes in technical specifications.”

Combination

Some data sheets will contain a combination of products with different designations (Advance In-

formation, Preliminary, or Full Production). This type of document will distinguish these products

and their designations wherever necessary, typically on the first page, the ordering information

page, and pages with DC Characteristics table and AC Erase and Program table (in the table

notes). The disclaimer on the first page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal

changes are expected, the Preliminary designation is removed from the data sheet. Nominal

changes may include those affecting the number of ordering part numbers available, such as the

addition or deletion of a speed option, temperature range, package type, or V

range. Changes

may also include those needed to clarify a description or to correct a typographical error or incor-

rect specification. Spansion Inc. applies the following conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. Spansion Inc. deems the products to have been in sufficient production volume such that sub-

sequent versions of this document are not expected to change. However, typographical or specification

corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local sales office.

S29AL016M

S29AL016M_00_A7 October 11, 2006

D a t a

S h e e t

Table of Contents

Distinctive Characteristics . . . . . . . . . . . . . . . . . . . 1

Architectural Advantages ..............................................................................

Performance Characteristics ........................................................................

Software Features ............................................................................................

Hardware Features .........................................................................................

Program Suspend/Program Resume Command Sequence .................... 30

Figure 6. Program Suspend/Program Resume........................ 31

Command Definitions Tables ......................................................................... 32

General Description . . . . . . . . . . . . . . . . . . . . . . . . 2

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 7

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 10

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 11

Table 1. S29AL016M Device Bus Operations ......................... 11

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 34

Table 10. Command Definitions (x16 Mode, BYTE# = V

) ...... 32

Table 11. Command Definitions (x8 Mode, BYTE# = V

) ........ 33

DQ7: Data# Polling ............................................................................................ 34

Figure 7. Data# Polling Algorithm ........................................ 35

RY/BY#: Ready/Busy# ....................................................................................... 35

DQ6: Toggle Bit I ............................................................................................... 36

DQ2: Toggle Bit II .............................................................................................. 36

Reading Toggle Bits DQ6/DQ2 ..................................................................... 37

Figure 8. Toggle Bit Algorithm ............................................. 38

DQ5: Exceeded Timing Limits ........................................................................ 38

DQ3: Sector Erase Timer ................................................................................ 39

Table 12. Write Operation Status ......................................... 39

Word/Byte Configuration ................................................................................. 11

Requirements for Reading Array Data .......................................................... 11

Writing Commands/Command Sequences ................................................. 12

Program and Erase Operation Status ........................................................... 12

Standby Mode ....................................................................................................... 12

Automatic Sleep Mode .......................................................................................13

RESET#: Hardware Reset Pin ..........................................................................13

Output Disable Mode .........................................................................................13

Table 2. Sector Address Tables (Model 01, Top Boot Device) ... 14

Table 3. Sector Address Tables (Model 02, Bottom Boot Device) ..

Absolute Maximum Ratings . . . . . . . . . . . . . . . . .40

Figure 9. Maximum Negative Overshoot Waveform ................ 40

Figure 10. Maximum Positive Overshoot Waveform ................ 40

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 40

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 41

CMOS Compatible ..............................................................................................41

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . .42

Figure 11. Test Setup......................................................... 42

Table 13. Test Specifications ............................................... 42

Figure 12. Input Waveforms and Measurement Levels ............ 42

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 43

Read Operations ................................................................................................. 43

Figure 13. Read Operations Timings..................................... 43

Autoselect Mode ..................................................................................................15

Table 4. Autoselect Codes (High Voltage Method) .................. 16

Sector Protection/Unprotection .................................................................... 16

Temporary Sector Unprotect ..........................................................................17

Figure 1. Temporary Sector Unprotect Operation .................... 17

Figure 2. In-System Single High Voltage Sector Protect/

Unprotect Algorithms .......................................................... 18

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 44

Hardware Reset (RESET#) ..............................................................................44

Figure 14. RESET# Timings................................................. 44

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 45

Erase/Program Operations .............................................................................. 45

Secured Silicon Sector Flash Memory Region ............................................ 19

Table 5. Secured Silicon Sector Addressing ........................... 19

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . 46

Figure 15. Program Operation Timings ................................. 46

Customer Lockable: Secured Silicon Sector NOT Programmed or

Protected At the Factory ............................................................................. 19

Figure 3. Secured Silicon Sector Protect Verify ....................... 20

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . 47

Figure 16. Chip/Sector Erase Operation Timings .................... 47

Common Flash Memory Interface (CFI) ...................................................... 21

Table 6. CFI Query Identification String ................................ 21

Table 7. System Interface String ......................................... 22

Table 8. Device Geometry Definition .................................... 22

Table 9. Primary Vendor-Specific Extended Query ................. 23

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . 48

Figure 17. Data# Polling Timings

(During Embedded Algorithms) ........................................... 48

Figure 18. Toggle Bit Timings

(During Embedded Algorithms) ........................................... 48

Hardware Data Protection ..............................................................................23

Low V

Write Inhibit ..................................................................................23

Write Pulse “Glitch” Protection ................................................................23

Logical Inhibit .................................................................................................. 24

Power-Up Write Inhibit ............................................................................... 24

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 49

Figure 19. DQ2 vs. DQ6 for Erase and

Erase Suspend Operations .................................................. 49

Temporary Sector Unprotect ........................................................................49

Figure 20. Temporary Sector Unprotect/Timing Diagram......... 49

Command Definitions . . . . . . . . . . . . . . . . . . . . . .24

Reading Array Data ........................................................................................... 24

Reset Command ................................................................................................. 24

Autoselect Command Sequence ....................................................................25

Word/Byte Program Command Sequence .................................................25

Unlock Bypass Command Sequence ........................................................ 26

Figure 4. Program Operation................................................ 27

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 50

Figure 21. Sector Protect/Unprotect Timing Diagram .............. 50

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 51

Alternate CE# Controlled Erase/Program Operations ........................... 51

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 52

Figure 22. Alternate CE# Controlled Write Operation Timings .. 52

Chip Erase Command Sequence ....................................................................27

Sector Erase Command Sequence ................................................................ 28

Erase Suspend/Erase Resume Commands .................................................. 28

Figure 5. Erase Operation.................................................... 30

Erase and Programming Performance . . . . . . . . . 53

TSOP Pin and BGA Package Capacitance . . . . . 53

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . .54

TS 048—48-Pin Standard TSOP .................................................................... 54

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . 55

October 11, 2006 S29AL016M_00_A7

S29AL016M

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