Datasheet
RX230 Group, RX231 Group
Renesas MCUs
R01DS0261EJ0120
Rev.1.20
Sep 28, 2018
54-MHz 32-bit RX MCUs, built-in FPU, 88.56 DMIPS, up to 512-KB flash memory,
various communication functions including USB 2.0 full-speed host/function/OTG, CAN, SD host
interface, serial sound interface, capacitive touch sensing unit, 12-bit A/D, 12-bit D/A, RTC, Encryption
functions
Features
■ 32-bit RXv2 CPU core
•
Max. operating frequency: 54 MHz
Capable of 88.56 DMIPS in operation at 54 MHz
•
Enhanced DSP: 32-bit multiply-accumulate and 16-bit
multiply-subtract instructions supported
•
Built-in FPU: 32-bit single-precision floating point (compliant to
IEEE754)
•
Divider (fastest instruction execution takes two CPU clock cycles)
•
Fast interrupt
•
CISC Harvard architecture with 5-stage pipeline
•
Variable-length instructions, ultra-compact code
•
On-chip debugging circuit
•
Memory protection unit (MPU) supported
•
•
•
•
•
•
•
•
Operation from a single 1.8-V to 5.5-V supply
RTC capable of operating on the battery backup power supply
Three low power consumption modes
Low power timer (LPT) that operates during the software standby state
128- to 512-Kbyte capacities
On-board or off-board user programming
Programmable at 1.8 V
For instructions and operands
PLQP0100KB-B 14 × 14 mm, 0.5 mm pitch
PLQP0064KB-C 10 × 10 mm, 0.5 mm pitch
PLQP0048KB-B 7 × 7 mm, 0.5 mm pitch
PWQN0064KC-A 9 × 9 mm, 0.5 mm pitch
PWQN0048KB-A 7 × 7 mm, 0.5 mm pitch
PTLG0100KA-A 5.5 × 5.5 mm, 0.5 mm pitch
PWLG0064KA-A 5 × 5 mm, 0.5 mm pitch
■ Low power design and architecture
■ Up to 14 communication functions
■ On-chip flash memory for code
■ On-chip data flash memory
•
8 Kbytes (1,000,000 program/erase cycles (typ.))
•
BGO (Background Operation)
•
32- to 64-Kbyte size capacities
■ On-chip SRAM, no wait states
■ Data transfer functions
■ ELC
•
DMAC: Incorporates four channels
•
DTC: Four transfer modes
•
USB 2.0 host/function/On-The-Go (OTG) (one channel),
full-speed = 12 Mbps, low-speed = 1.5 Mbps, isochronous transfer, and
BC (Battery Charger) supported
•
CAN (one channel) compliant to ISO11898-1:
Transfer at up to 1 Mbps
•
SCI with many useful functions (up to 7 channels)
Asynchronous mode, clock synchronous mode, smart card interface
Reduction of errors in communications using the bit modulation
function
•
IrDA interface (one channel, in cooperation with the SCI5)
•
I
2
C bus interface: Transfer at up to 400 kbps, capable of SMBus
operation (one channel)
•
RSPI (one channel): Transfer at up to 16 Mbps
•
Serial sound interface (one channel)
•
SD host interface (optional: one channel) SD memory/ SDIO 1-bit or
4-bit SD bus supported
•
16-bit MTU: input capture, output compare, complementary PWM
output, phase counting mode (six channels)
•
16-bit TPU: input capture, output compare, phase counting mode (six
channels)
•
8-bit TMR (four channels)
•
16-bit compare-match timers (four channels)
•
•
•
•
Capable of conversion within 0.83 μs
24 channels
Sampling time can be set for each channel
Self-diagnostic function and analog input disconnection detection
assistance function
■ Up to 20 extended-function timers
•
Module operation can be initiated by event signals without using
interrupts.
•
Linked operation between modules is possible while the CPU is sleeping.
•
Eight types of reset, including the power-on reset (POR)
•
Low voltage detection (LVD) with voltage settings
■ Reset and supply management
■ Clock functions
•
•
•
•
•
■ 12-bit A/D converter
Main clock oscillator frequency: 1 to 20 MHz
External clock input frequency: Up to 20 MHz
Sub-clock oscillator frequency: 32.768 kHz
PLL circuit input: 4 MHz to 12.5 MHz
On-chip low- and high-speed oscillators, dedicated on-chip low-speed
oscillator for the IWDT
•
USB-dedicated PLL circuit: 4, 6, 8, or 12 MHz
54 MHz can be set for the system clock and 48 MHz for the USB clock
•
Generation of a dedicated 32.768-kHz clock for the RTC
•
Clock frequency accuracy measurement circuit (CAC)
•
•
•
•
Adjustment functions (30 seconds, leap year, and error)
Calendar count mode or binary count mode selectable
Time capture function
Time capture on event-signal input through external pins
■ 12-bit D/A converter
•
Two channels
■ Capacitive touch sensing unit
■ Realtime clock
•
Self-capacitance method: A single pin configures a single key,
supporting up to 24 keys
•
Mutual capacitance method: Matrix configuration with 24 pins, supporting
up to 144 keys
•
Two channels × two units
•
5-V tolerant, open drain, input pull-up, switching of driving capacity
•
Unauthorized access to the encryption engine is disabled and
imposture and falsification of information are prevented
•
Safe management of keys
•
128- or 256-bit key length of AES for ECB, CBC, GCM, others
•
True random number generator
■ Analog comparator
■ General I/O ports
■ Independent watchdog timer
•
15-kHz on-chip oscillator produces a dedicated clock signal to drive
IWDT operation.
•
Self-diagnostic and disconnection-detection assistance functions for
the A/D converter, clock frequency accuracy measurement circuit,
independent watchdog timer, RAM test assistance functions using the
DOC, etc.
•
Four CS areas (4 × 16 Mbytes)
•
8- or 16-bit bus space is selectable per area
•
Input/output functions selectable from multiple pins
■ Encryption Functions (TSIP-Lite)
■ Useful functions for IEC60730 compliance
■ External address space
■ MPC
■ Temperature sensor
■ Operating temperature range
• −40
to +85°C
• −40
to +105°C
■ Applications
•
General industrial and consumer equipment
R01DS0261EJ0120 Rev.1.20
Sep 28, 2018
Page 1 of 170
RX230 Group, RX231 Group
1. Overview
1.
1.1
Overview
Outline of Specifications
Table 1.1
lists the specifications, and
Table 1.2
gives a comparison of the functions of the products in different
packages.
Table 1.1
is for products with the greatest number of functions, so the number of peripheral modules and channels will
differ in accordance with the package type. For details, see
Table 1.2, Comparison of Functions for Different
Packages.
Table 1.1
Classification
CPU
Outline of Specifications (1/4)
Module/Function
CPU
Description
•
•
•
•
•
Maximum operating frequency: 54 MHz
32-bit RX CPU (RX v2)
Minimum instruction execution time: One instruction per clock cycle
Address space: 4-Gbyte linear
Register set
General purpose: Sixteen 32-bit registers
Control: Ten 32-bit registers
Accumulator: Two 72-bit registers
Basic instructions: 75 (variable-length instruction format)
Floating-point instructions: 11
DSP instructions: 23
Addressing modes: 10
Data arrangement
Instructions: Little endian
Data: Selectable as little endian or big endian
On-chip 32-bit multiplier: 32-bit × 32-bit → 64-bit
On-chip divider: 32-bit ÷ 32-bit → 32 bits
Barrel shifter: 32 bits
Memory protection unit (MPU)
•
•
•
•
•
•
•
•
•
FPU
Memory
ROM
•
Single precision (32-bit) floating point
•
Data types and floating-point exceptions in conformance with the IEEE754 standard
•
Capacity: 128/256/384/512 Kbytes
•
Up to 32 MHz: No-wait memory access
32 to 54 MHz: Wait state required. No wait state if the instruction is served by a ROM accelerator hit.
•
Programming/erasing method:
Serial programming (asynchronous serial communication/USB communication), self-programming
•
Capacity: 32/64 Kbytes
•
54 MHz, no-wait memory access
•
Capacity: 8 Kbytes
•
Number of erase/write cycles: 1,000,000 (typ)
Single-chip mode, on-chip ROM enabled expansion mode, and on-chip ROM disabled expansion mode
(software switching)
•
Main clock oscillator, sub-clock oscillator, low-speed on-chip oscillator, high-speed on-chip oscillator,
PLL frequency synthesizer, USB-dedicated PLL frequency synthesizer, and IWDT-dedicated on-chip
oscillator
•
Oscillation stop detection: Available
•
Clock frequency accuracy measurement circuit (CAC)
•
Independent settings for the system clock (ICLK), peripheral module clock (PCLK), external bus clock
(BCLK), and FlashIF clock (FCLK)
The CPU and system sections such as other bus masters run in synchronization with the system
clock (ICLK): 54 MHz (at max.)
MTU2a runs in synchronization with the PCLKA: 54 MHz (at max.)
The ADCLK for the S12AD runs in synchronization with the PCLKD: 54 MHz (at max.)
Peripheral modules other than MTU2a and S12ADE run in synchronization with the PCLKB: 32 MHz
(at max.)
Devices connected to external buses run in synchronization with the BCLK: 32 MHz (at max.)
The flash peripheral circuit runs in synchronization with the FCLK: 32 MHz (at max.)
RES# pin reset, power-on reset, voltage monitoring reset, watchdog timer reset, independent watchdog
timer reset, and software reset
RAM
E2 DataFlash
MCU operating mode
Clock
Clock generation circuit
Resets
Voltage detection
Voltage detection circuit
(LVDAb)
•
When the voltage on VCC falls below the voltage detection level, an internal reset or internal interrupt
is generated.
Voltage detection circuit 0 is capable of selecting the detection voltage from 4 levels
Voltage detection circuit 1 is capable of selecting the detection voltage from 14 levels
Voltage detection circuit 2 is capable of selecting the detection voltage from 4 levels
R01DS0261EJ0120 Rev.1.20
Sep 28, 2018
Page 2 of 170
RX230 Group, RX231 Group
Table 1.1
Classification
Low power
consumption
1. Overview
Outline of Specifications (2/4)
Module/Function
Low power consumption
functions
Description
•
Module stop function
•
Three low power consumption modes
Sleep mode, deep sleep mode, and software standby mode
•
Low power timer that operates during the software standby state
•
Operating power control modes
High-speed operating mode, middle-speed operating mode, and low-speed operating mode
•
Interrupt vectors: 167
•
External interrupts: 9 (NMI, IRQ0 to IRQ7 pins)
•
Non-maskable interrupts: 7 (NMI pin, oscillation stop detection interrupt, voltage monitoring 1
interrupt, voltage monitoring 2 interrupt, WDT interrupt, IWDT interrupt, and VBATT power monitoring
interrupt)
•
16 levels specifiable for the order of priority
•
The external address space can be divided into four areas (CS0 to CS3), each with independent
control of access settings.
Capacity of each area: 16 Mbytes (CS0 to CS3)
A chip-select signal (CS0# to CS3#) can be output for each area.
Each area is specifiable as an 8-bit or 16-bit bus space
The data arrangement in each area is selectable as little or big endian (only for data).
Bus format: Separate bus, multiplex bus
•
Wait control
•
Write buffer facility
•
4 channels
•
Three transfer modes: Normal transfer, repeat transfer, and block transfer
•
Activation sources: Software trigger, external interrupts, and interrupt requests from peripheral
functions
•
Transfer modes: Normal transfer, repeat transfer, and block transfer
•
Activation sources: Interrupts
•
Chain transfer function
100-pin/64-pin/48-pin
I/O: 79/43/30 (RX231 Group), 83/47/34 (RX230 Group)
•
Input: 1/1/1
Pull-up resistors: 79/43/30(RX231 Group), 83/47/34 (RX230 Group)
•
Open-drain outputs: 58/34/26
•
5-V tolerance: 8/5/5
•
Event signals of 61 types can be directly connected to the module
•
Operations of timer modules are selectable at event input
•
Capable of event link operation for port B and port E
Capable of selecting the input/output function from multiple pins
(16 bits × 6 channels) × 1 unit
Maximum of 16 pulse-input/output possible
Select from among seven or eight counter-input clock signals for each channel
Supports the input capture/output compare function
Output of PWM waveforms in up to 15 phases in PWM mode
Support for buffered operation, phase-counting mode (two-phase encoder input) and cascade
connected operation (32 bits × 2 channels) depending on the channel.
•
Capable of generating conversion start triggers for the A/D converters
•
Signals from the input capture pins are input via a digital filter
•
Clock frequency measuring method
•
(16 bits × 6 channels) × 1 unit
•
Up to 16 pulse-input/output lines and three pulse-input lines are available based on the six 16-bit
timer channels
•
Select from among eight or seven counter-input clock signals for each channel (PCLK/1, PCLK/4,
PCLK/16, PCLK/64, PCLK/256, PCLK/1024, MTCLKA, MTCLKB, MTCLKC, MTCLKD) other than
channel 5, for which only four signals are available.
•
Input capture function
•
21 output compare/input capture registers
•
Pulse output mode
•
Complementary PWM output mode
•
Reset synchronous PWM mode
•
Phase-counting mode
•
Capable of generating conversion start triggers for the A/D converter
Controls the high-impedance state of the MTU’s waveform output pins
•
(16 bits × 2 channels) × 2 units
•
Select from among four clock signals (PCLK/8, PCLK/32, PCLK/128, PCLK/512)
•
14 bits x 1 channel
•
Select from among six counter-input clock signals (PCLK/4, PCLK/64, PCLK/128, PCLK/512, PCLK/
2048, PCLK/8192)
•
•
•
•
•
•
Function for lower operating
power consumption
Interrupt
Interrupt controller (ICUb)
External bus extension
DMA
DMA controller (DMACA)
Data transfer controller
(DTCa)
I/O ports
General I/O ports
Event link controller (ELC)
Multi-function pin controller (MPC)
Timers
16-bit timer pulse unit
(TPUa)
Multi-function timer pulse
unit 2 (MTU2a)
Port output enable 2
(POE2a)
Compare match timer
(CMT)
Watchdog timer (WDTA)
R01DS0261EJ0120 Rev.1.20
Sep 28, 2018
Page 3 of 170
RX230 Group, RX231 Group
Table 1.1
Classification
Timers
1. Overview
Outline of Specifications (3/4)
Module/Function
Independent watchdog
timer (IWDTa)
Realtime clock (RTCe)
Description
•
14 bits × 1 channel
•
Count clock: Dedicated low-speed on-chip oscillator for the IWDT
Frequency divided by 1, 16, 32, 64, 128, or 256
•
•
•
•
Clock source: Sub-clock
Time/calendar
Interrupts: Alarm interrupt, periodic interrupt, and carry interrupt
Time-capture facility for three values
Low power timer (LPT)
•
16 bits × 1 channel
•
Clock source: Sub-clock, Dedicated low-speed on-chip oscillator for the IWDT
Frequency divided by 2, 4, 8, 16, or 32
•
(8 bits × 2 channels) × 2 units
•
Seven internal clocks (PCLK/1, PCLK/2, PCLK/8, PCLK/32, PCLK/64, PCLK/1024, and PCLK/8192)
and an external clock can be selected
•
Pulse output and PWM output with any duty cycle are available
•
Two channels can be cascaded and used as a 16-bit timer
•
7 channels (channel 0, 1, 5, 6, 8, 9: SCIg, channel 12: SCIh)
•
SCIg
Serial communications modes: Asynchronous, clock synchronous, and smart-card interface
Multi-processor function
On-chip baud rate generator allows selection of the desired bit rate
Choice of LSB-first or MSB-first transfer
Average transfer rate clock can be input from TMR timers for SCI5, SCI6, and SCI12
Start-bit detection: Level or edge detection is selectable.
Simple I
2
C
Simple SPI
9-bit transfer mode
Bit rate modulation
Event linking by the ELC (only on channel 5)
•
SCIh (The following functions are added to SCIg)
Supports the serial communications protocol, which contains the start frame and information frame
Supports the LIN format
•
1 channel (SCI5 used)
•
Supports encoding/decoding of waveforms conforming to IrDA standard 1.0
•
•
•
•
1 channel
Communications formats: I
2
C bus format/SMBus format
Master mode or slave mode selectable
Supports fast mode
8-bit timer (TMR)
Communication
functions
Serial communications
interfaces (SCIg, SCIh)
IrDA interface (IRDA)
I
2
C bus interface (RIICa)
Serial peripheral interface
(RSPIa)
•
1 channel
•
Transfer facility
Using the MOSI (master out, slave in), MISO (master in, slave out), SSL (slave select), and RSPCK
(RSPI clock) enables serial transfer through SPI operation (four lines) or clock-synchronous
operation (three lines)
•
Capable of handling serial transfer as a master or slave
•
Data formats
•
Choice of LSB-first or MSB-first transfer
The number of bits in each transfer can be changed to 8, 9, 10, 11, 12, 13, 14, 15, 16, 20, 24, or
32 bits.
128-bit buffers for transmission and reception
Up to four frames can be transmitted or received in a single transfer operation (with each frame
having up to 32 bits)
•
Double buffers for both transmission and reception
•
•
•
•
•
•
•
•
USB Device Controller (UDC) and transceiver for USB 2.0 are incorporated.
Host/function module: 1 port
Compliant with USB version 2.0
Transfer speed: Full-speed (12 Mbps), low-speed (1.5 Mbps)
OTG (ON-The-Go) is supported.
Isochronous transfer is supported.
BC1.2 (Battery Charging Specification Revision 1.2) is supported.
Internal power supply for USB (allows operation without external power input to the VCC_USB pin
when VCC = 4.0 to 5.5V)
USB 2.0 host/function
module (USBd)
CAN module (RSCAN)
•
1 channel
•
Compliance with the ISO11898-1 specification (standard frame and extended frame)
•
16 Message boxes
R01DS0261EJ0120 Rev.1.20
Sep 28, 2018
Page 4 of 170
RX230 Group, RX231 Group
Table 1.1
Classification
Communication
functions
1. Overview
Outline of Specifications (4/4)
Module/Function
Serial Sound Interface (SSI)
Description
•
•
•
•
•
•
•
•
•
•
•
•
•
1 channel
Capable of duplex communications
Various serial audio formats supported
Master/slave function supported
Programmable word clock or bit clock generation function
8/16/18/20/22/24/32-bit data formats supported
On-chip 8-stage FIFO for transmission/reception
Supports WS continue mode in which the SSIWS signal is not stopped.
SD Host Interface (SDHIa)
1 channel
Transfer speed : Default speed mode (8MB/s)
SD memory card interface (1 bit / 4bits SD bus)
MMC, eMMC Backward-compatible are supported.
SD Specifications
Part 1: Compliant with Physical Layer Specification Ver.3.01 (Not support DDR)
Part E1: SDIO Specification Ver. 3.00
•
Error check function: CRC7 (command), CRC16 (data)
•
Interrupt Source: Card access interrupt, SDIO access interrupt, Card detection interrupt,
SD buffer
access interrupt
•
DMA transfer sources: SD_BUF write, SD_BUF read
•
Card detection, Write protection
Encryption
functions
Trusted Secure IP (TSIP-
Lite)
•
Access management circuit
•
Encryption engine
128- or 256-bit key sizes of AES
Block cipher mode of operation: GCM, ECB, CBC, CMAC, XTS, CTR, GCTR
•
Hash function
•
True random number generator
•
Prevention from illicit copying of a key
•
•
•
•
12 bits (24 channels × 1 unit)
12-bit resolution
Minimum conversion time: 0.83 µs per channel when the ADCLK is operating at 54 MHz
Operating modes
Scan mode (single scan mode, continuous scan mode, and group scan mode)
Group A priority control (only for group scan mode)
Sampling variable
Sampling time can be set up for each channel.
Self-diagnostic function
Double trigger mode (A/D conversion data duplicated)
Detection of analog input disconnection
A/D conversion start conditions
A software trigger, a trigger from a timer (MTU, TPU), an external trigger signal, or ELC
Event linking by the ELC
12-bit A/D converter (S12ADE)
•
•
•
•
•
•
Temperature sensor (TEMPSA)
•
1 channel
•
The voltage output from the temperature sensor is converted into a digital value by the 12-bit A/D
converter.
•
2 channels
•
12-bit resolution
•
Output voltage: 0.4 to AVCC0-0.5V
•
CRC code generation for arbitrary amounts of data in 8-bit units
•
Select any of three generating polynomials:
X
8
+ X
2
+ X + 1, X
16
+ X
15
+ X
2
+ 1, or X
16
+ X
12
+ X
5
+ 1
•
Generation of CRC codes for use with LSB-first or MSB-first communications is selectable.
•
2 channels × 2 units
•
Function to compare the reference voltage and the analog input voltage
•
Window comparator operation or standard comparator operation is selectable
Detection pin: 24 channels
Comparison, addition, and subtraction of 16-bit data
VCC = 1.8 to 2.4 V: 8 MHz, VCC = 2.4 to 2.7 V: 16 MHz, VCC = 2.7 to 5.5 V: 54 MHz
D version:
−40
to +85°C, G version:
−40
to +105°C
100-pin TFLGA (PTLG0100KA-A) 5.5 × 5.5 mm, 0.5 mm pitch
100-pin LFQFP (PLQP0100KB-B) 14 × 14 mm, 0.5 mm pitch
64-pin WFLGA (PWLG0064KA-A) 5 × 5 mm, 0.5 mm pitch
64-pin HWQFN (PWQN0064KC-A) 9 × 9 mm, 0.5 mm pitch
64-pin LFQFP (PLQP0064KB-C) 10 × 10 mm, 0.5 mm pitch
48-pin HWQFN (PWQN0048KB-A) 7 × 7 mm, 0.5 mm pitch
48-pin LFQFP (PLQP0048KB-B) 7 × 7 mm, 0.5 mm pitch
FINE interface
12-bit D/A converter (R12DAA)
CRC calculator (CRC)
Comparator B (CMPBa)
Capacitive touch sensing unit (CTSU)
Data operation circuit (DOC)
Power supply voltages/Operating frequencies
Operating temperature range
Packages
Debugging interfaces
R01DS0261EJ0120 Rev.1.20
Sep 28, 2018
Page 5 of 170
Embedded System
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