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R5F56108WDBG#U0

Description
32-bit microcontroller - MCU RX610 2M/128K BGA176 3.0-3.6V
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,87 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Environmental Compliance
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R5F56108WDBG#U0 Overview

32-bit microcontroller - MCU RX610 2M/128K BGA176 3.0-3.6V

R5F56108WDBG#U0 Parametric

Parameter NameAttribute value
Brand NameRenesas
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerRenesas Electronics Corporation
Parts packaging codeLFBGA
package instructionLFBGA, BGA176,15X15,32
Contacts176
Manufacturer packaging codePLBG0176GA-A176
Reach Compliance Codecompliant
Factory Lead Time20 weeks
Has ADCYES
Address bus width24
bit size32
CPU seriesRX
maximum clock frequency25 MHz
DAC channelYES
DMA channelYES
External data bus width16
JESD-30 codeS-PBGA-B176
length13 mm
Number of I/O lines140
Number of terminals176
Maximum operating temperature85 °C
Minimum operating temperature-20 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA176,15X15,32
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
RAM (bytes)131072
rom(word)2097152
ROM programmabilityFLASH
Maximum seat height1.4 mm
speed100 MHz
Maximum slew rate100 mA
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Datasheet
RX610 Group Datasheet
RENESAS 32-Bit MCU
R01DS0097EJ0120
Rev.1.20
Feb 20, 2013
1.
1.1
Overview
Features
The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.
One basic instruction is executable in one cycle of the system clock. Calculation functionality is further enhanced, with
the inclusion of a single-precision floating-point calculation unit as well as a 32-bit multiplier and divider. Additionally,
code efficiency is improved by instructions with lengths that are variable in byte units and by an enhanced range of
addressing modes.
Timers, serial communication interfaces, I
2
C bus interfaces, an A/D converter, and a D/A converter are incorporated as
peripheral functions which are essential to embedded devices.
Facilities for connecting external memory are also included, enabling direct connection to memory and peripheral LSI
circuits. The on-chip memory is flash memory capable of large-capacity, high-speed operation, and this significantly
reduces the cost of configuring systems.
1.1.1
Applications
Office automation equipment and digital industrial equipment
R01DS0097EJ0120
Feb 20, 2013
Rev.1.20
Page 1 of 84

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Description 32-bit microcontroller - MCU RX610 2M/128K BGA176 3.0-3.6V 32-bit microcontroller - MCU RX610 1.5M/128K BGA176 3.0-3.6V 32-bit microcontroller - MCU RX610 768K/128K BGA176 3.0-3.6V 32-bit microcontroller - MCU RX610 2M/128K QFP144 3.0-3.6V 32-bit microcontroller - MCU RX610 MCU 768K/128K QFP144 3.0-3.6V 32-bit microcontroller - MCU RX610 768K/128K BGA176 3.0-3.6V 32-bit microcontroller - MCU RX610 768K/128K QFP144 3.0-3.6V 32-bit microcontroller - MCU RX610 1M/128K QFP144 3.0-3.6V 32-bit microcontroller - MCU RX610 2M/128K BGA176 3.0-3.6V 32-bit microcontroller - MCU RX610 1M/128K BGA176 3.0-3.6V
Brand Name Renesas Renesas Renesas Renesas Renesas Renesas Renesas Renesas Renesas Renesas
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to conform to
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code LFBGA LFBGA LFBGA LFQFP LFQFP LFBGA LFQFP LFQFP LFBGA LFBGA
package instruction LFBGA, BGA176,15X15,32 LFBGA, BGA176,15X15,32 LFBGA, BGA176,15X15,32 LFQFP, QFP144,.87SQ,20 LFQFP, QFP144,.87SQ,20 LFBGA, BGA176,15X15,32 LFQFP, QFP144,.87SQ,20 LFQFP, QFP144,.87SQ,20 LFBGA, BGA176,15X15,32 LFBGA, BGA176,15X15,32
Contacts 176 176 176 144 144 176 144 144 176 176
Manufacturer packaging code PLBG0176GA-A176 PLBG0176GA-A176 PLBG0176GA-A176 PLQP0144KA-A144 PLQP0144KA-A144 PLBG0176GA-A176 PLQP0144KA-A144 PLQP0144KA-A144 PLBG0176GA-A176 PLBG0176GA-A176
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
Factory Lead Time 20 weeks 20 weeks 20 weeks 20 weeks 20 weeks 20 weeks 20 weeks 20 weeks 20 weeks 20 weeks
Has ADC YES YES YES YES YES YES YES YES YES YES
Address bus width 24 24 24 24 24 24 24 24 24 24
bit size 32 32 32 32 32 32 32 32 32 32
maximum clock frequency 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
DAC channel YES YES YES YES YES YES YES YES YES YES
DMA channel YES YES YES YES YES YES YES YES YES YES
External data bus width 16 16 16 16 16 16 16 16 16 16
JESD-30 code S-PBGA-B176 S-PBGA-B176 S-PBGA-B176 S-PQFP-G144 S-PQFP-G144 S-PBGA-B176 S-PQFP-G144 S-PQFP-G144 S-PBGA-B176 S-PBGA-B176
length 13 mm 13 mm 13 mm 20 mm 20 mm 13 mm 20 mm 20 mm 13 mm 13 mm
Number of I/O lines 140 140 140 117 117 140 117 117 140 140
Number of terminals 176 176 176 144 144 176 144 144 176 176
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -20 °C -20 °C -40 °C -20 °C -40 °C -20 °C -20 °C -40 °C -40 °C -40 °C
PWM channel YES YES YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA LFBGA LFQFP LFQFP LFBGA LFQFP LFQFP LFBGA LFBGA
Encapsulate equivalent code BGA176,15X15,32 BGA176,15X15,32 BGA176,15X15,32 QFP144,.87SQ,20 QFP144,.87SQ,20 BGA176,15X15,32 QFP144,.87SQ,20 QFP144,.87SQ,20 BGA176,15X15,32 BGA176,15X15,32
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 131072 131072 131072 131072 131072 131072 131072 131072 131072 131072
rom(word) 2097152 1572864 786432 2097152 786432 786432 786432 1048576 2097152 1048576
ROM programmability FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
Maximum seat height 1.4 mm 1.4 mm 1.4 mm 1.7 mm 1.7 mm 1.4 mm 1.7 mm 1.7 mm 1.4 mm 1.4 mm
speed 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
Maximum slew rate 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER OTHER INDUSTRIAL OTHER INDUSTRIAL OTHER OTHER INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL GULL WING GULL WING BALL GULL WING GULL WING BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.5 mm 0.5 mm 0.8 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM QUAD QUAD BOTTOM QUAD QUAD BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 13 mm 13 mm 13 mm 20 mm 20 mm 13 mm 20 mm 20 mm 13 mm 13 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
CPU series RX RX RX RX - RX RX RX RX RX
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