19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
L
L
NOTES: VALID UNLESS OTHERWISE SPECIFIED
1. GENERAL:
a. APPLICATION SPECIFICATION SEE: AS-34791-020
b. PRODUCT SPECIFICATION SEE: PS-34791-020
c. PACKAGING SPECIFICATION PER MOLEX DRAWING: SEE CHART
d. SOLDERABILITY PER SMES-152
e. PARTS MUST BE IN COMPLIANCE TO MOLEX CHEMICAL SUBSTANCES FOR
PRODUCTS AND PACKAGING SPECIFICATION: QEHS-699000-300
f. DATA MUST BE SUBMITTED UNDER THE MOLEX PART NUMBER TO IMDS
(COMPANY ID#13255)
g. FLAMMABILITY REQUIREMENT: PER ISO3795 OR GM3191
h. VISUAL DEFECTS SHALL MEET COSMETIC STANDARD PS-45499-002 (Class B)
2. DESIGN - MATERIALS:
a. SHROUD (PLASTIC HOUSING): SPS 30% GF, 20% REGRIND MAX PER WEIGHT
b. BLADES:
BASE METAL: C260 BRASS
PLATING REQUIREMENTS:
TIN OVER NICKEL:
UNDERPLATING:
OVERALL NICKEL: 1.25 - 2.25 MICROMETERS THICKNESS
OVERPLATING:
OVERALL TIN: 2.5 - 4.0 MICROMETERS THICKNESS
GOLD:
UNDERPLATING:
OVERALL NICKEL: 1.25 - 2.25 MICROMETERS THICKNESS
OVERPLATING:
CONTACT AREA: ELECTRODEPOSITED GOLD
0.76 MICROMETERS MINIMUM HARD GOLD
PCB CONTACT AREA: ELECTRODEPOSITED TIN MATTE FINISH
2.5 - 4.0 MICROMETERS MINIMUM THICKNESS
3. DESIGN - GEOMETRY:
a. THIS IS A 100% CAD GENERATED PART. THE CAD MATHEMATICAL DATA
IS THE MASTER FOR THIS PART. FOR DIMENSIONAL OR ANY INFORMATION
NOT SHOWN ON THIS DRAWING, ANALYZE THE CAD MODEL.
b. GEOMETRIC DIMENSIONS AND TOLERANCES PER ASME Y14.5M - 2009
c. GENERAL TOLERANCES: SEE TITLE BLOCK
d. EDGES AND UNDIMENSIONED DETAILS PER ISO13715
e. CORNERS SHOWN AS SHARP TO BE R 0.1 MAX
f. LETTERING SHALL BE BELOW SURROUNDING SURFACE OF PART.
THIS INCLUDES RECYCLING CODE, PLANT AND CAVITY ID,
VENDOR ID, AND CIRCUIT ID.
K
K
12 CIRCUIT SMT USCAR HEADER
POLARIZATION OPTION A
12 CIRCUIT SMT USCAR HEADER
POLARIZATION OPTION B
12 CIRCUIT SMT USCAR HEADER
POLARIZATION OPTION C
J
J
24CKT POLARIZATION OPTIONS SHOWN BELOW
ARE REPRESENTATIVE FOR 16 AND 20CKT
H
H
G
G
24 CIRCUIT SMT HEADER
POLARIZATION OPTION A
F
24 CIRCUIT SMT HEADER
POLARIZATION OPTION B
24 CIRCUIT SMT HEADER
POLARIZATION OPTION C
F
E
E
D
D
INSPECTION BALLON NUMBER LOG
PER DRAWING REVISION: W3
C
LAST BALLOON USED: 14
C
ADDED BALLOON NUMBERS:
REMOVED BALLOON NUMBERS:
2018/01/26
2018/01/31
2018/02/01
W4
ADDED 16CKT GOLD DEPOPULATED POL A P/N
W3
NX REMASTERING
REV
DESCRIPTION
QUALITY THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
GENERAL
SYMBOLS
TOLERANCES
5:1
MM ONLY
=
0
(UNLESS SPECIFIED)
B
DRWN BY
DATE
=
=
=
=
=
0
0
171601
KHEWITT
TMACHUGA
JDUNAJ
B
ANGULAR TOL ±
1.0
°
4 PLACES
3 PLACES
2 PLACES
1 PLACE
0 PLACES
±
±
±
±
±
TMACHUGA
CHK'D BY
DATE
2011/11/23
MINI 50 DUAL ROW
SMT HEADER ASSEMBLY SALES DRAWING
0
0
0
0
0
0.1
0.2
CHKD BY
APPR BY
DATE
PRODUCT CUSTOMER DRAWING
2011/12/19
SERIES
MATERIAL NUMBER
CUSTOMER
SMARCEAU
DRAWING SIZE
EC NO:
DRWN:
CHK'D:
APPR:
A
=
THIRD ANGLE PROJECTION
FORMAT: master-tb-prod-D
REVISION: G
DATE: 2017/02/06
RELEASE STATUS
19
RELEASE DATE
18
C
=
W4
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
34897
DOCUMENT NUMBER
SEE CHART
GENERAL MARKET
DOC TYPE
DOC PART
SHEET NUMBER
A
D
5
4
SD-34897-001
3
PSD
2
000
1 OF 5
1
17
16
15
14
13
12
11
10
9
8
7
6
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
L
L
12 CKT SMT USCAR HEADER
½
2.00
½
TYP
½
1.00
½
TYP
K
16 CKT SMT HEADER
½
1.04
½
TYP
½
1.00
½
TYP
½
2.00
½
TYP
½
1.04
½
TYP
½
1.00
½
TYP
20 CKT SMT HEADER
½
2.00
½
TYP
½
1.04
½
TYP
24 CKT SMT HEADER
½
2.00
½
TYP
½
1.00
½
TYP
½
1.04
½
TYP
K
J
½
18.80
½
½
2X 7.80
½
½
18.80
½
½
2X 7.80
½
½
18.80
½
½
2X 7.80
½
½
18.80
½
½
2X 7.80
½
J
H
H
1
25.49
±
0.13
2
22.62
±
0.13
4
29.49
±
0.13
7
33.49
±
0.13
10
37.49
±
0.13
5
26.62
±
0.13
8
30.62
±
0.13
11
34.62
±
0.13
Y
G
G
F
14X
⌓
0.1
Y
½
2.00
½
TYP
3
27.05
+0.25
-0.10
F
½
2.00
½
TYP
6
31.05
+0.25
-0.10
½
2.00
½
TYP
9
35.05
+0.25
-0.10
½
2.00
½
TYP
12
39.05
+0.25
-0.10
E
E
HEADER TO PCB
MOUNT
POST-REFLOW MINIMUM LATCH HEIGHT
24 CKT HEADER ASSEMBLY SHOWN AS EXAMPLE
D
D
B2
CENTER PLANE
C
B1
HEADER TO PCB
MOUNT
E
OF DATUM
B
A1
Z
B1 B2
5.55
±
0.10
14
SECTION
Y-Y
C
A2
CUTAWAY SHOWING UPPER
DATUM PADS
2X 5.90
MIN
B
2018/01/26
2018/01/31
2018/02/01
9.60
QUALITY THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
GENERAL
SYMBOLS
TOLERANCES
5:1
MM ONLY
=
0
(UNLESS SPECIFIED)
DRWN BY
DATE
=
0
0
171601
KHEWITT
TMACHUGA
JDUNAJ
B
ANGULAR TOL ±
1.0
°
B
Z
A3
B4
A4
B3
*POST REFLOW
MINIMUM
MEASURED FROM DATUM PADS IN
LOWER LEFT AND RIGHT CORNERS
TO DATUM TARGETS B3 AND B4.
=
4 PLACES
3 PLACES
2 PLACES
1 PLACE
0 PLACES
±
±
±
±
±
TMACHUGA
CHK'D BY
DATE
2011/11/23
MINI 50 DUAL ROW
SMT HEADER ASSEMBLY SALES DRAWING
B3 B4
=
=
=
0
0
0
0
0
A
0.1
0.2
CHKD BY
APPR BY
DATE
PRODUCT CUSTOMER DRAWING
2011/12/19
SERIES
MATERIAL NUMBER
CUSTOMER
SMARCEAU
DRAWING SIZE
A
SECTION
Z-Z
C
EC NO:
DRWN:
CHK'D:
APPR:
THIRD ANGLE PROJECTION
=
=
FORMAT: master-tb-prod-D
REVISION: G
DATE: 2017/02/06
RELEASE STATUS
19
RELEASE DATE
18
W4
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
34897
DOCUMENT NUMBER
SEE CHART
GENERAL MARKET
DOC TYPE
DOC PART
SHEET NUMBER
A
D
5
4
SD-34897-001
3
PSD
2
000
2 OF 5
1
17
16
15
14
13
12
11
10
9
8
7
6
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
RECOMMENDED PCB LAYOUT:
L
L
K
K
0.66
±
0.06
F
CIRCUIT 1
CIRCUIT 5
CIRCUIT 2
CIRCUIT 6
CIRCUIT 7
CIRCUIT 8
12X 0.66
±
0.06
⌖
0.08
F-G
CIRCUIT 9
CIRCUIT 10
0.66
±
0.06
G
CIRCUIT 12
CIRCUIT 11
CIRCUIT 4
CIRCUIT 3
J
BEFORE REFLOW SOLDERING
TEMPERATURE EXPOSURE
12X
½
0.5
½
7X
½
1
½
½
15
½
½
7.5
½
4X
½
2
½
(DATUM PLANE -E-)
HEADER OUTLINE - APPLIES SIMILARLY
TO ALL CIRCUIT SIZES
(PCB)
J
13
17.4
±
0.2
(DATUM PLANE -E-)
½
0.5
½
12X
½
1.05
½
2X
½
6.72
½
12X
½
2.75
½
2X (6.85)
H
2X
½
7.8
½
12.10 MAX
4X
2
7X
1
2X
½
8
½
H
SOLDER NAIL
SOLDER NAIL
G
(CENTERPLANE OF
SOLDER NAILS)
COMMON CENTERPLANE FOR:
* CENTERPLANE OF SOLDER
NAILS (HEADER)
* PCB SOLDER NAIL PADS
½
2X 0.24
½
14X CONTACT SURFACES
D
PCB SOLDER NAIL PADS
COMMON CENTERPLANE FOR:
* DATUM "F" (HEADER)
* PCB SOLDER NAIL PADS (28.52)
G
½
22.62
½
½
27.05
½
F
F
½
15
½
½
28.52
½
2X
½
3.32
½
12 CKT SMT USCAR HEADER (BOTTOM VIEW)
12 CKT PCB LAYOUT
(OTHER CIRCUIT SIZES ARE SIMILAR)
F
E
AFTER REFLOW SOLDERING
TEMPERATURE EXPOSURE
(DATUM PLANE -E-)
E
D
D
11.68
+0.2
-0.5
C
½
2X 0.24
½
14X CONTACT SURFACES
D
C
2018/01/26
2018/01/31
2018/02/01
QUALITY THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
GENERAL
SYMBOLS
TOLERANCES
5:1
MM ONLY
=
0
(UNLESS SPECIFIED)
B
DRWN BY
DATE
=
=
=
=
=
0
0
171601
KHEWITT
TMACHUGA
JDUNAJ
B
ANGULAR TOL ±
1.0
°
4 PLACES
3 PLACES
2 PLACES
1 PLACE
0 PLACES
±
±
±
±
±
TMACHUGA
CHK'D BY
DATE
2011/11/23
MINI 50 DUAL ROW
SMT HEADER ASSEMBLY SALES DRAWING
0
0
0
0
0
0.1
0.2
CHKD BY
APPR BY
DATE
PRODUCT CUSTOMER DRAWING
2011/12/19
SERIES
MATERIAL NUMBER
CUSTOMER
SMARCEAU
DRAWING SIZE
EC NO:
DRWN:
CHK'D:
APPR:
A
=
THIRD ANGLE PROJECTION
FORMAT: master-tb-prod-D
REVISION: G
DATE: 2017/02/06
RELEASE STATUS
19
RELEASE DATE
18
C
=
W4
REV
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
34897
DOCUMENT NUMBER
SEE CHART
GENERAL MARKET
DOC TYPE
DOC PART
SHEET NUMBER
A
D
5
4
SD-34897-001
3
PSD
2
000
3 OF 5
1
17
16
15
14
13
12
11
10
9
8
7
6
Microcontroller MCU
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