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MCP1405-E/MF

Description
Gate Driver 4.5A Dual MOSFET Drvr
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size668KB,23 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Download user manual Parametric View All

MCP1405-E/MF Overview

Gate Driver 4.5A Dual MOSFET Drvr

MCP1405-E/MF Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeDFN
package instructionHVSON, SOLCC8,.25
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time4 weeks
high side driverNO
Interface integrated circuit typeBUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 codeR-PDSO-N8
JESD-609 codee3
length5.99 mm
Humidity sensitivity level3
Number of functions1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Nominal output peak current4.5 A
Package body materialPLASTIC/EPOXY
encapsulated codeHVSON
Encapsulate equivalent codeSOLCC8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
power supply4.5/18 V
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage18 V
Minimum supply voltage4.5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
Disconnect time0.065 µs
connection time0.065 µs
width4.9 mm
MCP1403/4/5
4.5A Dual High-Speed Power MOSFET Drivers
Features
• High Peak Output Current: 4.5A (typ.)
• Low Shoot-Through/Cross-Conduction Current in
Output Stage
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Capacitive Load Drive Capability:
- 2200 pF in 15 ns
- 5600 pF in 34 ns
• Short Delay Times: 40 ns (typ.)
• Low Supply Current:
- With Logic ‘1’ Input – 1.0 mA (typ.)
- With Logic ‘0’ Input – 150 µA (typ.)
• Latch-Up Protected: Will Withstand 1.5A Reverse
Current
• Logic Input Will Withstand Negative Swing
Up To 5V
• Packages: 8-Pin SOIC, PDIP, 8-Pin 6x5 DFN,
and 16-Pin SOIC
General Description
The MCP1403/4/5 are a family of dual-inverting, dual-
non-inverting, or complimentary output drivers. They
can delivery high peak currents of 4.5A typically into
capacitive loads. These devices also feature low shoot-
through current, matched rise/fall times and
propagation delays.
The MCP1403/4/5 drivers operate from a 4.5V to 18V
single power supply and can easily charge and
discharge 2200 pF gate capacitance in under 15 ns
(typ). They provide low enough impedances in both the
on and off states to ensure the MOSFETs intended
state will not be affected, even by large transients. The
input to the MCP1403/4/5 may be driven directly from
either TTL or CMOS (3V to 18V).
The MCP1403/4/5 dual-output 4.5A driver family is
offered in both surface-mount and pin-through-hole
packages with a -40
o
C to +125
o
C temperature rating.
The low thermal resistance of the thermally enhanced
DFN package allows for greater power dissipation
capability for driving heavier capacitive or resistive
loads.
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the ground pin. All
terminals are fully protect against Electrostatic
Discharge (ESD) up to 4 kV.
Applications
Switch Mode Power Supplies
Pulse Transformer Drive
Line Drivers
Motor and Solenoid Drive
Package Types
MCP1404
8-Pin
MCP1405
MCP1403
PDIP/SOIC
NC
IN A
GND
IN B
1
2
3
4
8
7
6
5
16-Pin SOIC
NC
IN A
NC
GND
GND
NC
IN B
NC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
MCP1404
MCP1403
MCP1405
NC
OUT A
OUT A
V
DD
V
DD
OUT B
OUT B
NC
NC
OUT A
OUT A
V
DD
V
DD
OUT B
OUT B
NC
NC
OUT A
OUT A
V
DD
V
DD
OUT B
OUT B
NC
NC
OUT A
V
DD
OUT B
NC
OUT A
V
DD
OUT B
NC
OUT A
V
DD
OUT B
8-Pin DFN
(2)
NC
1
IN A
2
GND
3
IN B
4
8
7
6
5
MCP1404
MCP1403
MCP1405
NC
OUT A
V
DD
OUT B
NC
OUT A
V
DD
OUT B
NC
OUT A
V
DD
OUT B
Note 1:
Duplicate pins must both be connected for
proper operation.
2:
Exposed pad of the DFN package is electrically
isolated.
©
2007 Microchip Technology Inc.
DS22022B-page 1

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