Storage Temperature Range .............................-65ºC to +150°C
Soldering Temperature (reflow) .......................................+260°C
Package Thermal Characteristics
(Note 2)
WLP
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........52°C/W
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
PARAMETER
SUPPLY OPERATION
Operating Voltage
Shutdown Current
Quiescent Current
INTERNAL FET
R
ON
(IN1 or IN2 to OUT)
Soft-Start Trigger Voltage
Soft-Start Time
Soft-Start Output dV/dt Limit
IN1 - IN2 Comparator Rising
Threshold
IN1 - IN2 Comparator Falling
Threshold
LOGIC INPUT (EN1,
EN2)
EN1, EN2
Input Logic High
EN1, EN2
Input Logic Low
EN1, EN2
Input Leakage
Current
(V
IN1
, V
IN2
= 1.6V to 5.5V; T
A
= -40ºC to +85ºC, unless otherwise noted. Typical values are at V
IN1
, V
IN2
= 4.3V; T
A
= +25ºC.) (Note 3)
SYMBOL
V
IN1
V
IN2
I
SHDN
I
IN1
I
IN2
R
ON
|V
IN
-
V
OUT
|
t
SS
I
LIM_SS
V
THR_IN
C
LOAD
= 100µF
V
IN1
= 4.3V, V
IN2
= 4.0V, OUT is initially
connected to IN1, V
IN2
rises until OUT
connects to IN2
V
IN1
= 4.3V, V
IN2
= 4.6V, OUT is initially
connected to IN2, V
IN2
falls until OUT
connects to IN1
1.4
0.4
V
EN_
= 0V, 5.5V
-1
1
1
EN1
= high and
EN2
= high
EN1
or
EN2
= low, I
LOAD
= 0mA
V
IN_
= 4.3V, I
OUT
= 1A, T
A
= +25ºC
2.5
11
0.95
5
15
200
10
CONDITIONS
MIN
TYP
MAX
UNITS
1.6
5.5
5.75
7.5
15
V
µA
µA
mΩ
V
ms
mV/µs
mV
V
VTHF_IN
-200
mV
V
IH
V
IL
I
LEAK
V
V
µA
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Maxim Integrated │ 2
MAX14713
Compact 6A Smart Power Path Selector
Electrical Characteristics (continued)
PARAMETER
SYMBOL
(V
IN1
, V
IN2
= 1.6V to 5.5V; T
A
= -40ºC to +85ºC, unless otherwise noted. Typical values are at V
IN1
, V
IN2
= 4.3V; T
A
= +25ºC.) (Note 3)
CONDITIONS
Time from
EN_
low to OUT reaches 90% of
IN_ voltage, no load. (Figure 2)
V
IN_
= 3V, V
EN_
= 0V to 3V, R
LOAD
= 1kΩ.
Time from
EN_
high to OUT reaches 10% of
its initial value. (Figure 2)
V
IN1
= 3.8V, V
IN2
= 4.3V
V
EN1
= 0V, V
EN2
= 3V to 0V to OUT
reaches 90% of IN2. (Figure 2)
V
IN1
= 3.3V, V
IN2
= 3V to 4.3V
V
EN1
= 0V, V
EN2
= 0V,
OUT = 100mA and no load capacitor.
V
IN1
= 3.3V, V
IN2
= 4.3V to 3V
V
EN1
= 0V, V
EN2
= 0V. (Figure 3)
0
MIN
TYP
MAX
UNITS
DYNAMIC PERFORMANCE (NOTE 4)
Single-Path Turn-On Time
t
ON
t
OFF
6.5
µs
Single-Path Turn-Off Time
8
µs
Automatic Switchover
Enable Time
Automatic Switchover
Break-Before-Make
Automatic Switchover
Debounce Time
t
ASO
2
5
µs
t
BBM
t
ASDEB
0.4
2
µs
2
µs
Note 3:
All devices are 100% production tested at T
A
= +25ºC. Specifications over the operating temperature range are guaranteed
by design.
Note 4:
All timing is measured using 20% and 80% levels unless otherwise specified.
Timing Diagrams
IN1
OUT
IN2
OUT
t
ASDEB
EN1
EN2
Figure 1. Automatic Switch Operation: IN2 Rise
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Maxim Integrated │
3
MAX14713
Compact 6A Smart Power Path Selector
Timing Diagrams (continued)
IN2
IN1
t
ASO
t
OFF
OUT
EN1
t
ON
EN2
Figure 2. Automatic Switch Operation:
EN2
On (Time scale is exaggerated for easy recognition in the waveform)
IN2
OUT
IN1
OUT
t
ASDEB
t
LOFF
EN1
EN2
Figure 3: Automatic Switch Operation: IN2 Sag (Time scale is exaggerated for easy recognition in the waveform)
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